Abstract: The present disclosure includes an adjustable circuit board assembly including a circuit board, a header connected to the circuit board, and a matrix connector. The header may be configured for connection with the circuit board via a connection matrix and the matrix connector. A method of manufacturing a circuit board assembly may include providing a circuit board, providing a terminal header having a plurality of terminals, providing a connection matrix to at least one of the circuit board and the terminal header, providing a matrix connector, connecting the terminal header with the circuit board via the matrix connector and the connection matrix, and connecting the plurality of terminals to the circuit board.

Abstract: A method of applying viscous media on a substrate is disclosed. In the method, the substrate is provided, which is arranged for mounting of electronic components thereon. Further, flux is provided on a deposit of solder paste, which deposit is arranged at a predetermined position on the substrate. The flux is provided by a non-contact dispensing process, such as jetting. By providing flux on the deposit prior to reflow, the risk of quality related issues, such as e.g. graping, advantageously is reduced.

Abstract: Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.

Abstract: A circuit board component layout determination method includes the steps of: (1) simulating the placement of components by a circuit board layout software program; (2) performing a circuit board component layout density analysis to obtain a circuit board component layout density percentage; (3) determining whether or not the simulated placement of components is feasible according to the circuit board component layout density percentage, and if yes, carrying out step (4); and (4) placing the components into the circuit board. The method uses a circuit board layout software program and a spreadsheet or a database to calculate the statistics of an area of a circuit board that can be laid and an area of the circuit board that cannot be laid, so as to analyze and determine the implementability of a component layout, and improve the control, efficiency and cost-effective of the component layout of the circuit board.

Abstract: The disclosure relates to a method for producing a stator, where, for one or both layers of a two-layer winding, a tool with receiving regions is respectively provided on an end face of a laminated core. A relative arrangement of the receiving regions corresponds to a relative end position for conductor ends of the conductor elements. In a positioning process, the tool is moved into a first turning position and each conductor end of a first group of the conductor elements is respectively inserted into one of the receiving regions. Then the tool is turned into at least one further turning position and each conductor end of a further group of the conductor elements is respectively inserted into one of the receiving regions until the conductor ends of all the conductor elements of the layer are in the relative end position in relation to one another.

Abstract: A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.

Abstract: A component transfer device includes a detector configured to detect a rotation angle of a driving motor that moves a pair of gripping sections, or a position of the gripping sections, and a motor control section configured to perform position feedback control of the driving motor based on a detection signal of the detector and a position command signal from the transfer control device. A transfer control device is provided with a torque monitoring section configured to monitor a value of a command torque applied to the driving motor from the motor control section, and a gripping state determining section configured to determine that there was a change in a gripping state of the component when, with the pair of gripping sections in a state gripping the component, the command torque monitored by the torque monitoring section drops to a value smaller than a first threshold value.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: The invention relates to a method of manufacturing a rotor for an electric machine, wherein the rotor is composed of at least one electric sheet wherein at least one electric sheet is thermally treated regionally to directly modify its magnetic permeability in the treated region.

Abstract: The present invention relates to a punch down tool comprising a handle, a holder extending from the handle, and a down blade assembly operably connected to the holder. The down blade assembly comprises at least two down blades, wherein the down blades include a U-shaped cut out configured thereon for accommodating a wire that is to be crimped into a connector. The tool further comprises a housing in which the down blades are disposed such that the down blades are linearly displaceable within the housing. A cutting blade is also provided on the housing.

Abstract: Embodiments include microelectrodes including a flexible shank and a bioabsorbable material surrounding the flexible shank. The flexible shank can include a flexible substrate, a circuit, and a plurality of sensors. Embodiments also include a methods of forming flexible active electrode arrays including depositing a flexible polymer on a substrate. The methods also include forming a plurality of sensors on the flexible polymer and attaching a silicon-based chip to the flexible shank. The methods also include coating the flexible shank in a bioabsorbable material and cutting the shank and a portion of the bioabsorbable material from the substrate.

Abstract: A component mounting station is divided into two component mounting areas in a board conveyance direction according to the size of circuit boards used in two types of production that are performed in order, and the area in which a backup pin is arranged on a backup plate is divided into two pin arrangement areas corresponding to the two component mounting areas. The quantity of backup pins necessary to support the component mounting board are arranged in a predetermined arrangement pattern, the circuit boards transported using the conveyor are stopped in the component mounting areas according to the type of component mounting board produced, the backup plate is lifted up, and the circuit boards are clamped by the clamp member, and the circuit boards supported by the backup pins in the pin arrangement areas are positioned below the circuit boards, and components are mounted on the circuit boards.

Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Abstract: An apparatus for manipulating a wire comprises a first lever and a second lever. The first lever comprises a first tip-support portion, a first handle portion, and a first hinge portion. The second lever comprises a second tip-support portion, a second handle portion, and a second hinge portion. The first hinge portion and the second hinge portion are pivotally interconnected about a lever-pivot axis. The apparatus also comprises means for biasing the first tip-support portion and the second tip-support portion toward each other, a first tip half pivotally coupled to the first tip-support portion, and a second tip half pivotally coupled to the second tip-support portion. The first tip half comprises a first channel. The second tip half comprises a second channel.

Abstract: A medium is accommodated in a container together with an electronic component body including an underlying electrode layer. The medium treats a surface of the underlying electrode layer while vibration is applied to the container. The medium is spherical or substantially spherical. The medium has a diameter not smaller than about 0.2 mm and not greater than about 2.0 mm. The medium contains tungsten.

Abstract: A wedge connector system for connecting first and second elongate electrical conductors includes a C-shaped sleeve member, a wedge member, and an insert member. The sleeve member defines a sleeve cavity and opposed first and second sleeve channels on either side of the sleeve cavity. The wedge member includes a wedge body having first and second opposed wedge side walls. The insert member is configured to be selectively mounted in the first sleeve channel and defines an insert member channel to receive the first conductor when the insert member is mounted in the first sleeve channel. The sleeve member and the wedge member are configured to capture the first and second conductors such that: the first conductor is received in the insert member channel and captured between the sleeve member and the first wedge side wall; and the second conductor is captured between the sleeve member and the second wedge side wall.

Abstract: A component mounter comprises a mounting head that holds a plurality of nozzles. Two imaging positions are provided for the circumferential orbit along which the nozzles of the mounting head are arranged. While the nozzles are rotated continuously about the rotation axis, an operation of imaging the nozzles located at the imaging positions is performed for each of the imaging positions. Therefore, in a period when the nozzles rotate by an angle not larger than a predetermined angle around the rotation axis formed by the interval between the two imaging positions adjacent to each other along the circumferential orbit, imaging of the nozzles can be completed by locating each of the nozzles at one of the two imaging positions. As a result, it becomes possible to image the plurality of nozzles of the mounting head efficiently.

Abstract: A manufacturing method for an electrode of a high-temperature piezoelectric element, comprises: coating traditional conductive slurry on surfaces of a molded piezoelectric material (1); then polarizing the piezoelectric material (1); and then removing the coating of conductive slurry (2) on the surfaces there of, and connecting the piezoelectric material to outside electrode lead wires (3) to output a signal generated by piezoelectric effect thereof. A structure of a high-temperature piezoelectric element, comprises polarized piezoelectric material (1), wherein the coating of metallic conductive slurry (2) is removed from the surfaces of the polarized piezoelectric material (1) and the surfaces of the polarized piezoelectric material (1) is connected to electrode lead wires (3) to output a signal generated by piezoelectric effect thereof.

Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Abstract: A method is provided for setting up a transmission link for electrical energy, in which at least one superconductive cable and a cryostat surrounding the same are used, the cryostat having two metal tubes arranged concentrically in relation to one another, between which a vacuum insulation is provided. The ends of the cryostat in the assembled state as well as the superconductive cable located in the same are attached on fixed parts of the transmission link. At least at one end of the cryostat, there is gaplessly connected to the same a tube body which is bent by an angle of at least 180° and likewise consists of two metal tubes arranged concentrically in relation to one another, between which a vacuum insulation is provided. The superconductive cable protruding from the cryostat is arranged in the tube body at room temperature in such a way that it runs at least in the direct proximity of the wall of the inner tube of the tube body that has the greater bending radius.