Abstract: An integrated electronic switch includes an input unit and a circuit board. The input unit is configured to receive a drive signal output by a user. A sensing module for sensing the drive signal transmitted from the input unit, and a control module electrically connected to the sensing module are disposed on the circuit board, where the sensing module and the control module are disposed on a first side surface of the circuit board.

Abstract: A power module includes at least one power semiconductor element between first and second conductive layers, a first cooling member on the first conductive layer, a second cooling member under the second conductive layer, and at least one snubber capacitor between the first and second conductive layers. Each snubber capacitor has a capacitor core between first and second electrodes and first and second transition layers. The first transition layer is between the first conductive layer and the first electrode and the second transition layer is between the second electrode and the second conductive layer, or the first transition layer is between the first electrode and the capacitor core and the second transition layer is between the capacitor core and the second electrode. The first and second transition layers are conductive. A thermal expansion coefficient of the transition layers is between thermal expansion coefficients of adjacent elements of the snubber capacitor.

Abstract: A contacting device for electrical contacting of a printed circuit board with a coil body for a solenoid valve for a brake device for a vehicle, including: a helical electrically conductive contact spring which is configured to be contacted or being contactable with the printed circuit board at a first spring end and configured to be contacted or being contactable with the coil body at a second spring end, situated opposite the first spring end, to enable a resilient electrical contacting of the printed circuit board with the coil body; and a pin which is receivable or has been received in an interior space of the contact spring, the pin being configured to support the contact spring from the interior space in a received state received in the interior space. Also described are a related solenoid valve, method, and computer readable storage medium.

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.

Abstract: A wind turbine including a plurality of elements including a tower, a nacelle mounted to the tower and a plurality of blades rotatable mounted to the nacelle is provided. At least one element of the tower, the nacelle and the blades includes a coaxial impedance member coaxially arranged about an axis of the element.

Abstract: An apparatus for damping vibrations in high-voltage devices has a support arrangement for the high-voltage device. The support arrangement includes support elements interconnected by connection elements. Intermediate elements, in particular coated washers, are arranged between the connection elements and the support elements and/or between different support elements. There is also described a method for damping vibrations, in which connection elements spatially fix support elements of the support arrangement of a high-voltage device in a mechanically stable manner. When mechanical vibrations occur on the high-voltage device, the connection elements dampen the mechanical vibration in a defined manner via a predetermined sliding friction with the support elements and via a spatially predetermined play in relation to the support elements.

Abstract: An aluminum base wire includes a core wire made of pure aluminum or an aluminum alloy and a coating layer provided on an outer periphery of the core wire. The coating layer includes a first layer provided on the outer periphery of the core wire, a second layer provided on an outer periphery of the first layer, and a third layer provided on an outer periphery of the second layer. The first layer is composed of at least one metal selected from the group consisting of nickel, a nickel alloy, copper, and a copper alloy, the second layer is composed of metals that include zinc and tin, the third layer is composed of at least one metal selected from the group consisting of tin and tin alloys that contain substantially no zinc, and a zinc content in the second layer is 15 atomic % or more and 60 atomic % or less.

Abstract: An electronic device (1, and 1A to 1E) according to the present disclosure include a substrate (10, and 10F) made of a ceramic and a housing part (21) including a recessed portion (210) accommodating the substrate. The recessed portion includes a plurality of side wall portions (211) arranged around the substrate along a circumferential direction and respectively facing a plurality of sides (111) of the substrate in a plan view when viewing the substrate from a direction perpendicular to a circuit forming surface (110) of the substrate, and a plurality of gaps (212) each located between two of the plurality of side wall portions adjacent to each other in the circumferential direction. The substrate includes a plurality of corner portions (112) curved toward an inner side of the circuit forming surface in a plan view.

Abstract: A power electronic arrangement has a plurality of single-phase power semiconductor modules and one multi-phase power semiconductor module, wherein each single-phase power semiconductor module has a first, at least frame-like housing, two first DC voltage terminal elements, a first AC voltage terminal element, first auxiliary terminal elements and a first switching device. The multi-phase power semiconductor module has a second, at least frame-like housing, two second DC voltage terminal elements, at least two second AC voltage terminal elements, second auxiliary terminal elements and a second switching device. The first and second DC voltage terminal elements each form a stack in a section of their length and on the terminal sections are designed identically. All the power semiconductor modules are arranged in a row in the direction of the normal vectors of the respective first longitudinal side.

Abstract: Layout techniques for chip packages on printed circuit boards are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between chip packages while simultaneously providing for the rapid provision of transient power demands to the chip packages. The layout techniques may also enable improved thermal management for the chip packages.

Abstract: A composite insulator includes an insulating elongated core, a protective layer surrounding the elongated core, the protective layer including an outer surface with a shed profile and an adhesive primer layer disposed between the elongated core and the protective layer for adhering the protective layer to the elongated core, the adhesive primer layer including a coupling agent and particles of a low resistivity material. The method for producing a composite insulator includes preparing a first solution including a solvent, a coupling agent and particles of a low resistivity material, applying the first solution on at least a part of an envelope surface of an insulating elongated core and thus forming one or more first adhesive primer layers and applying a protective layer onto the first adhesive primer layer on the elongated core, wherein the protective layer includes an outer surface with a shed profile.

Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

Abstract: This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.

Abstract: A printed circuit board includes: a conductor plate below the inner dielectric layer; some vias through the inner dielectric layer, bonded to the conductor plate, centered at respective points on an upper surface of the conductor plate; a ground conductor above the inner dielectric layer, bonded to the vias, extending outwardly from any quadrangle with vertices being the nearest four points of the points; an electromagnetic resonance plate above the inner dielectric layer and inside the quadrangle, electrically connected to the ground conductor and the vias with a portion other than a protruding outer edge serving as a junction; an upper dielectric layer above the electromagnetic resonance plate; and a differential transmission line pair composed of a pair of strip conductors overlapping with the electromagnetic resonance plate, above the upper dielectric layer. The conductor plate and the vias constitute an electromagnetic field confinement structure.

Abstract: An electronic circuit assembly includes an interposer substrate, a wiring substrate, an electrical connective part and an electronic component. The interposer substrate with a first coefficient of thermal expansion (CTE) includes a first surface, a second surface opposite to the first surface, and a first side surface connecting to the first surface and the second surface. The wiring substrate with a second CTE is disposed below the second surface. The first CTE is lower than the second CTE. The electrical connective part is disposed in the interposer substrate and extends to the first side surface. The electronic component is attached to the first side surface and is electrically connected to the electrical connective part.

Abstract: A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.

Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

Abstract: An improved memory module structure includes a printed circuit board, memory units disposed on the printed circuit board, and a connection interface disposed on the printed circuit board for connection with an electronic device. The printed circuit board includes a solder pad zone having solder pads electrically connected with the memory units and the connection interface. A conduction element is combined with the solder pad zone or at least one conductor line electrically connected, in the form of bridge connection, the solder pads, in order to have the solder pads electrically connected. A memory module modification method is also provided, including removing a register from an existing dual inline memory module to expose a solder pad zone, and disposing of a conduction element or arranging a conductor line to have the memory units and the connection interface of electrically connected to thereby form an improved memory module structure.

Abstract: A power supply device (104-1) includes a substrate (20) on which an electric component (25) is mounted, a chassis (10) having a chassis surface (11) and a threaded part (10a), a chassis-side resin part (91) connected to a back surface (20a) and the chassis surface (11), a fixation screw (29), and an insulating member (60). The fixation screw (29) fixes both the electric component (25) and the substrate (20) to the chassis (10) by screw-coupling an end part (29c) of the fixation screw (29), exposed in a direction toward the chassis (10) from an open hole formed through the insulating member (60), to the threaded part (10a) of the chassis (10). In addition, the fixation screw (29) brings the electric component (25) and the chassis (10) into electrical noncontact with each other by being placed in an open hole of the insulating member (60).