Abstract: In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

Abstract: A system for servicing cable includes a plurality of jaws operable between an open position for receiving a cable in a direction transverse to a cable axis such that the cable extends axially beyond the jaws in two directions, and a closed position for engaging and rotationally fixing the cable about the cable axis. A tool arrangement is disposed proximate to the base and includes at least one tool operable to perform work on the cable when the cable is engaged by the jaws. The tool arrangement is operable to perform at least one of a rotational movement around or an axial movement along the cable axis and to operate the tool.

Abstract: A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 ?m. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.

Abstract: A component mounting system includes an automatic loading-type tape feeder (a component supply unit) being capable of supplying up to N (N is a natural number equal to or larger than 1) carrier tapes for storing a component, and automatically transporting an inserted carrier tape, and a component mounting apparatus which mounts the component supplied from the tape feeder on a substrate, in which a replenishing operation of carrier tape with respect to the tape feeder is detected, and a case where a carrier tape with which the tape feeder is to be replenished is an (N+1)-th is notified to an operator.

Abstract: A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.

Abstract: A method of assembling an implantable electrode array from a coupon (108) formed from plastically deformable material. Layers of material are disposed on the coupon to form the electrodes (48) and conductors (62) of one or more electrode arrays. Sections of the coupon on which the electrodes and conductors are removed, along with the electrodes and conductors to form the electrode arrays. The removed sections of the coupon thus function as plastically deformable carriers (74) for the arrays (40).

Abstract: A rotor fabrication method is provided. The rotor uses pre-fabricated conductive rotor bars in which the ends have been shaped and sized to fit within corresponding end cap receptacles. After assembly, the structure is compressed, thereby achieving mechanical and electrical coupling between the conductive rotor bars and the end caps. Locking members disposed at either end of the assembly maintain the desired level of axial compressive force on the structure.

Abstract: To improve the Q value of a piezoelectric thin-film element in a state in which unnecessary vibration is suppressed, an acoustic reflection film (104) is affixed to a first electrode (102), a piezoelectric single-crystal substrate (101) is thinned by polishing from the other surface (101b) of the piezoelectric single-crystal substrate (101), such that the first electrode (102) and piezoelectric thin film (105) are piled on the piezoelectric single-crystal substrate (101). In this polishing, a pressure (polishing pressure) to the surface (101b) during polishing in an electrode formation region where the first electrode (102) is formed differs from that in a non-electrode formation region around the electrode formation region. Consequently, the electrode formation region of the piezoelectric thin film (105), where the first electrode (102) is formed, is made thinner than the non-electrode formation region around the electrode formation region.

Abstract: A feeder device including a tape feeding mechanism which feeds out a carrier tape which stores components in corresponding multiple component storage sections and a cover tape which is adhered to the bottom tape and covers the component storage sections, and a tape peeling mechanism which includes a tape peeling blade which proceeds between the bottom tape and the cover tape as the carrier tape is fed out to perform peeling, the feeder device supplying the components from the component storage sections at a component supply position, and the feeder device further including a feed speed determination section which determines the feed speed at a peeling start time at which a leading end of the carrier tape comes into contact with the tape peeling blade according to at least one of properties of multiple types of carrier tape and characteristics of the components which are stored.

Abstract: A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

Abstract: A component mounting machine is provided with a suction nozzle including a nozzle suction surface, a camera acquiring nozzle imaged data of a tip end of the suction nozzle, and a control device determining the quality of a nozzle suction surface.

Abstract: A wiring loop structure of a skin electrode pad production machine includes a first transmission means for transmitting a strip clad substrate portion, a second transmission means for transmitting a strip conductive adhesive portion, a circulation conveyor belt with plural positioning fixtures, and two laminating rollers for laminating the clad substrate portion and the conductive adhesive portion. The first transmission means includes an assembling roller disposed above an end of the circulation conveyor belt, and the positioning fixture is provided for positioning an electrode lead, and the assembling roller strip clad is provided for adhering the substrate portion to the electrode lead, and the two laminating rollers are provided for attaching the strip clad substrate portion and the conductive adhesive portion after being laminated by the two laminating rollers, so as to facilitate the electrode lead to assemble and manufacture the electrode pad.

Abstract: A wire harness manufacturing system includes a display unit, a wire cutting machine that draws an electric wire from a wire feed reel and cuts the electric wire to a predetermined length, a control unit that directs the display unit to display a wire laying image and wire work identification information for identifying a work regarding each electric wire, the wire laying image including a plurality of wire images showing the plurality of electric wire in the laid state and the wire work identification information being displayed in the vicinity of the corresponding wire image, and a memory unit that stores the wire laying image and work instruction information so as to correspond to the wire work identification information, the work instruction information including cut length of the electric wire. The control unit sends the cut length information to the wire cutting machine.

Abstract: A brushless DC electric motor having a rotor with a single bearing, a multi-pole oriented magnet, an output coupling and a rotor shell. The rotor shell is formed of an electrically insulating material and can be overmolded onto the magnet, the bearing and the output coupling.

Abstract: Disclosed herein is a bonded-type laminated core member manufacturing apparatus including an adhesive application unit to apply an adhesive to a material being continuously transferred, and a laminating unit configured to integrate laminar members laminated within a laminating hole by blanking the material, a laminated core member being manufactured by interlayer adhesion between the laminar members, and the laminating unit includes an adhesive hardener to harden the adhesive located between the laminar members so as to integrate the laminar members passing through the laminating hole, and pinchers provided under the adhesive hardener to apply lateral pressure to the laminated core member so as to prevent falling of the laminated core member. Since the laminated core members may be stably extracted, damage to the laminated core member due to falling may be prevented and the laminated core members in an aligned state may be extracted.

Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

Abstract: A method for forming an acoustic resonator comprising: forming a piezoelectric material on a first substrate; and applying the piezoelectric material to a second substrate on which the acoustic resonator is fabricated upon.

Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

Abstract: An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.