Abstract: Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor including a ceramic body, and external electrodes disposed on first and second end surfaces of the ceramic body. First and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor, the first and second metal frames each disposed along upper and lower surfaces of the multilayer ceramic capacitor. An insulating cover encloses the multilayer ceramic capacitor and upper portions of the first and second metal frames. Lateral portions of the first and second metal frames disposed along end surfaces of the multilayer ceramic capacitor are in contact with the insulating cover, and lower portions of the first and second metal frames disposed along lower surfaces of the multilayer ceramic capacitor are spaced apart from the insulating cover by an interval.

Abstract: An electric energy transmission tether for an airborne wind power station comprises an elastic core, a first layer of one or more electric conductors helically wound around the elastic core, an electric insulation layer surrounding the first layer of electric conductors, a second layer of one or more electric conductors helically wound around the electric insulation layer, and a load bearing layer surrounding the second layer of electric conductors, for absorbing tensile forces and radial pressure forces acting on the tether.

Abstract: The present application relates to a reinforced cable used for submersible pump, consisting of a fluororubber sheath, a filler, wire ropes and signal cables. The wire ropes and the signal cables are arranged in a central region of the cable; the filler is filled in the surrounding, and the fluororubber sheath is extruded outside the filler; and the signal cable comprises a conductor and an insulating bush, a sintered membrane is formed on an outer wall of the conductor, and the insulating bush is extruded outside the conductor.

Abstract: A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.

Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.

Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.

Abstract: An insulated wire, having at least one layer as an insulation layer, on an outer periphery of a conductor, wherein at least one layer as the insulation layer is composed of a mixed resin of a crystalline resin (A) and a resin (B) having a glass transition temperature higher, by 30° C. or more, than a glass transition temperature of the crystalline resin (A), in which the glass transition temperature is measured by a thermomechanical analysis, and a mixing mass ratio of the mixed resin (a mass of the crystalline resin (A):a mass of the resin (B)) is 90:10 to 51:49; a coil; an electric or electronic equipment; and a method of producing the insulated wire.

Abstract: Disclosed are examples of a device that is mountable on a surface of an occupiable space in a building. The device may include an input interface plate that protrudes from the surface into the occupiable space of the building, while a portion of the device remains within the interior space of the building's surface. The device enables wireless control of a remote device, such as a luminaire, outlet or the like. The device is convertible between being powered by a stand-alone power source, such as a battery, and being powered by a power module that connects to the building's alternating current electrical power supply. The power module is configured to connect to the building's alternating current electrical power supply, convert the provided electrical power to a direct current electrical power appropriate for use by the device.

Abstract: A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

Abstract: A cable (210) includes a center conductor (220). An insulating material in the form of a layer (225) surrounds the center conductor. A sparse shield (232) partially surrounds the insulating material. The sparse shield may include a plurality of conductors, which are grouped adjacent to one another within a space around the insulating layer that has a length that is less than 25% of the total circumference of the insulating layer. An insulating jacket (227) covers the sparse shield and the remainder of the cable. The cable may be used in a cable assembly (10).

Abstract: A plurality of electronic wires are fixed by a mold part in a state arranged in at least two rows. The mold part has a first end face from which the electronic wires of a first row in the plurality of electronic wires protrude and a second end face from which the electronic wires of a second row in the plurality of electronic wires protrude. An angle of the first end face with respect to a direction of a central axis line of a multi-core cable differs from an angle of the second end face with respect to the direction of the central axis line. The electronic wires of the first row in the first end face protrude along a direction away from the electronic wires of the second row protruding from the second end face.

Abstract: A housing includes a main housing part with an opening as well as a covering device for the opening. The covering device has a first cover part, which at least substantially covers the opening and a second cover part which is separate from the first cover part, bears at least in certain regions against the first cover part and has at least one clearance or aperture in the region of the opening. The second cover part is fastened or supported at the main housing part, in particular in the region of a periphery of the main housing part that extends or runs around the opening. The weight of the covering device is therefore low and yet a high level of stability and sealing in relation to fluids is provided.

Abstract: There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.

Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

Abstract: Provided are a circuit board and a display apparatus in which, when a worker restores a cut wiring with laser, the worker may easily determine a portion to be irradiated with laser by the naked eye. In a circuit board including multiple layered wiring parts (G, O) and an insulating part deposited between layers of the wiring parts (G, O), the insulating portion has a missing part (F) at a superposed position where the wiring parts are superposed onto each other in a layered direction, and a marker (P) indicating the presence of the missing part (F) is formed.

Abstract: Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms/square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation.

Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

Abstract: An insulation material for use in a plenum-rated communications cable, as well as components formed from the insulation material are described. The insulation material may include a base polymeric material having a first melting point, the first melting point lower than a temperature at which the insulation material is extruded to form a cable component. The insulation material may also include a polymeric filler material blended throughout the base polymeric material, the filler material having a second melting point greater than the temperature at which the insulation material is extruded.

Abstract: [Object] Provided are an electrode substrate film which does not cause trouble in a process to create a circuit pattern formed of a metal thin line and in which the circuit pattern is less visible even under highly bright illumination, and a method of manufacturing the same. [Solving Means] An electrode substrate film with a transparent substrate 52 and a metal laminate thin line includes a metal absorption layer 51 with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer 50 as a second layer, counted from the transparent substrate side. Optical constants of the metal absorption layer in a visible wavelength range (400 to 780 nm) satisfy conditions that a refractive index is 1.8 to 2.2 and an extinction coefficient is 1.8 to 2.4 at a wavelength of 400 nm, the refractive index is 2.2 to 2.7 and the extinction coefficient is 1.9 to 2.8 at a wavelength of 500 nm, the refractive index is 2.5 to 3.2 and the extinction coefficient is 1.9 to 3.