Abstract: A data center configured to be positioned in an environment (e.g., an open space) has a plurality of modules. Among other things, each module has a housing forming an interior configured to contain a plurality of processing devices that generate heat during operation. To manage the temperature within the interior, each module has an air inlet configured to receive air from the environment, and an air outlet configured to exhaust air from the housing. At least three of the modules are spaced apart to form at least one lateral space between adjacent modules. The plurality of modules preferably are arranged so that the at least three modules form an interior region configured to receive the exhaust air of the at least three modules.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: Solid state and hybrid circuit protection devices include improved chemical, static discharge and impact resistant housing construction, arc-free switching operation, secure terminal assemblies and thermal management features. The solid state and hybrid circuit protection devices are ignition protected and avoid possible explosions and therefore obviate a need for conventional explosion-proof enclosures to ensure safe operation of an electrical power system in a potentially explosive environment.

Abstract: Methods, systems, and devices for managing coolant in data centers are disclosed. Coolant may be used in data centers to regulate the temperatures of computing devices. The disclosed methods and system may provide for containment of vapor and condensation of the vapor into coolant. The coolant may be used as part of a two phase cooling system to cool the computing devices. The vapor may be generated when the coolant removes heat from computing devices during operation while at least partially submerged in the coolant. A mobile condenser is used for condensing the vapor within the containment.

Abstract: A system and method are provided for coordinating the installation and removal a motor control center subunit with the power connection and interruption thereof. A system of interlocks and indicators causes an operator to install a motor control center subunit into a motor control center, and connect supply and control power thereto, in a particular order. Embodiments of the invention may prevent actuation of line contacts of the bucket, and shield the line contacts, until the bucket is fully installed in the motor control center. Other embodiments also prevent circuit breaker closure until the line contacts are engaged with a bus of the motor control center.

Abstract: A facility (e.g., data center) for more efficient cooling of computing devices is disclosed. In one embodiment, the data center comprises a set of external walls, a ceiling connected to the external walls and having circular exhaust openings, and one or more pods positioned within the external walls and below the ceiling. A set of flexible tubes are used to connect the pod exhaust openings to the ceiling openings. Actuating closures may be used (e.g., at one end of each of the tubes) to control airflow, and air pressure sensors may be placed near or inside one or more of the tubes. A controller may be configured to receive air pressure data from the air pressure sensors and adjust the actuating closures to maintain a desired air pressure level. In some examples, the actuating closure may have a normally closed position when power is not applied.

Abstract: Quantum processing circuitry cooling systems are provided. The systems can include: a first chamber maintained at a first pressure; a second chamber maintained at a second pressure, wherein the first and second pressures are independent from one another; a cooler within the first chamber and operable to act as a cooling source for the cooling system; and quantum processing circuitry within the second chamber, the quantum processing circuitry being thermally coupled to the cooler.

Abstract: Described herein are DC-DC converters with electronic module cooling units used for air-convection cooling of some components of power electronic modules and conductive cooling of other components, e.g., switching sub-modules. A cooling unit may have a heat exchanger and a cooling plate, thermally coupled to one or more heat exchangers and one or more switching sub-modules. For example, the cooling plate can be positioned between and thermally coupled to heat exchangers. One fan can direct air through one heat exchanger and to one power electronic module as a part of convection cooling. An additional fan can direct air through the second heat exchanger and to the second power electronic module. The cooling plate can be also positioned between and thermally coupled to switching sub-modules of these power electronic modules thereby enabling conductive cooling. The plate-cooling liquid is pumped through the cooling plate.

Abstract: An arrangement for cooling power semiconductor devices (2) of a converter (1) arranged in a closed casing (3) with the semiconductor devices in a bottom of the casing on top of a heat sink (5) having members (6) for heat exchange extending externally of the casing out from the bottom comprises a channel (8) for conducting a flow of air to pass said members (6) for cooling thereof, in which a first portion (7) of the channel has the casing bottom as a ceiling and receiving said members (6). A fan (9) is located with a suction side connected to the first channel portion (7) to create a flow of air from an inlet (16) from the exterior (19) into the channel while passing the heat sink members. A filter (18) covers the inlet to the channel for removal of dust and debris from air entering the channel from the exterior.

Abstract: An electronic device includes a housing, a plurality of fans aligned in a width direction of the housing, a partition board which is interposed between a plurality of fans adjoining each other in the width direction of the housing and extended in a downstream side of a flow direction of wind caused by a plurality of fans, an electronic part which is disposed to consecutively join the partition board in the downstream side of the flow direction of the wind, and a passage resistor which is disposed in a further downstream side of the flow direction of the wind from the electronic part.

Abstract: A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

Abstract: An inverter and a heat radiation structure thereof are provided. The heat radiation structure of the inverter includes a heat radiator for radiating heat from a heating element of the inverter, and a heat radiation fan for air-cooling the heat radiator. The heat radiator includes multiple heat radiation fins able to be air-cooled. The number of the heat radiator is at least two, and two adjacent heat radiators are a first heat radiator and a second heat radiator respectively. The heat radiation fan is provided between the first heat radiator and the second heat radiator, and the heat radiation fan is located on the tops of the heat radiation fins. In the heat radiation structure of the inverter, the heat radiation fan is capable of cooling the first heat radiator and the second heat radiator at the same time.

Abstract: An outdoor display apparatus comprises a case including an inlet and an outlet, a display module disposed inside the case and including a display panel on which an image seen through at least a portion of the case is displayed, and a heat exchanger. The heat exchanger comprises a first portion located on a first flow path formed to circulate air to the display module, a second portion to receive heat from the first portion, and located on a second flow path on which outside air is heat-exchanged with air, and a phase change material provided to circulate between the first and second portions, and provided to change a phase from a fluid to a gas. The case comprises a partition wall provided to isolate the first flow path and the second flow path from each other, and the first portion and the second portion are disposed obliquely.

Abstract: A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.

Abstract: A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.

Abstract: An electronic component heat dissipation apparatus and methods having a heat dissipation housing. The heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween. The internal wall defines an internal chamber having an airflow inlet opening and an airflow outlet opening. The housing is aligned with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of heated air. The external wall has at least one external air opening configured to allow external air into the outer chamber. The internal wall has a plurality of heat dissipation nozzles. Each heat dissipation nozzle has an external air inlet opening located within the internal wall and an external air outlet opening located within the internal chamber. The diameter of the external air inlet opening is greater than the diameter of the external air outlet opening.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid cool the computer components. Advantageously, a pH indicator is employed to monitor the acidity of the dielectric fluid via, for example, a color change.

Abstract: A pressure relief valve for a two-phase immersion cooling system is configured to support fluid flow rates up to 500 cfm, 550 cfm, 600 cfm, or even 2000 cfm. This, in turn, allows the cooling system to support computing systems with a power density greater than 250 kW. This is accomplished by the valve having a relatively large passage (e.g., 2-6 inch diameter), a relatively large spring (e.g., 1.5-1.7 inch diameter), and a guide rod rigidly coupled to the poppet and slidably coupled to a guide plate. The valve may be used as an outlet valve and coupled to an adsorbent chamber to reduce the loss of coolant from the system as air is vented to an ambient environment. The valve may be used as an inlet valve and coupled to an adsorbent chamber to reduce the intake of water vapor as air from the ambient environment flows into the system.

Abstract: A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.

Abstract: Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.