Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.

Abstract: A fastening device and fastening method for fastening a distribution box control panel to a distribution box, the fastening device comprising a push block, a biasing member, a shell, and a locking member sleeved in the shell, wherein the method utilizes the biasing force of the biasing member to fasten the device, and utilizes the elasticity of the locking member having a bending structure to realize assembly and disassembly, where a user can conveniently assemble the device with hand alone, i.e., during assembly, the fastening device is pushed in along a notch in the distribution box control panel and then pressed tightly, and during disassembly, the fastening device can be pushed out after the locking member is pressed such that in comparison to a screw fastening method, the fastening device of the present invention provides a constant fastening force, thus realizing more stable and reliable fastening.

Abstract: A housing for an electronic circuit configuration includes a housing seal disposed on an inner surface of the housing, integrally bonded to at least one outer housing wall and made of a liquid silicone elastomer. An electrical connecting element extends from the interior of the housing through an outer housing wall and out of the housing. A space between the outer housing wall and the electrical connecting element is sealed by the housing seal.

Abstract: The present invention provides an extruded flexible flat cable, which has a superior formability, flexibility, adhesiveness, and fire-retardancy, with a low manufacturing cost. The flexible flat cable of the present invention is adapted for sliding door of a motor vehicle and also other parts. The extruded flexible flat cable has a conductor covered with an insulation layer extrude-formed with an extrusion molding method. The insulation layer is formed from a fire-retardant resin composition containing a modified polybutylene terephthalate and a fire-retardant additive. The fire-retardant resin composition has a melting point of 170-215 degrees C. measured in reference to JIS K7121 with a differential thermal analysis at a rate of temperature increase of 10 degrees C. per minute.

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

Abstract: Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

Abstract: A package substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, an outermost conductor layer including first and second pads to mount electronic components, vias including first and second vias such that the first vias are connecting the first conductor layer and first pads and the second vias are connecting the first conductor layer and second pads, and skip vias penetrating through the outermost and inner interlayers such that the skip vias are connecting the outermost and second conductor layers. Sum of insulation distances (t1, t2) is in range of 40 ?m or less to 10 ?m or more, where the insulation distance (t1) is insulation distance between the outermost and first conductor layers and the insulation distance (t2) is insulation distance between the first and second conductor layers, and difference between the insulation distances (t1, t2) is less than 5 ?m.

Abstract: A substrate having an edge; a first and second active trace, wherein the first active trace corresponds to a first signal of a differential pair and the second active trace corresponds to a second signal of the differential pair; and a first and second conductive via which are located at different distances from the edge. The first active trace is routed to the first conductive via, and the second active trace is routed around the first conductive via to the second conductive via such that the second active trace is between the first conductive via and the edge. The substrate includes a first plating trace in electrical contact with the first active trace, and a second plating trace in electrical contact with the second active trace, wherein the first and second plating traces are routed to the edge on different metal layers of the substrate.

Abstract: An electrical connection box applied to a wire harness includes a casing and a cover member. The casing is provided with a first member that houses an electronic component and a second member and an insertion port formed on the first member, and an exterior installation unit formed outside the insertion port of the first member with an end of an exterior member of which being arranged in a stacking direction. The cover member has a pair of locking units, and is locked to the exterior installation unit via the pair of locking units and holds an end of the exterior member between the cover member and the first member. The second member includes a pressing wall that interposes an end to be pressed of the cover member between the pressing wall and the first member and that presses the end to be pressed toward the first member side.

Abstract: A conduit for an offshore cable assembly that includes a conduit body that has at least one longitudinal strength member embedded therein. The at least one longitudinal strength member extends the length of the conduit body. A plurality of cables, hoses, or a combination are received inside of the conduit body.

Abstract: It is an object of the present invention to ensure a high water-stopping property of a wire harness including a waterproofing connector section that is molded from a resin, by suppressing a variation in the outer size of a seal section of the connector section. The connector section is made from a first synthetic resin that is insert-molded with a part of a terminal fitting of the terminated electric cable used as an insert section. A water-stopping section is made from a second synthetic resin that is insert-molded with a section extending from a part of the terminal fitting to an insulation coating of the terminated electric cable used as an insert section. The seal section is made from the second synthetic resin that is insert-molded with a part of the connector section used as an insert section. The second synthetic resin is softer than the first synthetic resin.

Abstract: A flexible printed circuit which includes a flexible substrate, a plurality of conductive pads, and a plurality of conductive traces that conductively connect to at least two conductive pads. The plurality of conductive pads and traces are defined on the flexible substrate. The flexible substrate has a first portion and a second portion. The first portion has at least two sets of conductive pads. The second portion has at least one set of conductive pads and is configured to conductively connect to a testing device. After the flexible printed circuit is tested, the second portion of the flexible substrate is detached from the first portion of the flexible substrate.

Abstract: A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.

Abstract: A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.

Abstract: An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface.

Abstract: A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

Abstract: A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material.

Abstract: When laminating two resin films so that sides where the conductive patterns are not formed face each other, and when laminating other resin films so that sides where the conductive patterns are formed and the sides where the conductive patterns are not formed to face each other, a plurality of resin films each of which has the same resin thickness are used for the other resin films, and two resin films having a sum of resin thickness that is the same as the resin thickness of the other single resin film are used for the two resin films. Accordingly, dielectric thicknesses between the conductive patterns formed in the adjoining resin films can be made even so that an impedance can be calculated easily, and it becomes possible to ease the circuit design.

Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.