Abstract: The present invention makes it possible to provide a compound represented by formula (1) and a composition for an optical material containing this compound. (Where m+n=4, m represents an integer of from 0 to 3, and n represents an integer of from 1 to 4.) In addition, the present invention makes it possible to provide a method for producing an optical material, the method including a step for adding 0.0001-10 parts by mass of a polymerization catalyst per 100 parts by mass of the composition for an optical material, polymerizing, and curing.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 1.5 to 20.0 parts by mass, an epoxy resin composition, and an epoxy resin curing agent for an amine composition. In the formula (1), R1 is an alkyl group having 1 to 6 carbon atoms optionally having a hydroxy group, R2NHCH2—, where R2 represents an alkyl group having 1 to 6 carbon atoms, or a group represented by the following formula (1A), and p is a number of 0 to 2. In the formula (1A), R3 represents a hydrogen atom or NH2—.

Abstract: To provide 3,4-epoxycyclohexylmethyl methacrylate that is highly pure and that is useful as a raw material for functional materials or optical members having excellent transparency and heat resistance. An alicyclic epoxy compound product having a purity of 3,4-epoxycyclohexylmethyl methacrylate of 98.0 wt. % or greater and a total content of a compound represented by Formula (a) below and a compound represented by Formula (b) below of 1.3 wt. % or less. This alicyclic epoxy compound product preferably has a Hazen color number of 25 or less.

Abstract: An aromatic polysulfone resin produced by the polycondensation of 4,4?-dihydroxydiphenylsulfone represented by chemical formula (S1) shown below and 2-(4-(4-hydroxyphenylsuIfonyl)phenoxy)-5-(4-hydroxyphenylsulfonyl)phenol represented by chemical formula (S2) shown below with 4,4?-dichlorodiphenylsulfone represented by chemical formula (S3) shown below. wherein hydrogen atoms in phenylene groups in formula (S1), formula (S2) and formula (S3) may be each independently substituted with an alkyl group, an aryl group or a halogen atom.

Abstract: Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.

Abstract: The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 ?m or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.

Abstract: This base proliferating agent is represented by formula (1) or (2), where, in formula (1) and (2), R1, R2, and R3 independently represent a hydrogen atom or a substituent and n independently represents an integer from 1 to 4. A base-reactive resin composition can include this base proliferating agent and a base-reactive compound.

Abstract: A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.

Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

Abstract: A thermoset precursor composition includes a backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain, and at least one of: an epoxy group terminating the backbone or an aldehyde group terminating the backbone. The thermoset precursor can have at least two epoxy groups, one epoxy group and one aldehyde group, or two aldehyde groups.

Abstract: Provided are methods for the purification of polymer solutions. In particular, the method enables the separation of impurities from an oxazoline polymer solution by raising the temperature of the polymer solution above its lower critical solution temperature (LCST), wherein a water rich phase and a polymer rich phase separation occurs. The phases are then separated with the polymer rich phase containing a lower amount of impurities than before separation.

Abstract: A reactive amine accelerator is prepared by reacting a primary or secondary aromatic amine with a diglycidyl ether and an ?,?-unsaturated carboxylic acid. The reactive amine accelerator can be used in a reactive resin, in particular based on an epoxy (meth)acrylate resin or a urethane (meth)acrylate resin. A reactive resin composition, in particular based on epoxy (meth)acrylate resin and urethane (meth)acrylate resin, which has an amine accelerator is useful. The amine accelerator is covalently incorporated into the polymer network.

Abstract: The embodiments relate to a polyamide-based composite film that not only has excellent curl characteristics, mechanical properties, and optical properties, but also exhibits a privacy protection effect at a wide angle of view and glossiness characteristics similar to those glass at a main angle of view, and to a display device comprising the same. There are provided a polyamide-based composite film that comprises a base film comprising a polyamide-based polymer; and a functional layer disposed on the base film, wherein a glossiness control value according to Equation 1 is 0 or more, and a displace device comprising the same.

Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Abstract: In some aspects, the present disclosure pertains to a multi-arm polymer comprising a core and a plurality of polyoxazoline segments (or arms) having a first end that is covalently attached to the core and a second end comprising a moiety that comprises a reactive group. In some aspects, systems are provided that comprise a first composition comprising such a multi-arm polymer and a second composition comprising a multifunctional compound that comprises functional groups that are reactive with the reactive groups of the multi-arm polymer. In some aspects, systems are provided that comprise crosslinked reaction products of such a multi-arm polymer and such a multifunctional compound.

Abstract: Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

Abstract: A curable green epoxy resin composition is described. More particularly, the curable green epoxy resin composition includes a biobinder isolated from bio-oil produced from animal waste, such as from swine manure. The biobinder can act as a curing agent for an epoxy resin component in the resin composition. Cured green epoxy resins, prepregs containing the curable green epoxy resin, and related composite materials are described. In addition, methods of preparing the curable green epoxy resin composition and of curing the curable green epoxy resin.

Abstract: An epoxy resin adhesive including at least one epoxy resin in the resin component, at least one adduct AD including primary amino groups which is free-flowing at room temperature and is formed from (i) at least one polyepoxide and (ii) at least one amine of the formula (I) and optionally further amines, and additionally at least one accelerator B having at least one dimethylamino group in the hardener component, and a total of at least 50% by weight of at least one inorganic filler. The epoxy resin adhesive has low odor and good processibility, rapidly builds up strength at room temperature and under cold conditions and, after curing, has high strengths, especially particularly high compressive strengths, and high bonding forces to substrates such as steel, carbon fiber composites (CRP) and concrete.

Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) wherein substituents R? and R? independently of one another are H or CH3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula where R2= or CH2, R1=H or methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.

Abstract: A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.