Abstract: A method of forming on a substrate an amorphous silica-based coating film having a low dielectric constant of 3.0 or below and a film strength (Young's modulus) of 3.0 GPa or more, which comprises, as a typical one, the steps of; (a) coating on the substrate a liquid composition containing hydrolysate of an organic silicon compound or compounds hydrolyzed in the presence of tetraalkylammonium hydroxide (TAAOH); (b) setting the substrate in a chamber and then drying a coating film formed on the substrate at a temperature in the range from 25 to 340° C.; (c) heating the coating film at a temperature in the range from 105 to 450° C. with introduction of a superheated steam having such a temperature into the chamber, and (d) curing the coating film at a temperature in the range from 350 to 450° C. with introduction of a nitrogen gas into the chamber.

Abstract: A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.

Abstract: Techniques for arranging materials on a substrate are provided. In one embodiment, a system may comprise a driver for providing a rotational force, an outer body having an inner surface, and an inner body having an outer surface and disposed within the outer body in a concentric relationship therewith. The inner body may be coupled to the driver to be rotated by the rotational force. The system may further comprise a coupler attached to the outer body in order to retain a substrate, which forms at least one patterned groove therein. A fluid channel, which may be defined between the inner and outer bodies, may be filled with a fluid medium containing materials such as nano materials. When the inner body rotates via the rotational force, the materials contained in the fluid medium may be arranged in the patterned groove of the substrate.

Abstract: A method for making a conductive film of carbon nanotubes includes the steps of: a) preparing a carbon nanotube solution having a viscosity ranging from 1 to 50 c.p. at room temperature and containing a plurality of multi-walled carbon nanotubes; b) atomizing the carbon nanotube solution to form a plurality of atomized particles including the carbon nanotubes; c) providing a carrier gas to carry the atomized particles to a substrate disposed on a spin coating equipment; and d) spin coating the atomized particles on the substrate to form a conductive film of carbon nanotubes on a surface of the substrate.

Abstract: A polymer assisted deposition process for deposition of metal nitride films and the like is presented. The process includes solutions of one or more metal precursor and soluble polymers having binding properties for the one or more metal precursor. After a coating operation, the resultant coating is heated at high temperatures under a suitable atmosphere to yield metal nitride films and the like. Such films can be conformal on a variety of substrates including non-planar substrates. In some instances, the films can be epitaxial in structure and can be of optical quality. The process can be organic solvent-free.

Abstract: A semiconductor manufacturing apparatus comprises a discharge portion discharging a coating liquid onto a substrate; a gas supply tube supplying an inert gas into a liquid container that contains the coating liquid, and pressurizing an interior of the liquid container; a coating liquid supply tube airtightly supplying the coating liquid from the liquid container to the discharge portion using pressurization from the gas supply tube; a first connecting portion capable of attaching and detaching the liquid container to and from the coating liquid supply tube; a second connecting portion capable of attaching and detaching the liquid container to and from the gas supply tube; and a solvent supply tube supplying a solvent, which can dissolve the coating liquid, to the first connecting portion.

Abstract: A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface is disclosed. The method comprises providing a cleaning disc, and applying a liquid polymer precursor to the cleaning disc by spraying or spin coating the liquid polymer precursor onto the disc to form a polymer precursor film on the disc. The polymer precursor film is cured to form a polymer layer having a cleaning surface.

Abstract: A process for preparing a pressure sensitive adhesive using a modified planetary roller extruder is described. The process in accordance with one aspect of the invention includes introducing primary raw materials including a non-thermoplastic elastomer into a feeding section of the modified planetary roller extruder, conveying the raw materials from the feeding section to a compounding section of the modified planetary roller extruder, continuously mixing the primary raw materials in the compounding section to produce a homogeneous adhesive composition. The adhesive composition may be applied to a web-form material. The compounding section of the modified planetary roller extruder includes a main spindle surrounded by and intermeshed with a plurality of planetary spindles at least one of which is a double transversal mixing spindle having a plurality of back-cut helical flights.

Abstract: Methods for oxidizing organic compounds coated or adsorbed on a topographically patterned solid surface are provided. The methods can be used to selectively remove the organic compounds from the non-recessed areas.

Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

Abstract: The present invention discloses a method for preparing a substrate coated support for use in micro-array devices. The method of the present invention comprises the steps of applying a first coat of substrate to a support, making the substrate coating ramp by subjecting the coated support to centripetal forces, adding a second coat of substrate to the resulting support having a ramping planar coat and subjecting the coated support to centripetal forces for a second time to produce a substrate coated membrane in which the thickness of the substrate layer is uniform across the entire coated surface.

Abstract: A polymer layer is deposited on a surface of a support, said surface comprising a flat main part and at least one recessed zone with respect to the flat main part. The polymer layer is achieved by at least the following successive steps: deposition of a predetermined quantity of a liquid mixture comprising at least a polymer or at least a precursor of said polymer on the flat main part of the surface of the support, introducing at least a part of the liquid mixture into the recessed zone by moving a cylinder placed on the flat main part of the surface, deposition of an additional quantity of liquid mixture on the flat main part of the surface, and rotation of the support along an axis perpendicular to the plane of the surface.

Abstract: The invention relates to a method for producing tamper-proof identification elements, and to tamper-proof identification elements produced according to said method and consisting respectively of at least one layer (2) reflecting electromagnetic waves (3), a spacer layer, and a layer consisting of metallic clusters (4). According to said method, a partial or all-over layer reflecting electromagnetic waves is applied to a carrier substrate (1), followed by at least one partial and/or all-over polymer layer having a defined thickness (3), and a layer consisting of metallic clusters which is produced by means of a method using vacuum technology or from systems based on solvents is then applied to said spacer layer(s).

Abstract: It is shown a method and apparatus for distributing a viscous liquid over a surface of a substrate, e.g. a semiconductor wafer or a datastorage media, by conditioning the substrate thermally, locally specific before or during the spin coating process.

Abstract: The present invention supplies a solvent to the front surface of a substrate while rotating the substrate. Subsequently, the substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at the first number of rotations. Thereafter, the substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, in application of the resist solution by spin coating, the consumption of the resist solution can be suppressed, and a high in-plane uniformity can be obtained for the film thickness of the resist film.

Abstract: The present invention is drawn to a media sheet, comprising a substrate and a porous ink-receiving layer deposited on the substrate. The porous ink-receiving layer can comprise inorganic metal or semi-metal oxide particulates bound by a polymeric binder, and the porous ink-receiving layer can further include an effective amount of a sulfur-containing compound that interacts with ozone upon exposure thereto.

Abstract: The invention relates to a process for protecting the surface of an SiC substrate. This process comprises deposition of a temporary protection layer with a thickness equal to at least two monolayers on the surface of the substrate to be protected, the protection layer being composed of gallium nitride. Advantageously, the protection layer of gallium nitride may be obtained by depositing gallium on the surface of the substrate, followed by nitridation of the gallium layer formed. The invention also relates to an “epiready” substrate. This substrate comprises an SiC substrate for which at least one surface is covered by a temporary protection layer, the said layer being composed of GaN and being two monolayers thick.

Abstract: There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.

Abstract: A method and apparatus of coating a polymer solution on a substrate such as a semiconductor wafer. The apparatus includes a coating chamber having a rotatable chuck to support a substrate to be coated with a polymer solution. A dispenser to dispense the polymer solution over the substrate extends into the coating chamber. A vapor distributor having a solvent vapor generator communicable with the coating chamber is included to cause a solvent to be transformed into a solvent vapor. A carrier gas is mixed with the solvent vapor to form a carrier-solvent vapor mixture. The carrier-solvent vapor mixture is flown into the coating chamber to saturate the coating chamber. A solvent remover communicable with the coating chamber is included to remove excess solvent that does not get transformed into the solvent vapor to prevent the excess solvent from dropping on the substrate.

Abstract: A composite thermal protection structure, for applications such as atmospheric re-entry vehicles, that can withstand temperatures as high as 3600° F. The structure includes an exposed surface cap having a specially formulated coating, an insulator base adjacent to the cap with another specially formulated coating, and one or more pins that extend from the cap through the insulator base to tie the cap and base together, through ceramic bonding and mechanical attachment. The cap and insulator base have corresponding depressions and projections that mate and allow for differences in thermal expansion of the cap and base. A thin coating of a reaction cured glass formulation is optionally provided on the structure to allow reduce oxidization and/or to reduce catalytic efficiency.