Patents Examined by Michail V Datskovskiy
-
Patent number: 9086069Abstract: Cooling apparatuses, electronic device assemblies, and cooling assemblies having a magnetic shape memory member are disclosed. In one embodiment, a cooling apparatus includes a first compliant member, a magnetic shape memory member, a magnetic field generating device, a second compliant member and a fan member. A first end of the magnetic shape memory member is coupled to the first compliant member. The magnetic field generating device is positioned proximate the magnetic shape memory member, and generates a magnetic field toward the magnetic shape memory member to cause the magnetic shape memory member to expand along a linear translation axis. Expansion of the magnetic shape memory member causes an actuated portion of the second compliant member to translate about an axis. The fan member is coupled to the actuated portion of the compliant member such that translation of the actuated portion translates the fan member.Type: GrantFiled: February 21, 2014Date of Patent: July 21, 2015Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventor: Ercan Mehmet Dede
-
Patent number: 9084369Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.Type: GrantFiled: May 19, 2014Date of Patent: July 14, 2015Assignee: Chatsworth Products, Inc.Inventors: Richard Evans Lewis, II, Dennis W. Vanlith
-
Patent number: 9080820Abstract: The disclosure herein provides for heat dissipation switches and systems, as well as their use for dissipating excess heat from a heat source. Various aspects of a heat dissipation switch may include a thermally isolating material having a number of conductive element cavities. A number of thermally switched conductive elements may nest within the conductive element cavities either independently or as part of a thermally switched sheet. The material of the thermally switched conductive elements may be configured to deform in response to a temperature change through a threshold temperature or temperature range in order to create or interrupt heat flow paths from the heat source to a heat sink.Type: GrantFiled: May 22, 2012Date of Patent: July 14, 2015Assignee: The Boeing CompanyInventor: Douglas Aaron Bolton
-
Patent number: 9076769Abstract: An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.Type: GrantFiled: May 9, 2012Date of Patent: July 7, 2015Assignee: Foxconn Technology Co., Ltd.Inventor: Chin-Hsien Chen
-
Patent number: 9077160Abstract: An enclosure is for electrical distribution equipment including a number of inverters and alternating current distribution components. The enclosure includes: a first side; a second side adjacent to the first side; a third side adjacent to the second side; a fourth side adjacent to the first side and the third side; a top portion; a bottom portion; a number of first access panels installed on one of the first through fourth sides, the number of first access panels being configured to open to provide access to the number of inverters; and a second access panel installed on one of the first through fourth sides, the second access panel being configured to open to provide access to the alternating current distribution components.Type: GrantFiled: March 4, 2013Date of Patent: July 7, 2015Assignee: EATON CORPORATIONInventors: Matthew Michael Valencic, David Allen Bajzel, Jeremy Ryan Novotney, Jonathan Keller Hamilton, Paul David Seff, Samuel Gonzalez
-
Patent number: 9075570Abstract: A protective case with multiple air tunnels for the protective case, so the heat absorbed by contact blocks from the electronic equipment is radiated rapidly out of the protective case through vent pipes. When the electronic equipment is supported up to watch movie or play games, because the hot air will raise and be exhausted from the upper part, and the fresh cool air will come inside from lower part of the protective case, as a result, the ventilation is accelerated and the heat dissipation performance is greatly improved.Type: GrantFiled: July 30, 2013Date of Patent: July 7, 2015Inventor: Luhui Yuan
-
Patent number: 9075584Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.Type: GrantFiled: December 9, 2013Date of Patent: July 7, 2015Assignee: INTEL CORPORATIONInventors: Mark MacDonald, Shawn S. McEuen
-
Patent number: 9068784Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.Type: GrantFiled: November 15, 2012Date of Patent: June 30, 2015Assignee: International Business Machines CorporationInventors: Aaron R. Cox, William J. Grady, V, Jason A. Matteson, Jason E. Minyard
-
Patent number: 9072197Abstract: A cooling apparatus includes a case in which a refrigerant passage through which a refrigerant flows is formed inside, and an element module partially disposed within the refrigerant passage and including an element provided inside. A portion of the element module in contact with the refrigerant is formed of an insulating material.Type: GrantFiled: March 10, 2011Date of Patent: June 30, 2015Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Takahito Murata
-
Patent number: 9072202Abstract: In one embodiment, a filter cleaning system and method pertain to, during a filter cleaning operation, reversing a flow direction of an inlet fan associated with a filter of the electrical device, the inlet fan being adapted to force air into a housing of the electrical device during normal operation of the electrical device, and reversing a flow direction of an outlet fan adapted to draw air out from the electrical device housing during normal operation of the electrical device so as to increase pressure within the electrical device housing during the filter cleaning operation, wherein the combined action of the reversed inlet fan and the reversed outlet fan purges particulate matter from the filter.Type: GrantFiled: October 12, 2007Date of Patent: June 30, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventor: Kirk P. Gipson
-
Patent number: 9072195Abstract: A simple configuration for cooling comprises a front-back air supply and exhaust system. A first circuit board is located in front of a relay circuit board. A cooling unit and a second circuit board are placed behind the relay circuit board in a chassis. A first air passage allows intake air through an intake hole in a front side of the first circuit board unit to pass through the first circuit board and then through an opening in the relay circuit board to the cooling unit. A second air passage allows intake air through an intake hole in a front face of the chassis to pass through a lateral side of the first circuit board and then through a vent hole in a partition provided at the lateral side of the first circuit board. The second circuit board is placed in the second air passage.Type: GrantFiled: March 6, 2013Date of Patent: June 30, 2015Assignee: Alaxala Networks CorporationInventors: Shuuji Kameno, Tooru Sasaki, Manabu Sawa, Satoshi Shimada
-
Patent number: 9066454Abstract: The invention relates to an inverter with an enclosure that includes a removable hand plug which, when inserted inside the enclosure, shares an electrical connection with the inverter. The hand plug includes a fan configured to cool at least a portion of the inverter enclosure.Type: GrantFiled: March 14, 2012Date of Patent: June 23, 2015Assignee: SMA Solar Technology AGInventors: Andreas Donth, Thorsten Hobein, Bernd Gebert
-
Patent number: 9066452Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack, and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.Type: GrantFiled: October 23, 2013Date of Patent: June 23, 2015Assignee: BULL SASInventors: Audrey Julien-Roux, Lionel Coutancier, Thierry Fromont
-
Patent number: 9066453Abstract: A power electronic system including a casing encapsulating a circuit board and multiple power electronic components mounted to a first broad face of the circuit board. The casing includes a case body, a first lid, and a second lid. The case body includes a cooling channel region including a cooling plate having a first and second broad face, cooling features extending from the cooling plate first broad face, and a cooling block extending from the cooling plate second broad face. The case body further includes a first access gap defined through the case body. The circuit board is mounted to the casing with the first broad face proximal the cooling plate second broad face. The power electronic system additionally includes a connector that extends from the case exterior to connect to the circuit board first broad face, wherein connector connection is facilitated by the first access gap.Type: GrantFiled: March 6, 2013Date of Patent: June 23, 2015Assignee: Mission Motor CompanyInventors: Jon Wagner, Geoff Nichols
-
Patent number: 9065317Abstract: A fixing structure for an electrical component includes a heat removing member for removing heat from the electrical component. The heat removing member has a receiving portion for receiving the electrical component. The fixing structure for an electrical component further includes a separation member that is coupled to the electrical component to separate the electrical component from the heat removing member. The separation member is coupled to the heat removing member. The fixing structure for an electrical component includes a soft material member that is accommodated in the receiving portion to contact the receiving portion and the electrical component. Heat of the electrical component is transmitted to the heat removing member via the soft material member.Type: GrantFiled: January 4, 2012Date of Patent: June 23, 2015Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Shingo Enami, Ken Suitou, Yusuke Kinoshita
-
Patent number: 9060449Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.Type: GrantFiled: August 20, 2014Date of Patent: June 16, 2015Assignee: Facebook, Inc.Inventor: Jon Brian Ehlen
-
Patent number: 9058159Abstract: An electronic device includes an enclosure and a first air guiding duct mounted in the enclosure. The first air guiding duct includes a first part and a second part. The first part defines a first air channel and a second air channel. The second part defines a third air channel communicating with the first air channel and a fourth air channel located at a side of the second air channel. A guiding wall is located in the second air channel and extends from the second air channel to the fourth air channel. When air flows from the first part to the second part of the first air guiding duct, air flows from the first air channel to the third channel to cool a first electronic component, and flows from the second air channel to the fourth air channel by the guiding wall to cool a second electronic component.Type: GrantFiled: February 28, 2013Date of Patent: June 16, 2015Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Sheng-Hung Lee, Li-Ping Chen
-
Patent number: 9057742Abstract: The design of a functional measuring group for a medium-voltage substation has been optimized to make the product compact and robust in terms of internal arc, and also to favour complete accessibility to the measurement sensors. In particular, the voltage sensors are located in a vertical plane directly accessible via the front panel of the group, and the current sensors are located in the rear housing of the group, being directly accessible via the top of the group. In addition to being placed in an insulated compartment, the voltage sensors are insulated and shielded, and their connection terminals are designed for connection by cable with a flat interface.Type: GrantFiled: February 27, 2013Date of Patent: June 16, 2015Assignee: SCHNEIDER ELECTRIC INDUSTRIES SASInventors: Stephane Furlano, Sebastien Brunet, Frederic Toti-Buttin, Venanzio Ferraro, Somesha Somegowda
-
Patent number: 9059145Abstract: A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.Type: GrantFiled: August 21, 2012Date of Patent: June 16, 2015Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATIONInventors: Takuya Kadoguchi, Yoshikazu Suzuki, Tatsuya Miyoshi, Takanori Kawashima, Tomomi Okumura
-
Patent number: 9048636Abstract: The invention is directed to an electrical pedestal comprising an elastomeric base and housing which are configured as one piece to together define a unitary hollow enclosure for accommodating one or more electrical components.Type: GrantFiled: July 6, 2012Date of Patent: June 2, 2015Assignee: Cast-Perfect Products Inc.Inventors: Kelly Borden, Dean Ruptash