Abstract: The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), R1 to R18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).

Abstract: Degradable hyperbranched epoxy resin and a preparation method thereof, wherein the preparation method comprises carrying out a reaction between a cyclotriazine compound and a carboxyl-sourced compound to prepare a carboxyl-terminated or hydroxy-terminated hyperbranched polymer; then reacting with epoxy chloropropane to obtain a degradable hyperbranched epoxy resin of which the molecular weight is about 1,900-22,000 g/mol. After the degradable hyperbranched epoxy resin is cured, a cyclotriazine structure can be completely degraded within 2 h in a phosphoric acid solution at the temperature of 80° C., thus realizing the recycle of the epoxy resin. The invention has simple process, and the product is degradable and has self-strengthening and self-toughening functions, and is expected to be used in the fields of strengthening and toughening of epoxy resins, solvent-free coatings etc.

Abstract: Isocyanate-modified polyester-epoxide polymer (i-PEEP) compositions are disclosed. The i-PEEP compositions comprise a reaction product of a polyepoxide compound, a polyisocyanate, and a polyester polyol composition. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.2 to 2. The i-PEEP index as defined herein is within the range of 100 to 200. The i-PEEP composition has a Tg within the range of ?30° C. to 35° C. Low- and elevated-temperature processes catalyzed by bases or Lewis acids for making the i-PEEP compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for coatings, elastomers, adhesives, sealants, and other valuable products is assembled from readily available starting materials without reliance on the polyamines typically used to cure epoxy systems.

Abstract: A latex of a carboxyl group-containing nitrile rubber contains an ?,?-ethylenically unsaturated nitrile monomer unit in a content of 8 to 60 wt % and having an iodine value of 120 or less, wherein the total content of potassium and sodium contained in the latex is 2,300 to 10,000 ppm by weight with respect to the whole latex.

Abstract: An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.

Abstract: A component comprises a first part and a second part, wherein said second part is in contact with said first part, wherein: (i) said first part comprises a polymer having a repeat unit of formula —O-Ph-O-Ph-CO-Ph-??I and a repeat unit of formula —O-Ph-Ph-O-Ph-CO-Ph??II wherein Ph represents a phenylene moiety; and (ii) said second part comprises a metal.

Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

Abstract: The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.

Abstract: A toughened epoxy resin composition includes an end-capped polyalkylene oxide (A), an epoxy resin (B), an epoxy curing agent (C), and a core shell polymer (D). The end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000, and 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group. A weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10. The core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight and the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer.

Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

Abstract: A method for producing a polymer latex, including an emulsification step of emulsifying a polymer solution obtained by dissolution of synthetic polyisoprene and/or a styrene-isoprene-styrene block copolymer having a molecular weight distribution of 1.0 to 2.6 in an organic solvent, in water in the presence of a surfactant, to thereby obtain an emulsified liquid, wherein as the synthetic polyisoprene and/or styrene-isoprene-styrene block copolymer, used are/is synthetic polyisoprene and/or a styrene-isoprene-styrene block copolymer which, when dissolved in an organic solvent to thereby be formed into a polymer solution having a viscosity at a temperature of 60° C. of 20,000 cps, have/has a solid content concentration in the range of 10 to 60% by weight.

Abstract: Compositions (120), which may be in the form of flexible films, molded bodies, or printable inks, can incorporate ceramic particles (122) comprising titanium monoxide (TiO) for purposes of electromagnetic interference (EMI) shielding at megahertz through gigahertz frequencies. One or more additional ceramic particles can also be included. The compositions comprise a composite material (120) which includes the ceramic particles (122) dispersed within a matrix material (121), such as a polymer. Methods associated with such compositions are also described.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

Abstract: A thermoplastic aromatic polysulfone is obtained by polymerizing a dihalogeno compound (A) and a dihydric phenol (B). The ratio (Mw/Mn) between a number average molecular weight (Mn) and a weight average molecular weight (Mw) is at least 1.91, and the number average molecular weight (Mn) is at least 6,000 and less than 14,000, In (A) and (B), each of X and X? independently represents a halogen atom; each of R1, R2, R3 and R4 independently represents an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; each of n1, n2, n3 and n4 independently represents an integer of 0 to 4; and when n1, n2, n3 or n4 is an integer of 2 to 4, a plurality of R1, R2, R3 or R4 groups may be the same or different from each other.

Abstract: The present invention relates to the polyamines N,N?-diaminopropyl-2-methyl-cyclohexane-1,3-diamine and N,N?-diaminopropyl-4-methyl-cyclohexane-1,3-diamine and mixtures thereof, to the use thereof as curing agents for epoxy resin and to a curable composition comprising epoxy resin and these polyamines. Even at low temperatures this curing agent/the corresponding curable composition cures rapidly and is early-stage water resistant and is thus especially suitable for floor coatings. The invention further relates to the curing of this composition and the cured epoxy resin obtained by curing of this composition.

Abstract: Provided are a tow prepreg comprising a reinforcing fiber bundle impregnated with a matrix resin composition, wherein the matrix resin composition contains a component (A) (an epoxy resin), a component (B) (dicyandiamide), a component (C) (a curing accelerator), and a component (D) (a core-shell type rubber particle), and a content of the component (D) with respect to 100 parts by mass of the component (A) is from 20 to 70 parts by mass, a viscosity is from 3 Pa·s to 80 Pa·s at 30° C., and a minimum viscosity to be obtained when a viscosity is measured by raising a temperature from room temperature to 130° C. at a rate of temperature rise of 2.0° C./min is from 0.04 Pa·s to 1 Pa·s, which exhibits excellent drape property and tackiness and less stickiness and can be unwound at a high speed; and a composite material-reinforced pressure vessel having fewer voids in a reinforcing layer which is obtainable by using the tow prepreg, a high burst pressure, and an excellent appearance due to appropriate resin flow.

Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.

Abstract: A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.