Abstract: A high-performance triple-crosslinked polymer and a preparation method thereof are provided. The polymer is obtained by curing and cross-linking a monomer having two epoxy groups, a cross-linking monomer and a functional monomer. The polymer contains a cross-linking network formed by covalent bonds and two types of multi-level hydrogen bonds with different strengths. The interaction strength between the covalent bonds and the two types of hydrogen bonds decreases in a gradient. The dilemma of the strength-ductility tradeoff in a high-performance polymer is overcome by forming a triple-crosslinked network with covalent bonds and multi-level hydrogen bonds with different strengths in the polymer. The dynamic and hierarchical hydrogen bonds are broken and recombined timely and continuously to concurrently maintain the complete structure of the polymer network and enable the polymer network to quickly respond to the transmission and dissipation of the external environment.

Abstract: The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Abstract: The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 ?m or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

Abstract: An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa·s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

Abstract: The present invention provides benzylated triaminononane compounds, epoxy curing agent compositions comprising benzylated triaminononane compounds and methods of making such compositions. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Abstract: A one-component thermosetting epoxy resin composition, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; c) at least one physical or chemical blowing agent BA; d) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR1 with a Mooney Viscosity of 15-30 MU (Mooney units), based on the total amount of epoxy resin A; and e) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR2 with a Mooney Viscosity of 35-50 MU (Mooney units), based on the total amount of epoxy resin A. The ratio of ABR1 to ABR2 is from 0.5-2.0. The epoxy resin adhesive is notable for the improved storage stability.

Abstract: Discussed is a method for manufacturing a touch device, the method including forming a protective layer per touch sensor on first and second surfaces of a mother substrate on which two or more touch sensors are formed; dividing the mother substrate into two or more substrates of a touch sensor unit by mechanically cutting or chemically treating the mother substrate; chemically strengthening an edge of each of the divided substrates; and removing the protective layer from at least one divided substrate.

Abstract: Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0° C. or more before its curing.

Abstract: A rubber-metal adhesion promoter characterized by including: a metal salt (1) of a carboxylic acid which is a metal salt of an aliphatic carboxylic acid having 2 to 25 carbon atoms and in which the metal is bismuth, copper, antimony, silver or niobium; or a compound (2) represented by the following general formula (A): [wherein Z represents a structure selected from the following formulae (z-1) to (z-4); M represents bismuth, copper, antimony, silver or niobium; (RCOO) represents a residue of an aliphatic carboxylic acid having 2 to 25 carbon atoms; and x represents the valence of M minus 1].

Abstract: An object is to provide an epoxy resin composition which exhibits excellent tracking resistance and additionally has excellent heat resistance with a Tg of 200° C. or higher and flame retardancy. Provided is an epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8%, wherein the phosphorus-containing epoxy resin has a ratio (L/H) of 0.6 to 4.0 of the content of trinuclear bodies (L) to the content of hepta or higher nuclear bodies (H) measured by GPC, and is a product obtained from a novolac epoxy resin having an average number of functional groups (Mn/E) of 3.8 to 4.8 and a phosphorus compound represented by the following general formula (1) and/or general formula (2).

Abstract: Random copolymers, crosslinked thin films of the random copolymers and cell culture substrates comprising the crosslinked thin films are provided. Also provided are methods of making and using the copolymers, thin films and substrates. The copolymers are polymerized from glycidyl methacrylate monomers and vinyl azlactone monomers. The crosslinked thin films are substrate independent, in that they need not be covalently bound to a substrate to form a stable film on the substrate surface.

Abstract: A rosin-modified resin having a structural unit (ab) derived from a compound obtained by addition of an ?,?-unsaturated carboxylic acid or acid anhydride thereof (B) to a conjugated rosin acid (A), a structural unit (c) derived from an organic monobasic acid (C) excluding the conjugated rosin acid (A), a structural unit (d) derived from an aliphatic polybasic acid anhydride (D), and a structural unit (e) derived from a polyol (E), wherein the weight ratio between the structural unit (ab) and the structural unit (c) is within a range from 100:80 to 100:350.

Abstract: Resins are provided including bisphenol M diphthalonitrile ether resin or bisphenol P diphthalonitrile either resin. Compositions are also provided, including a primary amine curative and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. Further, polymerized products are provided of the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. In addition, a method of making a polymerized network is provided. A two component system is further provided, including a curative in one of the components and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin in the other component. In addition, a resin blend is provided, including a blend of at least two of bisphenol M diphthalonitrile ether resin, bisphenol P diphthalonitrile either resin, or bisphenol T diphthalonitrile ether resin.

Abstract: This base proliferating agent is represented by formula (1) or (2), where, in formula (1) and (2), R1, R2, and R3 independently represent a hydrogen atom or a substituent and n independently represents an integer from 1 to 4. A base-reactive resin composition can include this base proliferating agent and a base-reactive compound.

Abstract: A sheet molding compound includes an epoxy resin composition meeting (I) and/or (II): (I) a component has a hydroxy group equivalent weight of 20 to 120, and (II) carbon fibers are bundle-shaped aggregates of discontinuous carbon fibers such that in a plane that has a largest width perpendicular to an alignment direction of the carbon fibers, two acute angles, referred to as angle a and angle b, formed between the alignment direction of the carbon fibers and sides formed by arrays of both ends of the carbon fibers in the bundle-shaped aggregates are 2° or more and 30° or less, the epoxy resin composition has a viscosity at 30° C. of 3.0×104 Pa·s or more and 1.0×106 Pa·s or less, and the epoxy resin composition has a viscosity at 120° C. of 1.0×102 Pa·s or more and 5.0×103 Pa·s or less.

Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Abstract: An epoxy resin composition contains components (A)-(C), and satisfies the expressions below: Component (A): an aliphatic epoxy resin having one hydroxyl group and two to three epoxy groups in one molecule; Component (B): an aliphatic epoxy resin having no hydroxyl group and three epoxy groups in one molecule; Component (C): a polyisocyanate compound; 0.125?A/B?3; and 0.2<(A+B)/T?0.8 (A: parts by mass of component (A), B: parts by mass of component (B), and T: total parts by mass of the epoxy resins in the epoxy resin composition).

Abstract: A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.