Abstract: A controller for managing at least one MLC non-volatile memory module and at least one SLC non-volatile memory module. The flash controller is adapted to determine if a range of addresses listed by an entry and mapped to said at least one MLC non-volatile memory module fails a data integrity test. In the event of such a failure, the controller remaps said entry to an equivalent range of addresses of said at least one SLC non-volatile memory module. The flash controller is further adapted to determine which of the blocks in the MLC and SLC non-volatile memory modules are accessed most frequently and allocating those blocks that receive frequent writes to the SLC non-volatile memory module and those blocks that receive infrequent writes to the MLC non-volatile memory module.

Abstract: A nonvolatile memory includes a plurality of memory blocks and an address decoder. The address decoder is configured to activate a block word line corresponding to the memory blocks in common when one memory block is selected among the memory blocks, supply voltages to word lines of the selected memory block among the memory blocks, and float word lines of an unselected memory block among the memory blocks.

Abstract: A base chip including first to Nth delay units coupled in series, where N is a natural number equal to or larger than 2, wherein when the number of stacked chips over the base chip is 1, the base chip is suitable for delaying a refresh signal, and generating first to Xth delayed refresh signals using the first to Xth delay units among the first to Nth delay units, where X is a natural number having a relation of N>X?1, and when the number of stacked chips over the base chip is 2, the base chip is suitable for delaying the refresh signal, and generating first to Yth delayed refresh signals using the first to Yth delay units among the first to Nth delay units, where Y is a natural number having a relation of N?Y>X.

Abstract: To provide a semiconductor device which can be stably operated while achieving a reduction of the power consumption. A semiconductor device includes a CPU, a system controller which designates an operation speed of the CPU, P-type SOTB transistors, and N-type SOTB transistors. The semiconductor device is provided with an SRAM which is connected to the CPU, and a substrate bias circuit which is connected to the system controller and is capable of supplying substrate bias voltages to the P-type SOTB transistors and the N-type SOTB transistors. Here, when the system controller designates a low speed mode to operate the CPU at a low speed, the substrate bias circuit supplies the substrate bias voltages to the P-type SOTB transistors and the N-type SOTB transistors.

Abstract: According to one embodiment, a semiconductor device includes a first transistor of a first conductivity type, and a first logical circuit. The first transistor of the first conductivity type is connected between a first node to which a power supply voltage is applied and a second node. The first transistor is turned on in the initial stage of an active cycle, and is turned off by applying the power supply voltage to the second node. The first logical circuit is driven by the power supply voltage applied to the second node. The first logical circuit outputs a voltage which is lower than the power supply voltage in the active cycle based on an input signal supplied thereto.

Abstract: A nonvolatile memory device may include a nonvolatile memory device may include a nonvolatile memory cell array; a peripheral circuit suitable for: activating an operation voltage in response to an operation voltage activation command, performing an operation to the nonvolatile memory cell array using the activated operation voltage in response to an operation command, and deactivating the activated operation voltage in response to an operation voltage deactivation command after the performing of the operation; and a control circuit suitable for controlling the peripheral circuit to execute an intervening operation during the activating of the operation voltage, the performing of the operation, and the deactivating of the activated operation voltage.

Abstract: A semiconductor storage device includes an SRAM memory cell composed of a drive transistor, a transfer transistor and a load transistor, an I/O circuit that is connected to bit lines connected to the memory cell, and an operating mode control circuit that switches an operating mode of the I/O circuit between a resume standby mode and a normal operation mode, wherein the I/O circuit includes a write driver that writes data to bit lines, a sense amplifier that reads data from the bit lines, a first switch inserted between the bit lines and the write driver, a second switch inserted between the bit lines and the sense amplifier, a precharge circuit that precharges the bit lines, and a control circuit that controls the first and second switches and the precharge circuit according to a signal from the operating mode control circuit.

Abstract: Provided is a semiconductor device including gate structures provided on a substrate, a separation insulating layer interposed between the gate structures, and a plurality of cell pillars connected to the substrate through each gate structure. Each gate structure may include horizontal electrodes vertically stacked on the substrate, and an interval between adjacent ones of the cell pillars is non-uniform.

Abstract: An apparatus includes an interface and a circuit. The interface may be configured to generate a read signal that carries read data from a memory channel. The circuit may be configured to (i) modify the read signal with a de-emphasis on each pull up of the read signal and a pre-emphasis on each pull down of the read signal and (ii) transfer the read signal as modified to a memory controller.

Abstract: A microelectronic component is capable of being used as a memory cell. The component includes a semiconductor layer resting on an insulating layer and including a doped source region of a first conductivity type, a doped drain region of a second conductivity type, and an intermediate region, non-doped or more lightly doped, with the second conductivity type, than the drain region, the intermediate region including first and second portions respectively extending from the drain region and from the source region. An insulated front gate electrode rests on the first portion. A first back gate electrode and a second back gate electrode are arranged under the insulating layer, respectively opposite the first portion and the second portion.

Abstract: A multi-time programmable memory cell has a differential multi-time programmable memory cell and a second-level latch cell. The differential multi-time programmable memory cell provides a first balance signal and a second balance signal, and the second-level latch cell receives the first balance signal and the second balance signal and provides an output signal according to the first balance signal and the second balance signal based on a first latch control signal and a second latch control signal.

Abstract: A semiconductor device includes: a sense amplifier; a branched line selectively connectable to the sense amplifier; a recycling arrangement selectively connectable to the branched line; an array of bit lines connected to corresponding memory cells; a multiplexer configured to selectively connect the branched line to a selected one of the memory cells through a corresponding line amongst the array of bit lines; and a controller. The controller is configured to: permit, during a recovery phase in which a gleaned amount of charge (gleaned charge) is recovered, flow of charge (charge-flow) between the recycling arrangement and the branched line; interrupt, during a drainage phase in which the gleaned charge is preserved, charge-flow between the recycling arrangement and the branched line; and permit, during a reuse phase in which the gleaned charge is reused, charge-flow between the recycling arrangement and the branched line.

Abstract: An EPROM device may include a unit cell, a switching unit, a decoder, and a comparing unit. The unit cell may be disposed between a ground voltage terminal and a bit line coupled to a program voltage supply line. The switching unit may control an electrical coupling of the program voltage supply line and the unit cell according to input switching control signal. The decoder may generate a plurality of output signals according to an input of binary data. The comparing unit may compare each of a plurality of reference voltages with a bit lien voltage and generate a program mode output signal. The level shifter may receive at least one output signal of the output signals of the decoder and the program mode output signal, and may output the output signal of the decoder or the program mode output signal as the switching control signal.

Abstract: According to one embodiment, there is provided a semiconductor storage device including N word lines, M bit lines, multiple memory cells, and a read circuit. N is an integer of four or greater. M is an integer of two or greater. The M bit lines intersect with the word lines. The multiple memory cells are placed at positions where the word lines and the bit lines intersect. The memory cell stores binary data. The read circuit is connected to the M bit lines. The read circuit is able to detect levels of a multi-ary signal.

Abstract: An interface circuit may include a first FIFO circuit and a second FIFO circuit. The first FIFO circuit may generate first output data based on a first sampling signal and a second sampling signal. The second FIFO circuit may generate second output data based on a third sampling signal and a fourth sampling signal. The first FIFO circuit and the second FIFO circuit may be cross-reset.

Abstract: To provide a magnetic element capable of performing skyrmion transfer, a skyrmion memory to which this magnetic element is applied, and a shift register, for example, a magnetic element capable of performing skyrmion transfer is provided, the magnetic element providing a transverse transfer arrangement in which the skyrmion is transferred substantially perpendicular to a current between an upstream electrode and a downstream electrode, and including a plurality of stable positions in which the skyrmion exists more stably than in other regions of a magnet, and a skyrmion sensor that detects a position of the skyrmion.

Abstract: A memory system includes a nonvolatile memory device and a memory controller. The nonvolatile memory device has a first program mode and a second program mode. The second program mode programs data to have a larger read margin than the first program mode. The memory controller controls the nonvolatile memory device to program the data according to the second program mode for a read reclaim operation.

Abstract: A bit line equalizer includes a first line-shaped gate extended in a first direction, a second line-shaped gate spaced apart from the first line-shaped gate by a predetermined distance and extending parallel to the first gate, a third gate configured to interconnect the first gate and the second gate, a first contact node located at one side of the first gate, a second contact node located at one side of the second gate, a third contact node located between the first gate and the second gate and located at one side of the third gate, and a fourth contact node located between the first gate and the second gate and located at the other side of the third gate.

Abstract: A welding system including a fine tuning knob and a coarse adjustment knob for setting a weld wire feed speed are provided. The welding system may include a welder having the coarse adjustment knob and a spool gun having the fine tuning knob. A user may adjust the knob on the welder to set a coarse adjustment wire feed speed and may adjust the knob on the spool gun to fine tune the wire feed speed setting.

Abstract: Proposed as a configuration, a controlling method, and a testing method for a ferroelectric shadow memory are (1) a bit line non-precharge method, in which no precharging of a bit line is performed during a read/write operation; (2) a plate line charge share method, in which electric charge is shared between plate lines that are driven sequentially during store/recall operation; (3) a word line boost method, in which the potential on a word line is raised during a write operation; (4) a plate line driver boost method, in which the driving capacity of a plate line driver is raised during a store/recall operation; and (5) a testing method for detecting a defect in a ferroelectric capacitor by arbitrarily setting a potential on a bit line from outside a chip.