Abstract: In a submersible ultrasonic cleaning system for use in highly radioactive environments (e.g., cleaning radiated nuclear fuel assemblies), a bond between energy producing transducers and an radiating wall is strengthened with a polyurethane adhesive such as Permabond PT326, or 3M DP-190 adhesive. In various diagnostic tests, one or more of the transducers are operated in an energy-transmitting mode while one or more other transducers are operated in an energy-detecting mode to detect a weakened transducer/wall bond and/or acoustic conditions of the working fluid.

Abstract: A plant for cleaning rolled metal strips provided with a superficial layer of oxide, the plant comprising unwinding means for unwinding at least one coil of rolled strip and pickling means for pickling said rolled strip; wherein there are provided measuring means for measuring the thickness of the superficial layer of oxide, arranged between said unwinding means and said pickling means. A relating cleaning method is also claimed.

Abstract: The present disclosure relates to a level adjustable washing machine and a method for adjusting a level of the washing machine.

Abstract: A substrate processing apparatus includes a liquid film forming unit 16A configured to form a liquid film of a liquid for anti-drying on a substrate; a drying processing unit 16B configured to dry the substrate; and a transfer mechanism 17 configured to transfer the substrate from the liquid film forming unit into the drying processing unit. By a transfer time adjusting operation of adjusting a volatilization amount of the liquid during a transfer of the substrate by adjusting a transfer time during which the substrate is transferred from the liquid film forming unit into the drying processing unit or by an initial liquid film thickness adjusting operation of adjusting a thickness of the liquid film formed in the liquid film forming unit, the thickness of the liquid film when a drying processing is begun in the drying processing unit is controlled to fall within a target range.

Abstract: A cleaning apparatus of a substrate processing apparatus according to an exemplary embodiment includes a nozzle and a scanner. The nozzle ejects a gas toward in an inner wall surface of a processing chamber in which a substrate is processed. The scanner causes the nozzle to scan along the inner wall surface of the processing chamber in the processing chamber.

Abstract: An apparatus comprising a cleaning rod driven in reciprocating, axial extension (y) and retraction (x) movements upon cleaning a smelt discharge opening of a chemicals recovery boiler, wherein a linear actuator is controllable for driving the cleaning rod in the axial movements. A pivot actuation means is controllable for pivoting the cleaning rod about an axis (S) upon cleaning a smelt spout associated with the smelt discharge opening, wherein one or more sensors are arranged to provide control basis for correlation of the axial movements (x; y) with the change in pivot angle (?) during pivoting of the cleaning rod. A method to be performed in use of the apparatus is likewise disclosed.

Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

Abstract: System for selectively contacting a cleaning composition with a surface of a turbine engine component is presented. The system includes a cleaning apparatus and a manifold assembly. The cleaning apparatus includes an upper portion and a lower portion defining a cleaning chamber configured to allow selective contact between the cleaning composition and a surface of the first portion of the turbine engine component. The upper portion includes a plurality of fill holes in fluid communication with the cleaning chamber, and the lower portion includes a plurality of drain holes in fluid communication with the cleaning chamber. The manifold assembly is configured to selectively circulate the cleaning composition from a reservoir to the cleaning chamber via the plurality of fill holes, and recirculate the cleaning composition from the cleaning chamber to the reservoir via the plurality of drain holes. Methods for selectively cleaning a turbine engine component is also presented.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: Disclosed herein is a washing machine including a door including an external cover and an internal glass to open and close a laundry entrance, at least one image sensor disposed to face the internal glass to acquire image data, a detergent bubble recognizer configured to recognize detergent bubble from the image data through a machine learning based image recognition model, and a controller configured to perform control to perform an additional rinsing cycle based on a result of recognition.

Abstract: An apparatus for washing shell eggs includes a washing unit and an egg conveyor extending in a longitudinal direction, and having a transverse direction. The longitudinal and transverse directions define a conveyor plane. Spray nozzles are arranged in the washing unit above the conveyor plane so that in a first step the eggs can be subjected to a liquid jet from a first liquid spray nozzle spraying in a first spray direction, and in a second step the eggs can be subjected to a liquid jet from a second liquid spray nozzle spraying in a second spray direction. The first and second spray nozzles are arranged on opposite sides of the egg when seen in the transverse direction and at a distance above the conveyor plane so that the liquid sprayed in the first and second spray directions hits the egg from opposite sides in a downwards angle.

Abstract: A device for masking the inner periphery of a disc of a turbine engine generally includes a lower element, an upper element, and an elastic annular seal. The lower element, the upper element, and the elastic annular seal are coaxial, the elastic annular seal arranged longitudinally between the lower element and the upper element. The seal generally includes a lower annular part bearing radially and internally against the lower element, and an upper annular part bearing radially and internally against the upper element. The lower part and the upper part are connected to one another by an annular central part forming a return element. The elastic annular seal is configured to bear longitudinally, radially, and externally against each longitudinal end of said inner periphery of the disc to mask said inner periphery, and a clamping system capable of clamping the seal between the lower element and the upper element.

Abstract: A photovoltaic (PV) module cleaning system can include a robotic cleaning device and a support system. The support system can be configured to provide a metered fill to the robotic cleaning device. In some embodiments, the robotic cleaning device and include a curved cleaning head. Various techniques for deploying a robotic cleaning device on PV modules include out-and-back, leapfrog, among others.

Abstract: A footwear sole cleaning and sanitizing system including a housing having a top surface, first side positioned adjacent to a user entry portal, a second side positioned adjacent to a user exit portal, and railing mounted on the top surface. The system includes a debris remover arranged to remove debris from the footwear sole and a sanitizer arranged to remove contaminants from the footwear sole. The system further includes sensors arranged to generate sensor data based on a detected position of the footwear sole, a user interface arranged to provide cues to the user during operations of the device, and a controller arranged to: i) receive the sensor data from the sensors; i) control operations of the debris remover and sanitizer in response to the received sensor data, and iii) send cue instructions associated with the one or more cues to the user interface.

Abstract: A clean-in-place process may begin with a pre-rinse step in which soil (e.g., contaminants, residual product) is flushed from industrial equipment prior to circulating a cleaning agent through the equipment. To determine when the equipment has been suitably flushed, pre-rinse fluid exiting the industrial equipment and containing soil may be fluorometrically analyzed. A concentration of the soil is determined from fluorescent emissions emitted by the soil itself. Based on this information, the pre-rinse flushing process can be controlled, for example, to minimize water usage, maximize pre-rinse cleaning, or based on any other suitable metric.

Abstract: An intelligent floor cleaner, including a vehicle body, a clean water tank, a control box, a dirty water tank, a floor cleaning apparatus, a manual steering apparatus, an autonomous steering apparatus, a navigation apparatus, and a mileage apparatus, where the clean water tank is located above the vehicle body and is fixedly connected to the vehicle body; the control box is located in a middle location above the vehicle body and is fixedly connected to the vehicle body; the dirty water tank is located at a rear side above the clean water tank and is fixedly connected to the clean water tank; the floor cleaning apparatus is located below the vehicle body; and the navigation apparatus includes a 3D laser and a laser mounting rack, and the navigation apparatus is located above the vehicle body.

Abstract: An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements. Gas provided to the plurality of nozzles exits the nozzles in a stream directed parallel to the supporting surface and the stream of gas generates forces that enable wafers to be securely supported in a floating manner over the supporting surface without coming into direct contact with the supporting surface.

Abstract: The present invention relates to systems and methods for cleaning of devices, such as heat exchangers. According to the invention, controlled cavitation is created at predetermined positions within a device. The cavitation is done by mechanical waves, such as ultrasound waves, generated by transducers, wherein the waves are based on output of time-reversal wave form analysis of the device structures.

Abstract: Techniques herein pertain to apparatus embodiments and methods for treating the surface of a microelectronic substrate, and in particular for removing objects from the microelectronic substrate using fluid treatment sprays such as cryogenic fluid sprays. The apparatus embodiments and methods described herein further include techniques for monitoring and/or controlling treatment processes for removing particles from surfaces of a microelectronic substrate. The techniques allow using image analysis techniques to monitor characteristics of spray nozzle(s) (e.g., frost formation on the nozzle surface) and using the resultant image information of the nozzle to take corrective action if frost or another nozzle condition is detected.

Abstract: The invention relates to a method for cleaning dissolution vessels and for the subsequent dosing of a dissolution media, and to mobile modular cleaning and dosing equipment for the implementation of said method. According to said method, injected water steam is used for the cleaning and is subsequently aspirated, together with the residues of the dissolution, and the vessel is then refilled with the desired quantity of a new dissolution media. The mobile modular cleaning and dosing equipment allows the cleaning and dosing to be carried out in situ without having to remove the dissolution vessels from the equipment or site where the dissolution tests are carried out, using self-sufficient modular equipment, and a novel steam supply line is used for the cleaning, which sprays the steam against the bottom of the vessel and the inner side walls.