Patents Examined by Minh N Trinh
  • Patent number: 11404942
    Abstract: A motor stator assembly, a synchronous motor and a passenger transport device are provided by the present disclosure. The motor stator assembly includes: a stator base disposed axially around a motor drive shaft, the stator base having a receiving space and two stator end faces, and the receiving space being disposed between the two stator end faces and disposed along a circumferential outer side of the stator base; and a plurality of coil assemblies each inserted in the receiving space in a radial direction of the stator base. According to the motor stator assembly, the synchronous motor and the passenger transport device of the present disclosure, by providing a plurality of coil assemblies inserted in the stator base, the maintenance or replacement can be performed as needed, the maintenance is convenient, and less time-consuming, and also has reliable performances.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: August 2, 2022
    Assignee: OTIS ELEVATOR COMPANY
    Inventor: Lib Li
  • Patent number: 11387722
    Abstract: A manufacturing method for a rotary electric machine is equipped with an insertion roller having an outer circumferential surface configured to contact a coil lead line in such a manner that the coil lead line is inserted into accommodating grooves of an insulator, a roller support section that rotatably supports the insertion roller, and a bending unit that performs a bending process to bend the coil lead line by coming into contact with the coil lead line so as to form a terminal part.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: July 12, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Kenji Masai, Satoru Uchiumi, Takashi Yoshida, Keitaro Momosaki
  • Patent number: 11387720
    Abstract: A wave winding coil (9) has a first linear part (11a), second linear part (11b), arm part (12) and turn part (13). A retaining apparatus (1) retains the first linear part (11a) along the axis line direction between middle pins (3b, 3b) of a middle body part (3), and retains the second linear part (11b) between upper pins (2b, 2b), middle pins (3b, 3b), and lower pins (4b, 4b), in a state where sections of both ends of the second linear part (11b) in the axis line direction deviate to each other in circumferential opposite sides of the wave winding coil (9) to the axis line direction of the wave winding coil (9) and in a state where a bent angle ?b? between the second linear part (11b) and the connecting part is smaller than a bent angle ?a? between the first linear part (11a) and the connecting part.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: July 12, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Keiichiro Oka
  • Patent number: 11388848
    Abstract: A component supply device including: a stage configured such that components can be scattered on the stage; a slide device configured to slide the stage; a contacting section configured to contact the component scattered on the stage in accordance with sliding of the stage by the slide device; and a control device configured to control operation of the slide device, wherein the control device includes a determining section configured to determine whether the stage has been slid to a set position when the stage is slid towards the contacting section, and an operation control section configured to control operation of the slide device so as to, in a case in which it is determined by the determining section that the stage has not been slid to the set position, after sliding the stage in a direction away from the contacting section, once again slide the stage towards the contacting section.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: July 12, 2022
    Assignee: FUJI CORPORATION
    Inventors: Kazuma Ishikawa, Toru Matsumoto
  • Patent number: 11388821
    Abstract: A device substrate includes a core material. A capacitor sheet can be affixed adjacent to a surface of the core material, where the capacitor sheet covers the surface of the core material. A first opening can extend through both capacitor sheet and the core material, where the first opening are larger than a substrate pass through-hole. An electrically inert material can fill the first opening. A second opening can extend parallel to the first opening through the electrically inert material, where the second opening is at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: July 12, 2022
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda
  • Patent number: 11381049
    Abstract: The invention relates to a crimping pliers network (39) which comprises pressing pliers (2), an electronic control unit (31) (in particular a smartphone or a tablet) as well as a data storage device (37) (in particular a cloud storage (38)). According to the invention, a die (3, 4) of the pressing pliers (2) comprises an identifier (18, 19) which can be captured by a capturing device (21) of the pressing pliers. Data (48) from the data storage device (37) and being specific for the captured identifier (18, 19) is provided to the control unit (31). The data might be a desired pressing force curve (49), a desired pressing displacement curve (50) and/or information concerning a workpiece for which the dies (3, 4) are designated. In this way, it is possible to increase the process safety when using the crimping pliers (2). Furthermore, the invention relates to a method for pressing a workpiece.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: July 5, 2022
    Assignee: WEZAG GMBH WERKZEUGFABRIK
    Inventor: Thomas Glockseisen
  • Patent number: 11367702
    Abstract: A bonder includes a first chuck unit 1A, a second chuck unit 1B, a first base 21A, a second base 21B, and a first floating mechanism 3A. The first chuck unit 1A and the second chuck unit 1B are chuck units in a pair including respective suction surfaces for suction of bonding targets and are arranged while respective suction surfaces 11a and 11b face each other. The first base 21A and the second base 21B support the first chuck unit 1A and the second chuck unit 1B respectively. The first floating mechanism 3A applies gas pressure to a back surface 12a of the first chuck unit 1A to float the first chuck unit 1A from the first base 21A, thereby moving the suction surface 11a of the first chuck unit 1A toward the suction surface 11b of the second chuck unit 1B.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 21, 2022
    Assignee: TAZMO CO., LTD.
    Inventor: Masaaki Tanabe
  • Patent number: 11349224
    Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: May 31, 2022
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Sheng-Hung Yi, Pen-Yi Liao, Tsung-Han Wu, Po-Cheng Huang
  • Patent number: 11342256
    Abstract: A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: May 24, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Guan Huei See, Vincent Dicaprio
  • Patent number: 11335511
    Abstract: A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers arranged in a stacking direction, and two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed. The laminate has a rectangular parallelepiped configuration or shape and includes two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces. On at least one of the four surfaces, the laminate includes a protrusion in which the exposure region protrudes outward.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kotaro Kishi, Takashi Sawada
  • Patent number: 11332972
    Abstract: This invention describes an apparatus for assembling triple pane insulating glass units from a plurality of insulating spacer frames having sealant or adhesive applied to opposite sides of said spacer frames.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: May 17, 2022
    Assignee: GED Integrated Solutions, Inc.
    Inventors: William A. Briese, John Grismer, Timothy B. McGlinchy
  • Patent number: 11328843
    Abstract: A process for manufacturing finished wire and cable having reduced coefficient of friction and pulling force during installation, includes providing a payoff reel containing at least one internal conductor wire; supplying the at least one internal conductor wire from the reel to at least one extruder; providing the least one extruder, wherein the least one extruder applies an insulating material and a polymerized jacket composition over the at least one internal conductor wire, wherein the polymerized jacket composition comprises a predetermined amount by weight of nylon; a predetermined amount by weight of mineral oil in the range of 0.
    Type: Grant
    Filed: May 6, 2018
    Date of Patent: May 10, 2022
    Assignee: Encore Wire Corporation
    Inventor: William T. Bigbee, Jr.
  • Patent number: 11317520
    Abstract: A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: April 26, 2022
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Masaharu Furuyama, Daisuke Mizutani, Tomoyuki Akahoshi, Masateru Koide, Manabu Watanabe, Seigo Yamawaki, Kei Fukui
  • Patent number: 11316415
    Abstract: A method of installing a winding in a stator includes forming a first multi-conductor winding including a first plurality of terminal leads and a second plurality of terminal leads, forming a second multi-conductor winding including a third plurality of terminal leads and a fourth plurality of terminal leads, introducing the first multi-conductor winding into a plurality of stator slots of a stator body, introducing the second multi-conductor winding into the plurality of stator slots of the stator body radially inwardly of the first multi-conductor winding, and connecting the second plurality of terminal leads with the third plurality of terminal leads to form a twelve conductor stator winding.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: April 26, 2022
    Assignee: BORGWARNER INC.
    Inventor: Kirk Neet
  • Patent number: 11310921
    Abstract: A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 19, 2022
    Assignee: International Business Machines Corporation
    Inventors: Kyle Indukummar Giesen, Matteo Cocchini, Sylvain Pharand
  • Patent number: 11309776
    Abstract: A manufacturing method of a core for a rotary electric machine includes: a step of forming a stator side release hole in at least a first portion of a portion of an electric steel plate in which a slot portion is formed; a step of forming a rotor side hole portion in at least a part of a portion of the electric steel plate in which a hole portion is formed; a step of forming a flattened portion; and a step of forming a rotor plate member and a stator plate member by blanking the electric steel plate.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: April 19, 2022
    Assignee: AISIN CORPORATION
    Inventors: Masayuki Maki, Tetsuya Matsubara
  • Patent number: 11309675
    Abstract: A cable processing device includes at least one processing unit for assembling a cable and a sorting unit that can be actuated with a selection signal to output a cable received from the processing unit at least on a first side or on a second side according to the selection signal.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: April 19, 2022
    Assignee: komax Holding AG
    Inventor: Dominik Feubli
  • Patent number: 11304349
    Abstract: A method for repairing a semiconductor chip and a device for repairing a semiconductor chip is provided, and the method for repairing a semiconductor chip includes: providing a plurality of light-emitting units, and at least one of the light-emitting units being a damaged light-emitting unit; next, removing the damaged light-emitting unit to form an unoccupied position; then, using a pick and place module to obtain a good light-emitting unit from a carrier board; then, a volatile adhesive material is formed on the bottom of the good light-emitting unit; next, the volatile adhesive material is used to adhere the good light-emitting unit to the unoccupied position; finally, the good light-emitting unit is heated so that the good light-emitting unit is fixed onto the unoccupied position.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: April 12, 2022
    Assignee: ASTI GLOBAL INC., TAIWAN
    Inventor: Chien-Shou Liao
  • Patent number: 11298739
    Abstract: Provided is a method for manufacturing an iron core that enables reduction of variations in dimension of a plurality of metal plates that occur during pressing of the laminate of these metal plates. The method includes: a laminate preparation step of stacking a plurality of metal plates to prepare a laminate; a pressing step of giving a temperature gradient to the laminate and pressing the laminate with a pressing machine having a punch and a die; and a temperature-gradient removal step of removing the temperature gradient from the laminate. The pressing step gives the temperature gradient to the laminate so that the temperature rises from the punch-side to the die-side in the stacking direction of the laminate.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: April 12, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenta Shikii, Hiroshi Ishikura
  • Patent number: 11295971
    Abstract: An adsorption device includes a magnetic plate and a limiting layer. A surface of the magnetic plate includes a first region and a plurality of second regions spaced apart from each other. The first region and each second region do not overlap with each other. The first region forms a magnetic pole of the magnetic plate, and each second region forms the opposite magnetic pole of the magnetic plate. The limiting layer covers the first region. Each second region is exposed to the limiting layer and configured for adsorbing a small-scale LED as a target object.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 5, 2022
    Assignee: Century Technology (Shenzhen) Corporation Limited
    Inventors: Po-Liang Chen, Yung-Fu Lin, Hirohisa Tanaka, Yasunori Shimada