Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 ?m to 200 ?m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Abstract: A motor vehicle door lock housing comprising at least one outwardly facing recess (2) for receiving electric strip conductors (3) and with passages (4) in the recess (2) for connecting the strip conductors (3) to the housing interior, wherein the strip conductors (3) together with at least one strip conductor board (6) carrying the latter can be placed in the recess (2).

Abstract: An antigalloping device can include first and second clamps, each having a respective jaw for clamping to respective first and second cables. A connecting assembly can be coupled between the first and second clamps. The connecting assembly can include an elongate insulator attached to a flexible tether. The flexible tether is capable of being bent and maneuvered during installation. At least one of the first and second clamps can be rotatably coupled to the connecting assembly. The elongate insulator and the flexible tether can straighten along a longitudinal axis. The at least one of the first and second clamps can be orientatable in a position transverse to the longitudinal axis for being rotatable between the position transverse to the longitudinal axis and a position inline with the longitudinal axis, under opposed tension exerted on the jaws of the first and second clamps, for twisting at least one of the first and second cables for reducing galloping.

Abstract: A waterproof seal for electrical assemblies having conductive wires attached to a metal contact and inserted into a connector body. The conductive wires and metal contact are coated with solder to fill the gaps. The space between the soldered wires and the connector body are filled with an epoxy. The wire insulation and connector body are continuously sealed with a bonding agent. A section of wire insulation and the connector body are encased within an outer plastic jacket overmold.

Abstract: Provided are: a first-group accommodation part (21) and a second-group accommodation part (22) in each of which accommodation parts (2) each of which accommodates at least one of a bus bar (3), a terminal (4), and an electric wire (5) connected to the terminal (4) are arranged; a linkage part (8) linking the first-group accommodation part (21) and the second-group accommodation part (22) to each other; and an electric wire routing part (9) provided in the linkage part (8) and accommodating the electric wires (5).

Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.

Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. Each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer.

Abstract: A printed wiring board comprises a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction. The printed wiring board is formed with one or more vias. The insulating layer is provided between the pattern layer and the ground layer. The ground layer is formed with a ground pattern. The pattern layer is formed with one common ground plane and two or more pads. The pads are arranged in a lateral direction. The common ground plane is located forward of the pads in the front-rear direction. The vias include a first via that connects the common ground plane and the ground pattern with each other. The pads include one or more ground pads and one or more signal pads. The ground pads are connected with the common ground plane. The signal pads are unconnected with the common ground plane.

Abstract: A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole, a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween, and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part.

Abstract: A terminal structure include an internal conductor connection portion, a removal portion and an external conductor connection portion. The internal conductor connection portion is connected to a internal conductor via a conducting portion and an external conductor. The removal portion is provided at a rear side relative to the internal conductor connection portion. The external conductor connection portion is provided at a rear side relative to the removal portion, is formed in the outer peripheral surface of the external conductor, is shut off from the internal conductor connection portion by the removal portion, and is connected to the external conductor.

Abstract: An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.

Abstract: A flameproof feed-through (200) includes a feed-through element (210) comprising a substantially planar shape, a first interface region (211), and a second interface region (212), wherein one or more conductors (217) extend between the first interface region (211) and the second interface region (212). The flameproof feed-through (200) further includes one or more body portions (220) assembled to the feed-through element (210), with the one or more body portions (220) holding the feed-through element (210) in position with respect to the aperture. The first interface region (211) of the feed-through element (210) extends at least partially to a first side (201) of the flameproof feed-through (200) and wherein the second interface region (212) of the feed-through element (210) extends at least partially to a second side (202) of the flameproof feed-through (200).

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: Electrical enclosures are provided that include arc resistant features designed to add structural strength for arc containment, to inhibit arc propagation, and/or to direct the release of pressure within and/or from the enclosure in order to provide arc resistant electrical enclosures. In general, the arc resistant features may be designed to provide enclosures where in the event of an arc fault, the doors and covers remain closed, parts are not ejected from the enclosure, holes are not produced in the enclosure, indicators located in close proximity to the enclosure do not ignite, and/or grounding connections remain effective. Further, the foregoing features may be designed to provide electrical enclosures that comply with industry guides and standards for arc resistant ratings.

Abstract: A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion.

Abstract: A non-halogen multilayer insulated wire includes a conductor, an inner layer covering the conductor, and an outer layer formed on the external surface of the inner layer. The inner layer includes a polyolefin resin composition including 60 to 95 parts by mass of a high density polyethylene, 5 to 40 parts by mass of an ethylene copolymer, and 0.1 to 1 part by mass of a metal damage inhibitor. The outer layer includes a polyester resin composition that includes a base polymer mainly including a polyester resin, and further includes, relative to 100 parts by mass of the base polymer, 50 to 150 parts by mass of a polyester block copolymer, 0.5 to 5 parts by mass of a hydrolysis inhibitor, 0.5 to 5 parts by mass of an inorganic porous filler, and 10 to 30 parts by mass of magnesium hydroxide.

Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Abstract: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width.

Abstract: A branched electrical system is adapted for providing multiple users with access to high and/or low voltage electrical power in work areas or high density seating areas, such as stadium or theater seating, work rooms, lecture halls, and public transportation vehicles. The system includes a main line and a plurality of branch lines, each branch line having at least one high voltage or low voltage electrical receptacle that is accessible to a user located at the seating, such as for powering a portable electronic device. The branch lines may be coupled to the main line via a splice or other electrical-mechanical connection.