Abstract: Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.

Abstract: Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract: An electronic device includes a housing and a functional module received in the housing. The housing includes a bottom wall, two sidewalls extending from opposite sides of the bottom wall, and two connecting walls. Each of the connecting walls extends from an edge of each sidewall away from the bottom wall and bends towards to the other of the connecting walls. The bottom wall, the sidewalls and the connecting walls cooperatively form a receiving space having at least one opening. The functional module includes a fixing frame positioned adjacent to the bottom wall, a circuit board positioned on the fixing frame, and a display panel positioned on circuit board away from the fixing frame and electrically connected with the circuit board. The fixing frame is capable of being slidably pushed into the housing via the at least one opening together with the circuit board and the display panel.

Abstract: A cooling system for an electronics chassis includes a plurality of centrifugal blowers arranged to motivate cooling air through the electronics chassis. The centrifugal blowers are arranged in one or more sets, each having blowers oriented with respective inlets in mutual facing relationship. The orientation, positioning, and alignment of the centrifugal blowers facilitates a compact arrangement of the plurality of blowers that achieves increased aerodynamic efficiencies to reduce noise output and energy consumption.

Abstract: An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.

Abstract: A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.

Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.

Abstract: An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.

Abstract: Systems and methods that allow for weight and size reduction of electronics components, such as transformer rectifier units (TRUs) or autotransformer rectifier units (ATRUs), by providing a fluid cooling system is utilized to provide high heat dissipation for a transformer assembly of TRUs or ATRUs by providing a thermal interface at the windings of the transformer assembly, which are the hottest spots in such assemblies. The cooling system may include a fluid-cooled winding heat sink element or “finger,” which may be a thermally conductive bar (e.g., aluminum, copper) having microchannels therein positioned between the core and windings of a transformer or between turns of the windings of a transformer. Fluid passes through the microchannels of the heat sink element to provide direct cooling to the heat generating windings of the transformers. The heat sink element may be produced by an additive manufacturing technology.

Abstract: A folding portable keyboard includes a first keyboard section, a second keyboard section, and a folding structure. The first keyboard section and the second keyboard section are coplanar with each other when the portable keyboard is unfolded, or overlap each other when the portable keyboard is folded. The folding structure includes a rotary assembly having a first sleeve, a second sleeve, and a pivot. The first sleeve is defined on a first sidewall of the first keyboard section. The second sleeve is defined on a second sidewall of the second keyboard section. The pivot is sleeved by the first sleeve and the second sleeve. The first sleeve and the second sleeve are capable of rotating relative to each other about the pivot until the first keyboard section overlaps the second keyboard section.

Abstract: Attenuation systems have cooling components that produce power in response to heat generated by the attenuator. The cooling components can be used to power cooling fans if a primary power source of the fans fails.

Abstract: An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.

Abstract: An apparatus may include an electrical component body, where the electrical component body is operative to vary power during operation. The apparatus may also include a thermal component in contact with at least a portion of the electrical component body, in which the thermal component comprises a matrix material, and a thermal energy storage material embedded in the matrix material to absorb heat generated by the electrical component body. Other embodiments are disclosed and claimed.

Abstract: An electronic device includes a server unit, a storage apparatus, and a heat dissipation apparatus. The server unit includes a bottom plate defining a first air inlet. The heat dissipation apparatus includes an exhaust fan located above the bottom plate and an air adjusting member. The exhaust fan includes a second air inlet aligning with the first air inlet. The adjusting member is slidably located between the first air inlet and the second air inlet. The bottom plate and the storage apparatus cooperatively bound an airflow channel communicating with the first air inlet. The second air inlet is partitioned into a first air inlet communicating with the airflow channel and a second air inlet communicating with the server unit by the air adjusting member. The air adjusting member is operated to slide to change sizes of the first air inlet and the second air inlet.

Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

Abstract: A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.

Abstract: A gas insulated switchgear includes a transformer mounting body; a bushing mounted on the transformer mounting body; and a main circuit conductor. The main circuit conductor includes a first main circuit conductor which is connected to a circuit breaker and is located in the bushing and a second main circuit conductor which is connected to the first main circuit conductor. An insulator extends below the lower end of the transformer mounting body and toward the vicinity of the connection between the first main circuit conductor and the second main circuit conductor, in a region where the first main circuit conductor is located in the transformer mounting body. A ground shield is arranged in the insulator, and extends below the lower end of the transformer mounting body and above a coupling portion between the transformer mounting body and the bushing.

Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.

Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Abstract: A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.