Abstract: In the disclosed nonreciprocal circuit device, which employs a single-board-type capacitor, the problem of electrode peeling can be avoided. The nonreciprocal circuit device has characteristics such that attenuation is small in the direction of signal transmission and attenuation is large in the reverse direction and has matching capacitors disposed in signal input/output ports. The matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed each other on both main surfaces of a dielectric substrate with the substrate in between. An outer peripheral edge of a grounding electrode (or another connected electrode), to which a capacitor electrode of the single-board-type capacitor is connected, is positioned inwardly from an outer peripheral edge of the capacitor electrode.

Abstract: A variable attenuator includes a resistance region, a signal line to which the resistance region is connected, a very high frequency signal being propagated through the signal line, and a voltage applying part which applies a dc voltage across the ends of the resistance region, the dc voltage controlling a magnitude of attenuation to the very high frequency signal.

Abstract: A line coupling assembly contains a carrier plate of an electrically insulating material with first and second opposite surfaces. A first electrically conductive layer at least partially covers the first surface. A first line section is arranged on the first surface so as to be electrically insulated from the first layer. A second electrically conductive layer at least partially covers the second surface. A second line section is arranged on the second surface so as to be electrically insulated from the second layer. A line segment runs from the first surface to the second surface. First and second switches for bilateral electrical connection of the line segment to the first and second layers or to the first and second line sections are arranged on the first and the second surfaces, respectively.

Abstract: A dielectric waveguide which has a pair of dielectric substrates affixed to each other and a pair of electrically-conductive layers on the external surfaces of the two dielectric substrates. Each dielectric substrate has a projecting part that is thicker than other parts. A propagating region is formed where the projecting parts on the two opposing dielectric substrates are put together. Furthermore, a circuit is formed on the contact surface between the dielectric substrates. The circuit may include an electronic component. A part of the circuit is arranged in the propagating region so as to provide electromagnetic-field coupling between the circuit and the dielectric waveguide.

Abstract: This invention discloses a balancing circuit for providing a substantially fixed level of attenuation within a given return path frequency passband, while preventing noise related harmonics from distorting signal transmissions within the return path frequency passband. The balancing circuit includes coupling capacitors which are connected in series between input and output end nodes. A series connected inductor and capacitor pair is connected between each of the input and output end nodes and ground to form end sections. Another inductor is connected between the coupling capacitors and ground. A resistor is connected in parallel with the respective capacitor of each end section. The balancing circuit is placed in series at each subscriber port, and may be mounted on a printed circuit board and enclosed within a tubular housing with mating male and female "F" connections.

Abstract: A hermetic RF pin grid array package methodology is described that obviates the need for glass to metal feedthroughs, simplifying construction, improving reliability and reducing the cost of RF multi-chip modules. An array of cylindrical passages (13, 15) through the module's base plate (3) are aligned with and receive respective associated conductor pins (7, 9) depending from the module substrate (1). Cylindrical metal shrouds (11) are positioned within some passages (15) combine with associated pins (9) to define coaxial RF transmission lines and support for an external RF coax coupling. Unshrouded pins (7) serve to connect DC to the integrated circuit chips in the module. Waveguide interfaces, if required, are provided by conductive coupling structures patterned on the substrate, suspended over a waveguide (17) formed in or about the baseplate.

Abstract: A magnetostatic-wave device includes a dielectric substrate on which parallel first electrically conductive lines are formed. A magnetostatic-wave device formed of a gadolinium-gallium-garnet (GGG) substrate on which yttrium-iron-garnet (YIG) thin films are formed is disposed on the first electrically conductive lines. Crossed second electrically conductive lines are formed on a YIG thin film. Lands are formed at both ends of these electrically conductive lines and are connected to each other with bonding wire to form one electrically conductive line. Input and output ends are formed between both ends of this electrically conductive line and the ground.

Abstract: An active inductor which consumes less direct current (DC) power and is stably biased, has a smaller number of bias pins, a higher quality factor (Q) and fewer controlling ports, than that of the prior art, is realized in metal semiconductor field effect transistor or bipolar transistor technology. The active inductor includes an inverting amplifier of a common source (common emitter) type, which inversely amplifies an input signal and outputs the amplified signal as an output signal, a non-inverting amplifier of a common gate (common base) cascode type, which non-inversely amplifies the output signal and the amplified signal as the input signal, a capacitor connected between the input signal and a reference signal, and a biasing portion for biasing the inverting amplifier and the non-inverting amplifier.

Abstract: Disclosed is a surface mounting type isolator, which comprises: ferrite 1 having an internal magnetic field so as to render an external magnetic field unnecessary; ceramic substrate 5 into which ferrite 1 is inserted; full-surface grounding conductor 7 disposed on one surface of ceramic substrate 5; branch lines 2, 3 disposed on the other surface of ceramic substrate 5, branch lines 2,3 being connected to two input/output terminals 11, 12; connecting portion 4 disposed on ferrite 1 and connected to branch lines 2, 3; and terminating resistor 6 connected to connecting portion 4.

Abstract: An RF-signal combiner-splitter comprises a microwave cavity that is intended to mix together radio signals in the 2.0 GHz spectrum. A hollow cylindrical metal tube with a volume of a few cubic feet to a few cubic yards is closed at one end and open at the other. Many RF-ports into the microwave cavity are provided at random positions that penetrate the hollow cylindrical metal tube. For example BNC-type bulkhead connectors with 10 dB attenuator pads are used with a 2 to 3 inch whip antenna inside the cavity volume. The attenuator pads brute-force an impedance match between the radio equipment under test and their corresponding RF-ports. The open end of the hollow cylindrical metal tube allows for the quick decay of RF-reflections that reverberate inside the cavity volume. Such open end is preferably directed toward nadir because interfering signals are generally minimum from that direction.

Abstract: An apparatus for inhibiting cross talk under a difference mode is disclosed, in which undesired cross talk due to the adjacency and non-uniformness of the untwisted portion are eliminated when untwisting the UTP (unshielded twisted pair) cables to insert the UTP cables into plug holes. In four pairs which are liable to generate cross talk due to their adjacency, artificial patterns are disposed on the front and rear faces of a PCB in such a manner that an effect the same as an insertion of a spiral capacitor should be produced, so that the cross talk in the interfering lines would meet the regulated value. In arranging a plurality of transmission lines to improve the radio wave transmission performance, the four pairs of the lines are disposed on the front and rear faces of the PCB more specifically, spiral capacitors are disposed as follows. A third line is disposed on the rear of a first line, a fifth line is disposed on the rear of a third line, and an eighth line is disposed on the rear of a sixth line.

Abstract: An electrically controllable impedance matching device for matching an impedance of a signal output from a signal generator in an RF (Radio Frequency) amplifier. The impedance matching device includes a 3-dB directional coupler having a coupling terminal, a through terminal, an isolation terminal being an output terminal, and an input terminal connected to the signal generator; a first phase shifter connected to the coupling terminal, for shifting a phase of the signal according to a control signal; a second phase shifter connected to the through terminal, for shifting the phase of the signal according to the control signal; and controller for generating the control signal.

Abstract: A non-reciprocal circuit device has a plurality of central conductors arranged so as to intersect mutually on a magnetic substance to which a d.c. magnetic field is applied, and matching capacitors connected between the ports of the central conductors and ground. In the non-reciprocal circuit device an inductor is connected between at least one port of the central conductor and the signal-input/output terminal corresponding thereto, to modify the frequency response characteristics thereof.

Abstract: An RF plasma system employs frequency tuning to change the frequency of an RF generator within a frequency range to match the impedance of a plasma chamber. Forward power and reflected power magnitudes are obtained from a bidirectional sensor. The ratio of reflected power to forward power is obtained for one frequency, and then the frequency is changed. The tuning algorithm compares the ratio of reflected to forward power at the new frequency with the ratio obtained earlier. If this ratio is smaller, the frequency is changed again in the same direction, but if larger, then the frequency is changed in the other direction. These steps are iterated until the ratio of reflected to forward power reaches a minimum. The tuning algorithm can be implemented in hardware or in software.

Abstract: A radio frequency (RF) coupler transfers RF power between a first circuit on a rotary shaft and a second circuit relative to which the shaft can rotate. The coupler comprises a first RF transmission line arranged to rotate with the rotary shaft about the rotation axis of the rotary shaft for connection to the first circuit and a second RF transmission line relative to which the first RF transmission line can rotate for connection to the second circuit. The first and second RF transmission lines comprise first and second electrically conductive tracks arranged coaxially around the rotation axis in mutually overlapping relationship to provide RF coupling between the first and second RF transmission lines. Each track has a gap defining a pair of ports. One of the ports of each track is connectable to a respective circuit and another port in the track is connected to a RF reflecting termination. A notch filter tunable to a desired frequency within a predetermined RF band is also described.

Abstract: An RF combiner, of the Wilkinson type, capable of very wide band and high power continuous wave (CW) energy transmission, e.g., of a 5 way design, consisting of 5 input connected transformers coupled to two output providing transformers, with 5 balancing resistors respectively connected between the input terminals to the input connected transformers. The transformers are provided with ferrite cores in the form of one block for the input transformers and one block for the output transformers and the broader frequency band is obtained by properly selecting the ferrite material of the blocks making up the transformer cores, preferably with a permeability of 1600 that will provide a 2-150 MHz frequency range.

Abstract: Methods for the fabrication of miniature electromagnetic microwave switches are disclosed in this invention. In one embodiment, on a dielectric substrate, miniature electromagnetic switches for coplanar waveguide transmission lines are fabricated. In another embodiment, miniature electromagnetic microwave switches are fabricated for microstrip transmission lines. The miniature microwave switches are built on a dielectric substrate and are accompanied by miniature electromagnetic coils on the back of the substrate. The switch is controlled by regulating the dc current applied to the electromagnetic coil. A switch is ON when a dc controlling current is applied to the electromagnetic coil and is OFF when the controlling current is cut off. A reverse dc current may also be applied to the electromagnetic coil to repel the top electrode from the bottom electrode. The use of reverse current will prevent the possible sticking of the two electrodes, thus, reducing the switching time.

Abstract: An RF termination load includes a base of an electrically and thermally conductive material having opposed surfaces. A recess is in one of the surfaces of the base and a groove in the one surface extends from the recess to an edge of the base. A resistor is seated in the recess in the base. The resistor includes a substrate of an electrically insulating material having opposed surfaces and a resistance film on one of the surface of the substrate. A first contact of a resistance film is on the one surface of the substrate at one end of the resistor and a second contact of an electrically conductive material is on the one surface of the substrate at the other end of the resistor. The second contact extends over an edge of the substrate and over the other surface of the substrate. The resistor is mounted in the recess with the second contact being seated on and contacting the base. An RF cable has an end in the groove in the base.

Abstract: In a coupled line, microstrip lines are formed so as to be arranged with a spacing that is narrower than the smallest possible space that is obtainable with a conventional electrode forming process, on a top side thereof spaced away from a dielectric substrate. The microstriplines have a trapezoid-shaped cross-section with the narrower major surface at the bottom, in contact with the dielectric substrate. Such formation makes it possible to strengthen the coupling between the microstrip lines, and to reduce the conductor loss of the microstrip lines.

Abstract: A bus for high signal quality interconnections, comprising means for producing at least one common mode reflection, often for differential transmission line interconnections. Also, a bus for high signal quality interconnections further comprising means for under-damping the signal and/or reducing the common mode noise. In both cases the means are at least one impedance termination. To produce common mode reflections, there are non-contact couplers terminated by short and open circuits, which cause the reflections from via connectors and other like impedance discontinuities to be re-reflected in common mode so that they are rejected by a differential receiver. To produce under-damping of the signal and/or a reduction of the common mode noise, capacitive terminations are used. The under-damping of the signal sharpens in the falling edge of the coupler pulses.