Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid cool the computer components. Advantageously, a pH indicator is employed to monitor the acidity of the dielectric fluid via, for example, a color change.

Abstract: A pressure relief valve for a two-phase immersion cooling system is configured to support fluid flow rates up to 500 cfm, 550 cfm, 600 cfm, or even 2000 cfm. This, in turn, allows the cooling system to support computing systems with a power density greater than 250 kW. This is accomplished by the valve having a relatively large passage (e.g., 2-6 inch diameter), a relatively large spring (e.g., 1.5-1.7 inch diameter), and a guide rod rigidly coupled to the poppet and slidably coupled to a guide plate. The valve may be used as an outlet valve and coupled to an adsorbent chamber to reduce the loss of coolant from the system as air is vented to an ambient environment. The valve may be used as an inlet valve and coupled to an adsorbent chamber to reduce the intake of water vapor as air from the ambient environment flows into the system.

Abstract: A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.

Abstract: Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.

Abstract: Described herein are radio tray assemblies that include space for a specific radio and its power supply and that additionally provide cooling and power conversion and control functionalities. The disclosed radio tray assemblies are designed to have a form factor compatible with legacy radio systems (e.g., MIDS-LVT) while enabling installation of a new radio system (e.g., MIDS-JTRS). The disclosed radio tray assemblies are configured so that the radio and its power supply are secured to a tray so that the radio and power supply are side-by-side and parallel lengthwise. A cooling module or assembly of the disclosed radio tray assemblies is disposed immediately behind the radio and its power supply and is configured to cool these units using forced air cooling directed lengthwise through the radio and its power supply. A power converter and controller module converts input power into the power required by the radio power supply.

Abstract: A two-phase fluid management system, may include a sealed container and a mobile condenser that moves within the sealed container. The sealed container may include a plurality of input ports, each to receive a two-phase fluid as vapor from a respective one of a plurality of IT enclosures and a plurality of output ports, each to return the two-phase fluid as liquid to the respective one of the plurality of IT enclosures. The mobile condenser may be coupled to or include an actuator to move the mobile condenser to a respective one of a plurality of positions within the sealed container. An air intake and air outlet of the mobile condenser may form a sealed connection with a pair of condenser ports when the mobile condenser moves to the respective one of the plurality of positions.

Abstract: According to one embodiment, a server chassis for immersion cooling includes a chassis frame having a chassis base and an adjustable server panel coupled to the chassis base to receive a server blade to be mounted on the adjustable server panel. The server blade includes a first portion and a second portion. The first portion has a first set of electronic components and the second portion has a second set of electronic components. The adjustable server panel is adjustably mounted along the chassis base, such that when the server chassis is deposited into a container having two-phase coolant therein, the first set of electronic components is at least partially submerged into a liquid region filled with the two-phase coolant, and the second set of electronic components is positioned within a vapor region above an immersion line defining the liquid region and the vapor region.

Abstract: A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).

Abstract: The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes an internet technology (IT) tank that houses a computing device immersed in a two phase coolant; an aisle, in which the immersion tank is disposed, that captures a first vaporized portion of the two phase coolant escaped from the immersion tank; a condenser that transforms the first vaporized portion of the two phase coolant that escaped from the immersion tank into a first liquid portion of the two phase coolant; a second condenser captures and condenses a second portion of vapor; and a liquid distributor manages the cooling fluid and coolant fluid for the IT tank and two condensers.

Abstract: The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes multiple aisles that perform different functions. One of the aisles includes space for housing immersion tanks in which components of the data center may be positioned to be cooled. A second aisle allows the immersion tanks to be placed in the other aisle and for backside access. A third aisle transfers vapor from the aisle housing the immersion tanks to a vapor return unit to condense the vapor. A distribution unit distributes the coolant to cool the components of the data center is designed at the second aisle. The aisles and other units can be modularized to allow for deployment to meet different types of data center requirements.

Abstract: In an example implementation, a computer assembly includes a computer enclosure, a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure, a vent opening formed in the enclosure below the motherboard, and an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.

Abstract: A robot, robotic systems, and methods for conducting a subterranean operation. In some embodiments, a robot may include a hazardous atmosphere controlled volume, such as an explosive (EX)-certified chamber, that is located within the body of the robot. In some embodiments, a robot may include a cooling system that is at least partially disposed to fully disposed within the body of the robot, such as partially to fully disposed within the EX-certified chamber located within the body.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.

Abstract: A laundry appliance includes a basement housing comprising a capacitor receiver. A capacitor is disposed within the capacitor receiver to define a secured position. The capacitor receiver includes at least one retaining flange that is coupled to the basement housing via a living hinge. At least one retaining flange is outwardly biased away from a body of the capacitor when the capacitor is placed in an inserted position. At least one retaining flange includes a thread-engaging surface that operates to the secured position upon rotation of the capacitor in the inserted position.

Abstract: A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.

Abstract: An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

Abstract: An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.

Abstract: A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.

Abstract: A data center rack assembly includes a rack, an electronic device, and an adjustable air duct. The rack includes a frame defining opposite first and second rack sides spaced apart in a longitudinal direction. The electronic device presents an intake side configured to receive air therethrough for passage into the electronic device. The electronic device is mounted to the frame such that the intake side is disposed intermediately between the rack sides and is spaced from the first rack side to define a longitudinal dimension therebetween. The duct includes relatively shiftable first and second duct sections that extend in the longitudinal direction to cooperatively present an adjustable longitudinal duct length, and a drive mechanism operably coupled to the first and second sections to control relative shifting of the sections in the longitudinal direction to thereby adjust the longitudinal duct length to correspond with the longitudinal dimension.

Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.