Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.

Abstract: The present invention supplies a solvent to a front surface of a substrate while rotating the substrate. The substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at a first number of rotations. The substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, consumption of the resist solution can be suppressed and a high in-plane uniformity can be obtained for the film thickness of the resist film.

Abstract: Discloses herein is a method of forming a low-k layer. The method includes the following steps. Tetraalkoxysilane, ethanol, tetraalkylammonium hydroxide and water are mixed in a molar ratio between 1:0.1:0.1:5 and 1:10:0.5:36 to form a first mixture. The first mixture is heated for a period of less than about 36 hours to form a second mixture containing a plurality of non-crystalline silicon-containing particles, wherein each of the non-crystalline silicon-containing particles has a particle size of smaller than about 10 nm. Subsequently, a surfactant is added to the second mixture to form a colloid solution, in which the surfactant has a concentration of about 1-20% by weight of the colloid solution. The colloid solution is coated on a substrate and thereby forming a colloid layer thereon. Then, the colloid layer is heated at a condition sufficient to transform the colloid layer into the low-k layer.

Abstract: A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

Abstract: A method of making a nanostructure by preparing a face centered cubic-ordered metal nanoparticle film from metal nanoparticles, such as gold and silver nanoparticles, exerting a hydrostatic pressure upon the film at pressures of several gigapascals, followed by applying a non-hydrostatic stress perpendicularly at a pressure greater than approximately 10 GPA to form an array of nanowires with individual nanowires having a relatively uniform length, average diameter and density.

Abstract: In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.

Abstract: A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: A method is disclosed for spin coating a stent. The method comprises conducting the following acts at the same time: applying a coating substance to the stent; rotating the stent about a first axis of rotation; and rotating the stent about a second axis of rotation.

Abstract: The present invention provides nanocomposite materials comprising carbon nanotubes and oligo(p-phenylenevinylene) (OPV). Dispersion of CNT in the solution of solution of oligo(p-phenylenevinylene) (OPV) in organic solvent results in the formation of nanocomposite material. The ?-? interaction between CNT and OPV molecule were shown by spectroscopic and microscopic techniques. The nanocomposite solution can be drop casted over glass or metallic surface for the preparation of superhydrophobic coating. The resultant composite surface shows superhydrophobic nature even with corrosive liquids and its contact angle is almost constant even after prolonged contact with water.

Abstract: The invention relates to read/write methods for information hidden from visual perception and can be used to visualize hidden images of identification of an object, which provide protection against unauthorized reproduction. The surface of the object is first polished. An optically invisible marking image is formed on the polished surface by modifying at least one area of the surface, which changes the surface energy of modified sites. Said marking image is visualized by establishing a meta-stable environment in the vicinity of the aforementioned surface of the object. The marking image is produced in the form of distinguished structures formed by stable phase particles of the meta-stable environment at the sites of the object surface having different surface energy. Prior to performing a visualization process of the optically invisible marking image, the surface containing the modified areas is electrically-charged and cleaned by friction.

Abstract: Spin coating method for a recording medium having a hole in the center, including moving a tip of a feeding nozzle to an initial position at a distance X above a recording surface and a distance A radially apart from a periphery of the hole, feeding a coating liquid onto the recording surface for a predetermined period of time while rotating the recording medium at a predetermined speed, and moving the tip from the initial position along a radial direction towards an outer periphery of the recording medium while keeping the tip above the recording surface at the distance X. X satisfies X?2 [3 r ?/(2 g C)]1/3, where ? and C respectively are surface tension and density of the coating liquid, r is the outer radius of the feeding nozzle, and g is the acceleration of gravity. A satisfies A?r+X/3.

Abstract: There is provided a coating method which can efficiently apply a coating liquid, such as a liquid resist, to the entire surface of a wafer even when the coating liquid is supplied in a smaller amount than a conventional one, and can therefore reduce the consumption of the coating liquid. The coating method includes: a first step of rotating the substrate at a first rotating speed while supplying the coating liquid onto approximately the center of the rotating substrate; a second step of rotating the substrate at a second rotating speed which is lower than the first rotating speed; a third step of rotating the substrate at a third rotating speed which is higher than the second rotating speed; and a fourth step of rotating the substrate at a fourth rotating speed which is higher than the second rotating speed and lower than the third rotating speed.

Abstract: A spin-coating method according to the present invention includes a uniforming step of rotating a substrate at a predetermined main rotation speed for a predetermined main rotation time so as to primarily make a resist film thickness uniform, and a subsequent drying step of rotating the substrate at a predetermined drying rotation speed for a predetermined drying rotation time so as to primarily dry the uniform resist film. In the present invention, a contour map, for example, of film thickness uniformity within an effective region (critical area) shown in FIG. 3A is determined (generated), and resist-coating is performed by selecting a condition within the optimum region in this contour map in which the film thickness uniformity (within an effective region) can be the maximum, or within the region in which the film thickness uniformity (within an effective region) can be high enough for a desirably specified.

Abstract: A method for spin coating a surface of an optical article, includes the steps of: selecting as the optical article an article (10) with a concave face (12) able to adopt a facing up position in which its uppermost portion is an edge (15) and selecting the concave face as the surface to be coated; dispensing a predetermined volume of a coating solution (18) on the concave face (12) along the edge (15), the concave face (12) facing up and the solution being dispensed in a top down manner; waiting with no motion of the article (10) for the solution to flow on the concave face (12) until it collects centrally; and spinning the article (10) to force the solution back to the edge (15) of the concave face (12).

Abstract: There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.

Abstract: An apparatus and process operate to impose sonic pressure upon a spin-on film liquid mass that exhibits a liquid topography and in a solvent vapor overpressure to alter the liquid topography. Other apparatus and processes are disclosed.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: A wet processing system detects a globule of a process solution in a drippy or dripping state from the tip of any one of process solution pouring nozzles being moved to a pouring position for pouring the process solution onto a substrate by obtaining image data on the process solution pouring nozzle, and takes proper measures to prevent the process solution from dripping. A wet processing system 1 pours a process solution, such as a resist solution, through one of process solution pouring nozzles 10 onto a surface of a substrate, such as a wafer W, held substantially horizontally by a substrate holding device 41 surrounded by a cup 5 to process the surface by a wet process. A nozzle carrying mechanism 10a carries the process solution pouring nozzles 10 between a home position on a nozzle bath 14 and a pouring position above the substrate held by the substrate holding device 41. An optical image of the tips of the process solution pouring nozzles 10 is obtained by an image pickup means, such as a camera 17.

Abstract: A method and device for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm.