Abstract: A Mobile Soft Duct System includes a soft duct that can be extended and retracted along a track to deliver an air supply to various locations. A vent attached to a part of the soft duct system can include a flow control element that can be adjusted to direct air to a target location. Managing a soft duct system can include monitoring an environment to detect temperature hotspots and configuring the soft duct system, in response to detection of a hotspot at a particular location, to deliver air to the particular location to mitigate the hotspot. Configuring the soft duct system can include extending the soft duct along the track and adjusting a flow control element in a vent to direct air to the particular location. Soft duct system management can be implemented by one or more computer systems.

Abstract: Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: An immersion cooling tank comprises: a dielectric liquid disposed within a lower volume of the tank; at least one electronic equipment immersed within the dielectric liquid and which requires electrical power to operate; and at least one power distribution unit and/or a bus bar distribution system submerged beneath a surface of the dielectric liquid and providing electrical power to the at least one electronic equipment. The immersion cooling tank further includes a condenser located vertically above the dielectric fluid and the at least one electronic equipment, and through which is flowing a condensation fluid that has a lower density than the dielectric liquid. A leak of the condensation fluid into the tank volume results in the condensation fluid floating atop the dielectric liquid and prevents the condensation liquid from coming into contact with the power distribution unit. The bus bar distribution system enables blind mating of inserted electronic components.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system.

Abstract: A heat dissipation case is used to dissipate heat of electronic equipment and contains: a body. The body includes a receiving chamber for receiving electronic equipment and a dissipation groove defined thereon and corresponding to the receiving chamber, wherein the metal plate and the dissipating piece are stacked in the dissipation groove, and electronic equipment is received in the receiving chamber and contacts with the dissipating piece so as to dissipates heat of the electronic equipment. The metal plate has a peripheral side retained in the body. The peripheral side of the metal plate extends into the metal plate completely, and an area of the metal plate is larger than that of the dissipating piece.

Abstract: Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules having an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed.

Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.

Abstract: A gas insulated switchgear includes a support frame, a first fixed conductor being installed on one side of the support frame, a second fixed conductor opposing the first fixed conductor and being installed on another side of the support frame, a screw forming an axis on inner of the support frame and being spaced apart from the first and second fixed conductor, a first movable contact wherein one side of the first movable contact is bent and another side of the first movable contact moves along the axis through a rotation of the screw and a second movable contact wherein one side of the second movable contact is bent and another side of the second movable contact is move along the axis through a rotation of the screw.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A container data center includes a container, a row of racks installed in the container, an air conditioner, and a heat insulation apparatus. A cool channel and a heat channel are defined at two opposite sides of the row of racks. The removable heat insulation apparatus divides the cool channel into a first space and a small second next to the racks, and maintains the cooled air in the second space. Cooled air from the air conditioner is fed into the second space air conditioner, flows through the racks to remove heat generated, and enters the heat channel.

Abstract: In accordance with one embodiment, a gateway node having a housing, a bracket mounted relay and wireless communication capabilities. The gateway node is connected to a pad mount transformer.

Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

Abstract: Jet impingement and two-phase cooling apparatuses with sloped vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface having one or more jet orifices fluidly coupled to the fluid inlet channel such that coolant fluid within the fluid inlet channel flows through the one or more jet orifices as one or more impingement jets, and a target surface. The target surface and the jet orifice surface define an impingement chamber where the one or more impingement jets impinge the target surface at an impingement region such that at least some of the coolant fluid changes to a vapor. The cooling apparatus further includes a plurality of sloped vapor outlet channels that are fluidly coupled to the impingement chamber. Coolant fluid flows through the plurality of sloped vapor outlet channels after it impinges the target surface.

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract: An organic electroluminescence display module includes a display panel including a display region and a pad region, a mold frame supporting the display panel and including a recess in a region corresponding to the pad region, and an accommodation guide hole in an edge of the recess, a driving integrated circuit chip disposed between the display panel and the accommodation guide hole, and a cover installed over the recess, a metal member being inserted in the cover. A portion of the metal member contacts the driving integrated circuit chip, and another portion of the metal member is exposed to an outside of the organic electroluminescence display module.

Abstract: An electrical switching apparatus for housing a pair of opposing circuit breakers each circuit breaker of the pair of opposing circuit breakers having an opposing end face including an exhaust vent disposed thereon is disclosed. The electrical switching apparatus includes a panelboard to operatively support the pair of opposing circuit breakers to define a gap therebetween, and an insulative barrier to be operatively disposed in the gap. The insulative barrier includes a first cantilever wall member arrangeable to define a first plenum region having a first cross sectional area, and a second plenum region having a second cross sectional area. The insulative barrier is operative to deflect in a first direction to thereby increase one of the first and second cross sectional areas in response to a venting of ionized gases from one circuit breaker of the pair of circuit breakers.

Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Abstract: According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface.