Patents Examined by Timothy Thompson
  • Patent number: 10020094
    Abstract: An electric conductor may be provided. The electric conductor may comprise a conductor core and a plurality of conductor strands wrapped around the conductor core. The conductor core may comprise a plurality of core strands comprising an overall number of strands. The plurality of core strands may comprise a first portion of core strands and a second portion of core strands. The first portion of core strands may comprise a first number of strands. The first portion of core strands may comprise steel. The second portion of core strands may comprise a second number of strands. The second portion of core strands may comprise a composite material. A ratio of the first number of strands to the overall number of strands and a ratio of the second number of strands to the overall number of strands may be optimized to give the conductor core a predetermined characteristic.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: July 10, 2018
    Assignee: Southwire Company, LLC
    Inventor: Mark A. Lancaster
  • Patent number: 10021779
    Abstract: An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 10, 2018
    Assignee: TopLine Coporation
    Inventor: Martin B. Hart
  • Patent number: 10021785
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
  • Patent number: 10021781
    Abstract: A thin circuit board such as a flexure has a metal support layer forming a substrate, a base insulating layer provided on the metal support layer, a wiring layer being wiring traces provided on the base insulating layer, a cover insulating layer covering the wiring layer, internal terminals provided to the respective wiring traces and sequentially arranged side by side, each one internal terminal of said internal terminals used to be solder-bonded to a corresponding external terminal through solder material, and a wall provided for the solder material on at least any one of adjacent internal terminals of said internal terminals.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: July 10, 2018
    Assignee: NHK Spring Co., Ltd.
    Inventors: Yukie Yamada, Junya Jonishi, Subaru Tomizawa
  • Patent number: 10021796
    Abstract: An electronic control unit according to the present invention includes an electronic control element which includes a printed circuit board that electrically controls respective components of a vehicle, and a heat radiating portion that is provided at one side of the printed circuit board, a housing which accommodates the electronic control element, a connector which connects the electronic control element and the vehicle, a sealing unit which seals a connecting portion between the electronic control element and the connector, and a fixing bracket, and further includes a rivet fastening means in order to fastened the housing and the fixing bracket.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: July 10, 2018
    Assignee: Hyundai Autron Co., Ltd.
    Inventors: Sun Jae Yang, Jun Ho Lee
  • Patent number: 10018882
    Abstract: Embodiments of an apparatus for connection to a light adjustment sheet and conductive interfaces for connection to a light adjustment sheet are described. In one embodiment, an apparatus for connection to a light adjustment sheet include a power source interface configured to be connected to a power source and a sheet interface electrically connected to the power source interface. The sheet interface is configured to connect to the light adjustment sheet such that electricity can be conducted from the power source interface to the light adjustment sheet to switch the light adjustment sheet between different visibility states. Other embodiments are also described.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: July 10, 2018
    Inventors: Bernard Kok Yien Kwan, Winston Cheng
  • Patent number: 10021783
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: July 10, 2018
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
  • Patent number: 10014244
    Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: July 3, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Takamasa Takano
  • Patent number: 10012330
    Abstract: Systems and methods are provided for cable routing, such as within vehicles or structures. In certain examples, a cable holder is disclosed that includes one or more loop members with an interior groove and a rotatable cable holding member disposed within the interior groove. The rotatable cable holding member can be configured to rotate to decrease bends and/or stresses within the cable that the rotatable cable holding member is holding. Additionally, the rotatable cable holding member can be configured so that the cable held is perpendicular to the support for the cable.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 3, 2018
    Assignee: The Boeing Company
    Inventors: Daniel S. Thomas, Jeffrey R. Dempsey
  • Patent number: 10015876
    Abstract: The object of the present invention is to provide a printed circuit board that improves the heat radiating effect as the entire printed circuit board and a manufacturing method for such a printed circuit board.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 3, 2018
    Assignee: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Keiichiro Yamamoto, Kazuhiro Sasamoto
  • Patent number: 10009997
    Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: June 26, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroharu Inoue, Koji Kishino
  • Patent number: 10010016
    Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-deok Lim, Jung-je Bang, Hyun-tae Jang, Hye-in Park, Jae-heung Ye, Chan-beom Jeong, Sae-bom Lee, Yong-won Lee
  • Patent number: 10009992
    Abstract: A hybrid PCB system has a hybrid redistribution layer that redistributes a large pad-to-pad pitch to a smaller, finer pad-to-pad pitch and applies hybrid materials to balance the thermal-mechanical stress. The hybrid PCB system combines wafer level packaging, IC substrate and high density PCB technologies within a single hybrid PCB. The hybrid PCB system addresses the opportunity for interconnect reliability, design and assembly of a electronic components with pad pitches less than 400 microns directly to a PCB without need of an IC substrate or interposer.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: June 26, 2018
    Assignee: Multek Technologies Limited
    Inventors: Joan K. Vrtis, Michael James Glickman, Todd Robinson, Hollese Galyon
  • Patent number: 10008309
    Abstract: A hybrid cable is provided that transmits both electrical power and optical signals. The hybrid cable has a transverse cross-sectional shape with multiple lobes and a generally circular outer boundary. At least some of the lobes surround and insulate the electrical conductors. The lobes surrounding the electrical conductors can be torn away from the remainder of the cable while continuing to insulate the electrical conductors.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 26, 2018
    Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBA
    Inventors: Adam Broughton, David J. Walker, Aly Fahd
  • Patent number: 10008305
    Abstract: A wire harness includes one or more electrically-conducting paths, a tubular shielding member configured to collectively accommodate the electrically-conducting paths, a braided shielding member including a cylindrical braided member and connected to an end of the tubular shielding member, and an annular crimping member including a fixing portion which fixedly connects the braided shielding member and the tubular shielding member by crimping, and a bent portion which is formed by bending an open end of the fixing portion to outside of the fixing portion.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: June 26, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Eiichi Toyama, Shigemi Hashizawa
  • Patent number: 10008304
    Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, wherein an air gap is formed between the conductive wires. The flexible flat cable according to the present invention includes a plurality of conductive wires (15) disposed between an upper film (11) and a lower film (13), wherein the conductive wires (15) are fixed by a first thermal bonding resin (12) of the upper film (11) and a second thermal bonding resin (14) of the lower film (13), an air gap (16) is formed between the conductive wires (15), and a side end of the upper film (11) and a side end of the lower film (13) are bonded by the first thermal bonding resin (12) and the second thermal bonding resin (14).
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: June 26, 2018
    Inventor: Hee jun Yoon
  • Patent number: 10003183
    Abstract: A cable management system has an outer rotating plug. An inner rotating plug is disposed off-center from and within the outer rotating plug. The inner rotating plug is rotatable independent of a rotation of the outer rotating plug. A tower extends from the inner rotating plug and has an arm pivotally connected to the tower which defines a cable guide.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: June 19, 2018
    Assignee: TerraPower, LLC
    Inventors: Peter W. Gibbons, Ashok Odedra, P. Harley Park, James B. Waldo
  • Patent number: 10002691
    Abstract: An improved Ethernet cable with an undulating and folding jacket housing external spatial channels. The undulating housing provides for multiple connection configurations from a flat cable to rectangular block configurations. The cable has a plurality of internal electronic signal channels, each channel having a pair of conductors. Each channel is also further isolated by a multi-layer protective shield, the protective shield encasing the pair of conductors. This unique design meets the new requirements of CAT8 cables, and substantially enhances video and audio streaming and transmission speeds, while eliminating deleterious effects of prior cables.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: June 19, 2018
    Assignee: WIREWORLD BY DAVID SALZ, INC
    Inventor: David Salz
  • Patent number: 10002688
    Abstract: An electrical cable has a plurality of generally rectangular cross-section conductors superposed in a stack, the stack surrounded by a polymer jacket. The stack may be provided with a lubrication layer provided between at least two of the conductors. Conductors of the stack may have a thickness that is greater proximate the middle of the stack than at the top and bottom of the stack and/or a width that is less at the top and the bottom than at the middle. Further stacks may also be provided parallel and coplanar with the first stack, also surrounded by the polymer jacket.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: June 19, 2018
    Assignee: CommScope Technologies LLC
    Inventor: Frank A. Harwath
  • Patent number: 9999133
    Abstract: A flexible printed circuit board includes a base substrate, a first pad part on the base substrate, a second pad part on the base substrate, and a line part on the base substrate, the line part electrically connecting the first pad part and the second pad part. The base substrate includes a first body part including the first pad part thereon and having a curved edge, a second body part including the second pad part thereon, and a connection part between the first pad part and the second pad part and having a width decreasing as a distance from the first body part increases and a distance from the second body part decreases.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: June 12, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jaehyung Cho, Ahyoung Son, Heesoon Jeong, Myungho Lee