Patents Examined by Livius R Cazan
  • Patent number: 11424664
    Abstract: A method for manufacturing a stator for an electric rotary machine including a stator core formed by stacking a plurality of steel plates and a coil attached to the stator core, the method includes forming the steel plates, forming the stator core by stacking and fixing the plurality of steel plates with an adhesive, attaching the coil to the stator core, and changing a stack strength of the stator core, by deteriorating the adhesive such that a bending resonance frequency of the stator does not overlap with a pre-measured circular resonance frequency of the stator, the bending resonance frequency varying depending on the stack strength of the plurality of steel plates.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: August 23, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Manabu Sakurada, Shogo Nomura
  • Patent number: 11395451
    Abstract: A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: July 19, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideki Sumi
  • Patent number: 11385002
    Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 12, 2022
    Assignee: International Business Machines Corporation
    Inventors: Khaalid McMillan, Jason R. Eagle, Robert K. Mullady, Scott R. LaPree, Robert R. Genest, William James Anderl
  • Patent number: 11380224
    Abstract: A display apparatus, and a method for the display apparatus. The display apparatus includes a main frame, a magnet movably positioned on the main frame, and a light emitting diode (LED) module assembly detachably positioned on the main frame. The LED module assembly includes a plurality of LED modules, and a support frame on which the plurality of LED modules are installed, the support frame comprising a magnetic material interacting with the magnet. The display apparatus further includes a power cable configured to supply power to the plurality of LED modules, and a cover installed in the main frame to facilitate a connection of the power cable.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: July 5, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Jung, Yoon Ah Kim, Sang Ki Yoon, Huu Lam Vuong Nguyen, Kwang Sung Hwang
  • Patent number: 11380974
    Abstract: A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: July 5, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Josephine B. Chang, John M. Cotte
  • Patent number: 11375650
    Abstract: The pick-up tool is a tool used in a mounting device configured to mount a component on a board supported by backup pins disposed on a backup plate. The pick-up tool includes an attaching portion configured to be attached to a moving head moving the backup pin; a slit formed in an insertion direction in which an engaging portion formed on the distal end of the backup pin is inserted; and a groove, being formed orthogonally to the slit, into which the engaging portion enters.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 28, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Jinya Imura
  • Patent number: 11374472
    Abstract: The magnetic steel loading and separating device is used for separating magnetic steel strips and large plastic spacers of a magnetic steel plate, and includes a material case, a material pushing mechanism and a material separating mechanism. The material case includes a case body for accommodating the magnetic steel plate, and a discharge port is formed in a side wall of the case body. The material pushing mechanism is used for successively pushing the magnetic steel strips and the large plastic spacers of the magnetic steel plate out of the material case via the discharge port, wherein a discharge position and a take-up position that are provided for the magnetic steel strip are formed outside the material case. The material separating mechanism includes a magnetic steel pushing block that reciprocates between the discharge position and the take-up position of the magnetic steel strip.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: June 28, 2022
    Assignee: JEE TECHNOLOGY CO., LTD.
    Inventors: Lei Liu, Yulong Yao, Bo Wang, Shanwei Xia, Aiwen Shi
  • Patent number: 11367564
    Abstract: A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 21, 2022
    Inventor: Wen-Chin Wang
  • Patent number: 11342149
    Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: May 24, 2022
    Assignee: International Business Machines Corporation
    Inventor: Michel Despont
  • Patent number: 11318524
    Abstract: A method for producing a container having an upper part, a lower part and a receiving element such as an electronics module includes the following steps: the lower part is created from a first starting material in a first processing region of a processing device; the upper part is created from a second starting material in a second processing region of the processing device; the receiving element is fed into the first processing region of the processing device; the lower part receives the receiving element in the first processing region of the processing device; the upper part is fed from the second processing region into the first processing region of the processing device; and there the upper part and the lower part are joined together to form the container.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 3, 2022
    Assignee: Continental Teves AG & Co. OHG
    Inventors: Manfred Goll, Martin Haverkamp, Gerhard Sticksel
  • Patent number: 11322918
    Abstract: The present invention relates in general to the field of high voltage power line insulators, and more specifically, to a tool for installing high voltage power line insulators and a method of use. The installation tool includes a feature that allows a lineworker to safely install high voltage power line insulators of different shapes and sizes using the same installation tool. In particular, the installation tool comprises differently sized sockets that correspond to the distinct head size dimensions of different types of high voltage power line insulators. A purpose of the invention is to provide a tool for installing high voltage power line insulators and a method of use that minimizes risk of injury to the lineworker during installation, is easy to use, and cost-effective to manufacture.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: May 3, 2022
    Inventors: Spencer James Schenk, Hadan Sybrant
  • Patent number: 11317551
    Abstract: A component mounter provided with head, a device for moving head, transfer unit, and a mounting controller. Round plate is an example of a container for paste. The mounting controller, in the first operation mode, images components held by multiple nozzles using an imaging device before transfer is performed, and recognizes the position and/or orientation of each component based on the image of each component. Further, the head and the head moving device are controlled based on the position and/or orientation of each component such that a coating layer is transferred to connection terminals of each component at a transfer area of each of the components set in advance that does not include a margin based on the holding deviation of each component.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: April 26, 2022
    Assignee: FUJI CORPORATION
    Inventor: Ryohei Kamio
  • Patent number: 11300605
    Abstract: The present disclosure describes printed circuit board performance evaluation techniques. In some cases, a printed circuit board performance evaluation process may include determining a first set of electrical properties associated with an interface between components of a printed circuit board, where the interface is disposed on an internal or external layer of the printed circuit board. After selective application of a sheet of dielectric material to a portion of a transmission line in the interface, a second set of electrical properties associated with the interface may be determined. The first set of electrical properties may be compared to the second set of electrical properties to evaluate printed circuit board performance. In other cases, the interface may include a trace inductor, and electrical properties of the interface before and after application of a ferrous material may be compared to evaluate printed circuit board performance.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 12, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Layne A. Berge, Matthew S. Doyle, Manuel Orozco, John R. Dangler, Thomas W. Liang, Jason J. Bjorgaard
  • Patent number: 11302472
    Abstract: Techniques are disclosed concerning applied magnetic field synthesis and processing of iron nitride magnetic materials. Some methods concern casting a material including iron in the presence of an applied magnetic field to form a workpiece including at least one ironbased phase domain including uniaxial magnetic anisotropy, wherein the applied magnetic field has a strength of at least about 0.01 Tesla (T). Also disclosed are workpieces made by such methods, apparatus for making such workpieces and bulk materials made by such methods.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: April 12, 2022
    Assignee: REGENTS OF THE UNIVERSITY OF MINNESOTA
    Inventors: Jian-Ping Wang, Yanfeng Jiang
  • Patent number: 11296398
    Abstract: Methods and systems form shaped wire lengths of flexible wire materials by use of dispensing heads and movement of same in a direction along an axis different from the axis of movement followed by a web of material with which the thus formed shaped wire lengths are combined or to which the thus formed shaped wired are secured or adhered by adhesives applied onto the web prior to or during dispensing. Items are prepared that are suitable for use as antenna components of RFID devices. Also, RFID elements can be positioned on the web and the shaped wire length applied to the RFID element to provide a combination RFID device having both antenna and RFID element. Shaping of the flexible wires is achieved in manufacturing times substantially shorter than other methods and systems.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 5, 2022
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Ian Forster
  • Patent number: 11270722
    Abstract: A method according to one embodiment includes forming at least two write transducers for writing to a magnetic medium, the at least two write transducers being positioned adjacent each other and aligned along a line; and forming a shield structure having shields adjacent at least three sides of each of the at least two write transducers, the shields being formed of a magnetically-permeable material.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: March 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Robert G. Biskeborn, Philipp Herget
  • Patent number: 11233369
    Abstract: A positioning cartridge is disclosed for use during manufacture of an electrode. The positioning cartridge may have a plurality of positioning inserts, each with proximal and distal ends, and a scaffold secured to the proximal ends of each positioning insert. The scaffold may be configured to place the positioning inserts in a defined orientation with respect to each other that corresponds to a plurality of longitudinal bores of the electrode. An electrode may be manufactured using the positioning cartridge. The positioning cartridge may have a plurality of components, such that at least one component is associated with each positioning insert. The plurality of components may be temperature sensors. The positioning cartridge may be configured to position each temperature sensor at a location adjacent an outer surface of the electrode.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: January 25, 2022
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Rogelio Plascencia, Patrick Kiernan, Steven Campbell, Federico Valdovinos
  • Patent number: 11227719
    Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: January 18, 2022
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L Renner, John Bultitude, Allen Hill
  • Patent number: 11227629
    Abstract: A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 18, 2022
    Assignee: Magnecomp Corporation
    Inventors: Peter Hahn, Kuen Chee Ee, Long Zhang
  • Patent number: 11219151
    Abstract: To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using touch down sensors, a pick-up head including touch down sensors and the semiconductor devices on the carrier substrate are moved relative to each other to contact the carrier substrate with the touch down sensors. Signals from each touch down sensor indicating a degree of deformation of each touch down sensor caused by the contact with the carrier substrate are used to determine an orientation of the pick-up head by processing the signals, and adjust the orientation of the pick-up head based on the determined orientation to attach the semiconductor devices onto the pick-up head. In some embodiments, the touch down sensors are piezoelectric benders.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 4, 2022
    Assignee: Facebook Technologies, LLC
    Inventor: Pooya Saketi