Abstract: A probe includes: a probe base body having a first end as a portion that contacts a test object in an inspection and a second end that contacts a contact point member; a covering member that covers the probe base body between the first end and the second end; and an enlarged diameter portion 6 provided at an exposed portion on the second end side of the probe base body. The probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device. The second end of the probe base body is pressed against a contact point of the contact point member by opposing force due to the pressing.

Abstract: A position signal generator for an electronic position measuring device is disclosed. In an embodiment, the position signal generator includes a signal generation device for generating a periodic magnetic signal, and an electric power supply device for supplying the signal generation device with electric energy. The position of the position signal generator is determined via the position measuring device.

Abstract: A stretchable capacitance sensor having multiple components for communicating signals to a data acquisition system for reconstructing an image of an area or object located in a subject being sensed, and for calculating the shape or conformity that it is in. The stretchable sensor consists of an inner layer of plates that provide the capacitance data, a middle layer of plates that provide the geometry-sensing data, and an outer layer of plates that serves as the shielding ground layer. The configuration of all three components can be variably changed to increase the capacitance data channels, increase or decrease flexibility and stretchability of the sensor, and increase the spatial resolution of the geometry sensing feature. The sensor is adapted to communicate signals to a data acquisition system for providing an image of the area or object between the capacitance plates.

Abstract: An inductor current measurement probe apparatus and system are described herein. In an embodiment, a system comprises a probe interconnect including a first connector that couples to a positive terminal of the inductor and a second connector that couples to a negative terminal of the inductor. The system further comprises an RC filter that is coupled to the probe interconnect and that includes at least one resistor and at least one capacitor in an arrangement that converts a voltage of the inductor to a differential capacitor voltage. The system further comprises a differential active probe input circuitry including a positive terminal and a negative terminal that are coupled to the RC filter and arranged to convert the differential capacitor voltage to a single-ended capacitor voltage. In other embodiments, the RC filter may be coupled directly to the inductor. The system may further convert the capacitor voltage to inductor current.

Abstract: An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.

Abstract: An apparatus for calibration of an electronic instrument, such as a vector network analyzer, includes a number of calibrator connector elements for connection to the instrument, and a plate element including a plurality of calibration waveguide structures. The plate element has conductive surfaces, and the calibrator connector elements and conductive surfaces include periodic structures disposed with respect to each other such that gaps are formed between them. An interface enables interconnection of a waveguide of a calibrator connector element, a waveguide of the instrument, and a calibration waveguide structure. The apparatus includes a driving unit and controller for moving the plate element and/or the calibrator connector element to connect the calibrator connector element to different calibration waveguide structures.

Abstract: This application relates to methods and apparatus for determining the location of a fault in a power cable of a power distribution network. The method involves monitoring at least one electrical parameter of the power distribution network to detect the occurrence of a fault and determine at least one time window for the occurrence of the fault The method involves analysing a first set of measurement signals is obtained by a distributed fibre optic sensor having a sensing optical fibre deployed along the path of the power cable. The first set of measurement signals include signals indicative of the extent of any disturbances along the sensing fibre over a known time period. The measurement shallots are analysed based on the at least one time window for measurement signals and the location of the fault in the power cable is identified based on the location of one or more longitudinal sensing portions of the sensing fibre.

Abstract: A motor driving device includes: an insulation resistance measuring unit configured to measure insulation resistance of a motor selected as a measurement target to thereby measure the insulation resistance of each of the multiple motors; a measurement interrupting unit configured to interrupt measurement of insulation resistance if a measurement interrupt condition is established; a storage unit configured to store information indicating the motor selected as the measurement target at the time of interruption of the measurement of insulation resistance; and a measurement resuming unit configured to, when measurement is resumed, resume measurement of the insulation resistance sequentially from the motor that had been selected as the measurement target when the measurement was interrupted, based on the information stored in the storage unit.

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

Abstract: The present invention discloses an IC test method including the following steps: generating N test patterns; testing each of M chip(s) according to the N test patterns so as to generate N×M records of quiescent DC current (IDDQ) data; generating N reference values according to the N×M records, in which each of the N reference values is generated according to M record(s) of the N×M records, and the M record(s) and the reference value generated thereupon are related to the same one of the N test patterns; obtaining a reference order of the N test patterns according to the N reference values and a sorting rule; reordering the N×M records by the reference order so as to obtain reordered N×M records; generating an IDDQ range according to the reordered N×M records; and determining whether any of the M chip(s) is defective based on the IDDQ range.

Abstract: A support guide is provided for supporting a delicate heating wire in a failure test. The support guide includes a body formed of a heat resistant, non-conductive material. The body has a threaded surface configured to receive and support the delicate heating wire in a coiled form. Also provided is a failure testing method using the heat resistant, non-conductive threaded support guide.

Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

Abstract: A defect detection device enables easy removal of magnetic impurities. The defect detection device has a structure capable of effectively removing magnetic impurities adhered to a magnetic flux leakage detection device for nondestructive inspection of a small-diameter heat transfer tube or a partially saturated eddy current detection system. With the defect detection device, it is possible to minimize adhesion of magnetic impurities that deteriorate the performance of a leakage magnetic flux detection device for nondestructive inspection of a small-diameter tube of ferromagnetic metal material or a partially saturated eddy current detection system. Further, there is an advantage in that it is possible to remove the adhered magnetic impurities from the defect detection device easily.

Abstract: Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair.

Abstract: The invention refers to a solar testing device (11) for testing a solar module (6). The solar testing device (11) comprises a test area (12) for the solar module (6) to be tested, a light emitting area (16) comprising an array of LED-modules (17, 17A) arranged opposite to the test area (12) and arranged in a pitch (P) to each other. Further the solar testing device (11) comprises sidewall mirrors (21) extending in the direction from the light emitting area (16) to the test area (12). Guides (26) are provided having each an abutting surface (27) for supporting the solar module (6) whereby the abutting surfaces (27) of the guides (26) lie in the plane (A) of the test area (12).

Abstract: A defect inspection method and a defect inspection system for a solar cell are proposed, where the method includes the following steps. Output voltages and output currents of the solar cell are measured by a measuring device. A stepwise current-voltage curve (stepwise IV curve) and a fitted current-voltage curve (fitted IV curve) are generated by a processing device according to the output voltages and the output currents, and whether a first error of the fitted IV curve is less than a first error tolerance is determined by the processing device. When the first error is not less than the first error tolerance, whether there exists at least one surge in steps of the stepwise IV curve is determined by the processing device so as to determine whether the solar cell has a defect. Next, a determined result of the processing device is outputted by the output device.

Abstract: A system and method for determining electrical stress in an electrical power system of a work vehicle. The work vehicle includes a plurality of electrical power circuits, wherein each of the electrical power circuits is operatively connected to one of a plurality of electrical devices, such as a motor. One or more controllers are each operatively connected to one or more of the plurality of devices to determine a change to an operating characteristic of the connected device. In one embodiment, a current sensor is coupled to each of the devices to sense current drawn by the device over a period of time. Each of the controllers is configured to compare the value of the sensed current to a predetermined value of current to determine a rise in temperature of the device. The determined rise in temperature is used to determine fault conditions occurring in the devices and associated wiring harnesses.

Abstract: A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.

Abstract: An inspection device includes: one chamber in which an IC device after an inspection can be arranged; another chamber in which the IC device after the inspection can be arranged and which is different from the one chamber; and a tray on which the electronic component after the inspection can be placed and which can move with the IC device from the one chamber to the another chamber. Also, the inspection device can detect at least one of humidity and temperature in the another chamber.

Abstract: A probing apparatus for detection of an electric signal generated by a device-under-test. The probing apparatus includes a rigid support structure having a contact surface for sliding contact with the device-under-test, and a probing instrument to contact the connector for tapping the electric signal. Magnets on the support structure apply attracting force on a mating metal element on the device-under-test such that the probing instrument is aligned to contact the connector, wherein a gap is formed between each magnet and mating metal element when the contact surface touches the device-under-test.