Abstract: Methods, systems, and devices for parallel access in a memory array are described. A set of memory cells of a memory device may be associated with an array of conductive structures, where such structures may be coupled using a set of transistors or other switching components that are activated by a first driver. The set of memory cells may be divided into two or more subsets of memory cells, where each subset may be associated with a respective second driver for driving access currents through memory cells of the subset. Two or more of such second drivers may operate concurrently, which may support distributing current or distributing associated circuit structures across a different footprint of the memory device than other different implementations with a single such second driver.

Abstract: The fuse device includes a plurality of fuse circuits, a global latch circuit and a plurality of local latch circuits. The global latch circuit is coupled to the fuse circuits. The global latch circuit is used to sense the blown states of the fuse circuits at different times, so as to output the fuse information of the fuse circuits at the different times. The local latch circuits are coupled to the global latch circuits. Each of these local latch circuits latches the fuse information output by the global latch circuit at the different times.

Abstract: A method for programming at least one memory cell of a plurality of memory cells included in a non-volatile memory device, the at least one memory cell including a word line and a bit line, the method including: performing a first and second program and verify operation based on a first and second condition, respectively, wherein each program and verify operation includes generating a program voltage and a bit line voltage by a voltage generator included in the non-volatile memory device and providing the program voltage and the bit line voltage to the word line and the bit line, respectively, wherein voltage levels and voltage application times of each program voltage and bit line voltage correspond to the first condition or the second condition, respectively, wherein the first condition is different from the second condition.

Abstract: A memory system includes a nonvolatile memory, and a controller including an equalizer circuit and a clock-and-data output circuit. The equalizer circuit receives a first data signal from a host via a serial communication, reduces an inter-symbol interference jitter of the first data signal to generate a second data signal, and outputs the second data signal. The clock-and-data output circuit extracts a third data signal and a clock signal from the second data signal and outputs the third data signal and the clock signal. The controller executes, when a link speed with the host is switched, a process of detecting predetermined data in the third data signal based on the first data signal received from the host, and resets a state of the clock-and-data output circuit when the predetermined data is not detected within a predetermined period of time.

Abstract: Technology for applying a positive temperature coefficient (Tco) voltage to a control terminal of a dummy select transistor. The dummy select transistor resides on a NAND string having non-volatile memory cells and a regular select transistor. The dummy select transistor is typically ON (or conductive) during memory operations such as selected string program, read, and verify. In an aspect, the positive Tco voltage is applied to the control terminal of a dummy select transistor during a program operation. Applying the positive Tco voltage during program operations reduces or eliminates program disturb to the dummy select transistor. In some aspects, the dummy select transistor is used to generate a gate induced drain leakage (GIDL) current during an erase operation. In some aspects, the dummy select transistor is a depletion mode transistor.

Abstract: A memory system may include multiple memory cells to store logical data and cycle tracking circuitry to track a number of cycles associated the memory cells. The cycles may be representative of one or more past accesses of the memory cells. The memory system may also include control circuitry to access the memory cells. Accessing of the memory cell may include a read operation, a write operation, or both. During the accessing of the memory cell, the control circuitry may determine a voltage parameter of the access based at least in part on the tracked number of cycles.

Abstract: A semiconductor storage device includes a first word line, a second word line provided in the same layer with the first word line and configured to be controlled independently from the first word line, a plurality of memory pillars between the first word line and the second word line, each of the plurality of memory pillars including a first memory cell facing to the first word line and a second memory cell facing to the second word line, the plurality of memory pillars being arranged in a first direction and a second direction intersecting to the first direction and a control circuit. The control circuit is configured to perform a write operation to the second memory cell included in the plurality of memory pillars after performing a write operation to the first memory cell included in each of the plurality of memory pillars.

Abstract: A memory device includes a plurality of memory cells, a peripheral circuit, and control logic. The peripheral circuit is configured to perform an incremental step pulse program (ISPP) on the plurality of memory cells. The control logic is configured to control the peripheral circuit to perform the ISPP using bit line voltages set based on different bit line step voltages according to a target program state of each of the plurality of memory cells among a plurality of program states.

Abstract: An integrated circuit includes: a dual port Static Random Access Memory (SRAM) cell including a plurality of transistors; a bit line pair connected to the dual port SRAM cell, the bit line pair including a first bit line and a second bit line spaced apart from each other in a first direction and extending in a second direction perpendicular to the first direction; a power line group including a plurality of power lines spaced apart from each other in the first direction, spaced apart from the bit line pair placed in the first direction, and extending in the second direction, the power line group being configured to apply a voltage to the dual-port SRAM cell; and a first word line provided between the first bit line and the second bit line and connected to the dual port SRAM cell.

Abstract: A semiconductor storage device includes first and second chips. The first chip includes a first semiconductor substrate, first conductive layers arranged in a first direction and extending in a second direction, a semiconductor column extending in the first direction and facing the first conductive layers, a first charge storage film formed between the first conductive layers and the semiconductor column, a plurality of first transistors on the first semiconductor substrate, and first bonding electrodes electrically connected to a portion of the plurality of first transistors. The second chip includes a second semiconductor substrate, a plurality of second transistors on the second semiconductor substrate, and second bonding electrodes electrically connected to a portion of the plurality of second transistors, and bonded to the first bonding electrodes.

Abstract: According to one embodiment, a memory system includes a non-volatile memory, a controller for writing data to the non-volatile memory and reading data from the non-volatile memory, and a power supply circuit. The power supply circuit includes a capacitor. The power supply circuit supplies power to the non-volatile memory and the controller from an external power supply and supplies power to the non-volatile memory and the controller from the capacitor if the external power supply is interrupted. The controller controls the power supply circuit to charge the capacitor when current consumption of the non-volatile memory is less than some first current level.

Abstract: A sense amplifier includes: an amplification circuit, configured to read data of a memory cell on a first bit line or a second bit line; and a first offset voltage storage cell and a second offset voltage storage cell, respectively and electrically connected to the amplification circuit, wherein in a case where the data in the memory cell on the first bit line is read, in an offset elimination stage of the sense amplifier, the sense amplifier is configured to store an offset voltage of the sense amplifier in the first offset voltage storage cell; and in a case where the data in the memory cell on the second bit line is read, in the offset elimination stage of the sense amplifier, the sense amplifier is configured to store the offset voltage of the sense amplifier in the second offset voltage storage cell.

Abstract: Methods, systems, and devices for efficient power scheme for redundancy are described. A memory device may include circuitry that stores memory address information related to one or more defective or unreliable memory components and that compares memory address information to memory addresses targeted for memory access operations. The memory device may selectively distribute a targeted memory address to one or more circuits within the circuitry based on whether those circuits store memory address information. Additionally or alternatively, the memory device may selectively power one or more circuits within the circuitry based on whether those circuits store memory address information.

Abstract: A method of operating a memory device that performs a plurality of program loops for a plurality of memory cells includes applying a first program pulse and a first verify pulse of a first program loop from among the plurality of program loops, counting a first off cell count by using an output based on the first verify pulse, determining a first verify skip period using the first off cell count, applying an N-th program pulse and a plurality of verify pulses in response to an end of the first verify skip period, counting a second off cell count by using an output based on the plurality of verify pulses, and determining a second verify skip period using the second off cell count.

Abstract: A memory device includes a string of series-connected memory cells, a data line, a first select transistor, a common source, a second select transistor, and a gate leakage transistor. The string of series-connected memory cells includes a vertical channel region. Each memory cell of the string of series-connected memory cells includes a first gate stack structure. The data line is connected to the vertical channel region. The first select transistor is connected between the data line and the string of series-connected memory cells. The second select transistor is connected between the common source and the string of series-connected memory cells. The gate leakage transistor is connected between the first select transistor and the second select transistor. The gate leakage transistor includes a second gate stack structure different from the first gate stack structure.

Abstract: A semiconductor device is provided which includes a first control circuit including a first transistor in a silicon substrate channel, a second control circuit provided over the first control circuit, a memory circuit provided over the second control circuit, and a global bit line and an inverted global bit line that have a function of transmitting a signal between the first control circuit and the second control circuit. The first control circuit includes a sense amplifier circuit including an input terminal and an inverted input terminal. In a first period for reading data from the memory circuit to the first control circuit, the second control circuit controls whether the global bit line and the inverted global bit line from which electric charge is discharged are charged or not in accordance with the data read from the memory circuit.

Abstract: A nonvolatile memory device includes a memory cell array, a voltage generator and a control logic circuit for programming a selected memory cell of the memory cell array to a selected word line into a first program state by controlling the voltage generator and a verify operation on the memory cell array. The control logic circuit controls a first word line voltage applied to an adjacent word line not to be programmed in the verify operation to be different from a read voltage level of a read voltage applied in a read operation of the nonvolatile memory and controls a bit line voltage applied to a bit line in the read operation. The control logic circuit controls the voltage generator to apply a plurality of different and decreasing verify voltages to the selected word line in the verify operation.

Abstract: In order to inhibit memory cells from programming and mitigate program disturb, the memory pre-charges channels of NAND strings connected to a common set of control lines by applying positive voltages to the control lines and applying voltages to a source line and bit lines connected to the NAND strings. The control lines include word lines and select lines. The word lines include an edge word line. The memory ramps down the positive voltages applied to the control lines, including ramping down control lines on a first side of the edge word line, ramping down the edge word line, and performing a staggered ramp down of three or more control lines on a second side of the edge word line. After the pre-charging, unselected NAND strings have their channel boosted to prevent programming and selected NAND strings experience programming on selected memory cells.

Abstract: A sense amplifier, a control method of the sense amplifier, and a memory are provided. The sense amplifier includes: a first power input terminal, a second power input terminal, a first switch transistor, a second switch transistor, a third switch transistor, a fourth switch transistor, a fifth switch transistor, a first negative-channel metal-oxide semiconductor (NMOS) transistor, a second NMOS transistor, a first positive-channel metal-oxide semiconductor (PMOS) transistor and a second PMOS transistor.

Abstract: A memory device may include a plurality of memory cells, a plurality of word lines, and a plurality of bit lines. The memory device may determine, when programming a first memory cell among the plurality of memory cells to a target program state, a precharge time based on a number of times that a program voltage is applied to a first word line connected to the first memory cell among the plurality of word lines, and may precharge the plurality of bit lines during the precharge time when executing a verify operation on the first memory cell.