Patents Examined by Timothy Thompson
  • Patent number: 10109409
    Abstract: A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwan Lee, Chan Yoon, Hye Yeon Cha, Jin Woo Han
  • Patent number: 10109958
    Abstract: An electrical connection system configured to terminate electrical connectors and to transmit digital electrical signals having a data transfer rate of 5 Gigabits per second (Gb/s) or higher. The system includes a first parallel mirrored pair of terminals having a planar connection portion and a second pair of parallel mirrored terminals having a cantilever beam portion and a contact point configured to contact the first terminals.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: October 23, 2018
    Assignee: Delphi Technologies, Inc.
    Inventors: Klara P. Carbone, Leslie L. Jones, Joon Lee, Nicole L. Liptak
  • Patent number: 10104937
    Abstract: An article of footwear, an article of apparel or protective gear can include a tensioning apparatus for tightening, for example, laces, cables or strings or other devices that secure the article to a wearer. The tensioning apparatus receives signals from an input assembly that is in communication with the tensioning apparatus. The input assembly may include pairs of wires that have twisted loops or other curvilinear segments that allow the input assembly to accommodate to different actions by the wearer of the footwear. The input assembly may also include a flexible epoxy cover that protects the connections between the wires and a printed circuit board that includes input devices.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: October 23, 2018
    Assignee: NIKE, Inc.
    Inventors: Tiffany A. Beers, Andrew A. Owings, Steven H. Walker
  • Patent number: 10111348
    Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Shimizu, Kiyoyuki Nakagawa
  • Patent number: 10111321
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Won Park, Dong-Kyun Yu, Ji-Heon Yu, Seung-Yup Lee, Taek-Kyun Choi
  • Patent number: 10103526
    Abstract: A protector applied to a wire harness includes a main body that has a main space formed along a first direction and into which a conductive main wiring material can be inserted; a movable branch that has a movable branch space communicated with the main space and into which a movable branch wiring material branched from the main wiring material can be inserted; a holding unit that can hold the movable branch wiring material inserted into the movable branch space to the movable branch; a rotation support unit that rotatably supports the movable branch relative to the main body, at a wiring position where the movable branch space is placed along a second direction and at a use position where the movable branch space is placed along a third direction; and a fixing unit that can fix the movable branch to the main body at the use position.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: October 16, 2018
    Assignees: YAZAKI CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Michihito Suzuki, Naotaka Sawazaki, Ikuya Takamura, Takumi Banno, Takanori Kawai, Shogo Uchiyama
  • Patent number: 10102944
    Abstract: A multi-core cable for vehicles comprises two power lines, two signal lines, two electric wires, and a jacket. The two power lines are the same in size and material, each comprise an insulation layer composed of an inner layer and an outer layer, and are excellent in abrasion resistance and bending resistance. The two signal lines are the same in size and material and the two lines are twisted as a set to constitute a twisted pair of the signal lines. The two electric wires are the same in size and material and the two wires are twisted as a set to constitute a twisted pair of the electric wires. The two power lines, the twisted pair of the signal lines, and the twisted pair of the electric wires are integrally twisted.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: October 16, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takaya Kohori, Hiroyuki Okawa
  • Patent number: 10104788
    Abstract: A display device includes a first housing, a second housing rotatably connected to the first housing, and a first display panel disposed over the first housing and the second housing. An edge of the first display panel may be bent along at least a portion of at least one of an edge of the first housing and an edge of the second housing.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: October 16, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jinhwan Choi, Taewoong Kim, Boik Park, Taean Seo
  • Patent number: 10102942
    Abstract: An aluminum composite twisted wire conductor includes a center assembled twisted wire positioned closest to a center of the aluminum composite twisted wire conductor in cross-sectional view, a plurality of first-layer assembled twisted wires positioned around the center assembled twisted wire, and a plurality of second-layer assembled twisted wires positioned around the first-layer assembled twisted wires. Each of the center assembled twisted wire, the plurality of first-layer assembled twisted wires, and the plurality of second-layer assembled twisted wires is an assembled twisted wire. The assembled twisted wire comprises a plurality of aluminum strands which are collectively first-twisted and made of aluminum or an aluminum alloy. The center assembled twisted wire, the plurality of first-layer assembled twisted wires, and the plurality of second-layer assembled twisted wires are collectively second-twisted.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: October 16, 2018
    Assignee: YAZAKI CORPORATION
    Inventor: Makoto Ichikawa
  • Patent number: 10096582
    Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: October 9, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: Paul L. Mantiply, Straty Argyrakis
  • Patent number: 10096398
    Abstract: An electrical cable (1) is provided having (1) a conductive element (2), a first layer (3) having polyimide (PI) surrounding said conductive element (2), a second fluorinated layer (4) having at least one fluorinated compound, surrounding the first layer, and optionally at least one fluorinated semiconductor layer having at least one fluorinated compound, where the total thickness of the assembly of fluorinated layers is at least 0.4 mm.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: October 9, 2018
    Assignee: NEXANS
    Inventors: Hakim Janah, Thiery Daumand, Virak Phul, Patrick Rybski, Pascal Clouet, Wilfried Lecluse, Rui Manuel Da Silva
  • Patent number: 10092241
    Abstract: Elongated conductors are provided. Aspects of the elongated conductors include: an elongated structure having a proximal region and a distal region, where the elongated conductor includes two or more insulated conducting members that are in fixed relative position along at least a portion of the elongated structure and extend from the proximal region to the distal region. A pattern of insulation openings among the insulated conducting members is present at one or both of the proximal and distal regions. Aspects of the invention further include methods of making the elongated conductors, as well as devices that include the elongated conductors.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: October 9, 2018
    Assignee: Autonomix Medical, Inc.
    Inventors: Landy Toth, Robert Schwartz
  • Patent number: 10096394
    Abstract: An aluminum alloy wire rod having a composition including Mg: 0.10-1.00 mass %, Si: 0.10-1.00 mass %, Fe: 0.01-1.40 mass %, Ti: 0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Sn: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities, wherein a ratio of (standard deviation of crystal grain size of the aluminum alloy wire rod)/(average crystal grain size of the aluminum alloy wire rod) is less than or equal to 0.57, and a ratio of (diameter of the aluminum alloy wire rod)/(average crystal grain size of the aluminum alloy wire rod) is greater than or equal to 10.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: October 9, 2018
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Shigeki Sekiya, Sho Yoshida, Kengo Mitose
  • Patent number: 10091879
    Abstract: A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material including a first surface, a second surface, and an end surface. The mounting board also includes a first conductor layer and a second conductor layer. The target board includes a mounting surface and a third conductor layer formed on the mounting surface. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate to connect an end portion of the first or second conductor layer to the third conductor layer. One of the end portions not subjected to connection established with the anisotropic conductive material is separated further from the end surface of the base material than another end portion which is connected to the third conductor layer.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: October 2, 2018
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Shigemi Ohtsu
  • Patent number: 10090659
    Abstract: A raintight fitting has a fitting body including a plurality of first cable passageways configured to receive electrical cables. The first cable passageways converge into a second cable passageway, and the second cable passageway is configured to receive the conductors from plural cables received in the first cable passageways. A plurality of cable locks are each located at respective first cable passageways, are engageable with the cables received in the first cable passageways, and are configured to (i) secure the cables within the first cable passageways, and (ii) provide an electrically conductive path between the metallic covering of each cable and the fitting body. A raintight seal extends about the periphery of each first cable passageway, and is configured to form a raintight seal between (i) the fitting body and the electrical cables received within the first cable passageways and (ii) between the first cable passageways and ambient atmosphere.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: October 2, 2018
    Assignee: BRIDGEPORT FITTINGS, INC.
    Inventor: Lawrence J. Smith
  • Patent number: 10090655
    Abstract: A conduit box assembly including: a housing defining an interior chamber; arms extending outward from the housing, wherein the arms each have a wall defining a passage into the chamber; a compressible seal for each of the arms, wherein each seal has an outer surface configured to seat in and abut the wall of the arm receiving the seal, and a cover configured to attached to the housing and cover an open side of the housing, wherein the cover includes arms extending outward from a center portion the cover and the arms are each configured to cover an open side of a respective one of the arms of the housing and compress the seal in the respective arm.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: October 2, 2018
    Assignee: General Electric Company
    Inventors: Edgar Eduardo Luna, Luis Martinez
  • Patent number: 10090084
    Abstract: An insulator for a bus bar of a breaker panel may be modularly sacrificed for the installation of a breaker. The ability to modularly sacrifice insulating portions enables protection of the electrical service worker while installing a new breaker panel or modifying an existing breaker panel.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: October 2, 2018
    Inventor: Travis J. Cronkrite
  • Patent number: 10084293
    Abstract: A frame for a switch cabinet has a plurality of frame profiled elements connected to each other. At least two retainers vertically spaced apart from each other, which have holes for distribution bus bars, are arranged within the outer contour formed by the profiled elements. In an operating position, the retainers are oriented along a vertical axis. An electrically insulating bottom plate is arranged at a first end of the distribution bus bars, the bottom plate having a region of overlap with the distribution bus bars. The bottom plate is detachably supported in a retainer connected to the frame profiled elements.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: September 25, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Thomas Berger, Guenter Doleschal, Georg Reuberger
  • Patent number: 10085344
    Abstract: An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: September 25, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaki Hirota, Yoshikazu Sasaoka, Yasunori Taseda, Shinichiro Kuroiwa
  • Patent number: 10084310
    Abstract: A DC power bus having reduced parasitic inductance and higher tolerable operating temperature is disclosed. In example embodiments, a bus structure overlies a printed circuit board, and an array of capacitors is arranged on a surface of the printed circuit board distal the bus structure. The bus structure comprises an upper metal plate, a lower metal plate, and a dielectric film interposed between the upper and lower metal plates. The capacitors are connected in parallel between conductive planes of the printed circuit board. The upper and lower metal plates of the bus structure are connected to respective conductive planes of the printed circuit board.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: September 25, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Jason C. Neely, Joshua Stewart, Jarod James Delhotal, Jack David Flicker, Geoff L. Brennecka