Abstract: A system for performing a direct transfer of a semiconductor device die includes a first conveyance mechanism to convey a first substrate, and a second conveyance mechanism to convey a second substrate with respect to the first substrate. The first substrate includes a first side and a second side, and the semiconductor device die is disposed on the first side of the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to a first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also includes a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

Abstract: The present invention relates to replacing conductors in a high-voltage power transfer system. The method provides, for example, a method for maintaining sections of electrically conductive phases in a three-phase power conductor line, wherein the three phases are parallel and spaced apart in an ordered sequence. The phases are strung between support structures and supported above the ground. Maintenance work, which include replacement or repair, is performed on sections of the three phases without interrupting a power load in any one of the three phases and without transposing the relative positions of the phases out of their ordered sequence.

Abstract: A stator for a rotary electric machine includes a stator coil configured such that a tip end of a conductor segment bent in a stator circumferential direction is joined to a tip end of another conductor segment in the same phase. A conductive material is exposed from the tip ends of the conductor segments, and a distance between the tip ends in different phases and adjacent to each other in the stator circumferential direction is larger than a distance between the tip ends in the same phase and adjacent to each other in the stator circumferential direction.

Abstract: A method is provided that integrates an autonomous energy harvesting capacity in a mobile device in an aesthetically neutral manner. A unique set of structural features combine to implement a hidden energy harvesting system on a surface of the mobile device body structure or casing to provide electrical power to the mobile device, and/or to individually electrically-powered components in the mobile device. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below. The layers appear opaque when observed from a light incident side, while allowing at least 50%, and as much as 80+%, of the energy impinging on the energy or incident side to pass through the layer.

Abstract: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

Abstract: An electric motor including a motor rotor and a motor stator including a stator core including a plurality of stator teeth spaced along a circumferential direction of the stator core, a plurality of coil groups, wherein each of the plurality of coil groups includes a plurality of coils wound on a corresponding stator tooth, and an incoming line terminal and an outgoing terminal both comprising a same number of coil ends, and two motor lead groups, wherein a number of the plurality of motor leads of each of the two motor lead groups is equal to a number of the plurality of coil groups, and wherein each of the plurality of motor leads is connected to one incoming line terminal or one outgoing line terminal of one corresponding coil group of the plurality of coil groups.

Abstract: To prevent the axial compressive force that acts on the rotor core from becoming unnecessarily large and to enable a high-quality magnet embedded core to be manufactured efficiently, a retaining jig (10) for a rotor core (2) including a magnet insertion hole (4) forming a through hole defining openings on end surfaces in an axial direction includes: a first plate (12) configured to contact against one of the end surfaces of the rotor core (2) and including a gate (20) configured to communicate with the corresponding opening of the magnet insertion hole (4); a second plate (14) configured to oppose another of the end surfaces of the rotor core (2); a closure member (26) coupled to the second plate (14) via a compression spring member (28) and configured to be capable of closing the opening of the magnet insertion hole (4) on the other of the end surfaces; and a coupling member (30) that couples the first plate (12) and the second plate (14) to each other such that the closure member (26) closes the opening and

Abstract: Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

Abstract: The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and form

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

Abstract: A wire harness electric wire length correcting device, which corrects a design value of an electric wire length of an electric wire included in a wire harness, includes an electric wire identifying means including an identification mark, which is attached to an end portion of the electric wire, and which is to be cut off from the electric wire when the wire harness is installed on an installation target object, so as to use the identification mark to identify which electric wire an end cut off from the electric wire has been cut off from, a measuring means for measuring a length of the cut off end, and a correcting means for, for the electric wire identified by the electric wire identifying means, correcting the design value of the electric wire length of that electric wire, based on the length of the cut off end measured by the measuring means.

Abstract: Provided are methods of making a long-term implantable electronic device, and related implantable devices, including by providing a substrate having a first encapsulation layer that covers at least a portion of the substrate, the first encapsulation layer having a receiving surface; providing one or more electronic devices on the first encapsulation layer receiving surface; and removing at least a portion of the substrate from the first encapsulation layer; thereby making the long-term implantable electronic device. Further desirable properties, including device lifetime increases during use in environments that are challenging for sensitive electronic device components, are achieved through the use of additional layers such as longevity-extending layers and/or ion-barrier layers in combination with an encapsulation layer.

Abstract: A method of manufacturing an electronic component that includes preparing unfired multilayer bodies each including main surfaces opposite to each other in a stacking direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction. One of the side surfaces of each of the unfired multilayer bodies is bonded to an adhesive sheet, and the other side surface of each of the unfired multilayer bodies is polished by rotating a polishing surface of a rotary polishing machine while contacting the other side surface. An insulating layer is formed on the polished other side surface. In the polishing of the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other thereof to form a polish groove in the length direction.

Abstract: A method for fabricating an asymmetric printed circuit board with minimized warpage. The method includes determining a first resin area and a second resin area in a stack of printed circuit board layers. The method further includes performing computer modeling to predict a warpage of the printed circuit board layers during a predicted use of the printed circuit board layers. The method further includes determining a first target coefficient of thermal expansion for the first resin area and a second target coefficient of thermal expansion for the second resin area based on the computer modeling. The method further includes differentially curing resin in the first resin area and the second resin area based on the first target coefficient of thermal expansion and the second target coefficient of thermal expansion. The method further includes forming an asymmetric printed circuit board from the stack of printed circuit board layers.

Abstract: A device for inserting electrical conductors into a machine element of an electric machine comprises a collection receptacle for providing an assembly of one or several crowns formed from electrically conductive hairpins, and an inserting device for removing the crown assembly from the collection receptacle and for introducing the crown assembly into the machine element. An associated method comprises the steps of: providing, in a collection receptacle, an assembly of one or several crowns of hairpins; removing the crown assembly from the collection receptacle; and introducing the crown assembly into the machine element which, in particular, is a stator or rotor of an electric motor.

Abstract: A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

Abstract: A method of replacing a brush holder includes positioning a handle on the brush holder while the brush holder is connected to a support, rotating the handle relative to the brush holder in a first direction that is clockwise or counter-clockwise to connect the handle to the brush holder, removing the brush holder from the support by pulling the handle with the handle attached to the brush holder, rotating the handle relative to the brush holder in a second direction that is opposite to the first direction while pulling a trigger on the handle that moves a core in the handle upward in a cavity in the handle, and removing the handle from the brush holder.

Abstract: A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.

Abstract: Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

Abstract: Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.