Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.
Abstract: A telecommunications chassis is configured for receiving telecommunications equipment. The chassis defines a top, a bottom, a front side, a rear side, a right side, and a left side. The chassis defines a central longitudinal axis extending between the top and the bottom. A first pair of panels is located at the front side, a second pair of panels is located at the rear side, a third pair of panels is located at the right side, and a fourth pair of panels is located at the left side. Each panel defines a plurality of receptacles for receiving the telecommunications equipment. When mounted to a fixed surface, the chassis is rotatable relative to the fixed surface about the central longitudinal axis. Each panel is pivotable away from the other panel of the any given pair of panels about a pivot axis parallel to the central longitudinal axis.
Type:
Grant
Filed:
January 15, 2016
Date of Patent:
May 29, 2018
Assignee:
CommScope Connectivity Belgium BVBA
Inventors:
Didier Pierre W Claeys, Danny Ghislain Thijs
Abstract: An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.
Abstract: A transparency includes a transparent substrate and a plurality of electrically conductive lines on the transparent substrate, at least one of the electrically conductive lines intersecting at least one other electrically conductive line, and at least one of the electrically conductive lines having a width of no more than 50 ?m to reduce distraction resulting from optical diffraction of light transmitted through or reflected by the transparency as compared to a transparency comprising electrically conductive lines having a width greater than 50 ?m. A coated substrate includes: a substrate; a dielectric layer on the substrate; and a sensor including a conductive layer on the dielectric layer, where at least one layer selected from the dielectric layer and the conductive layer is formed by at least one method selected from lithography, inkjet printing, and aerosol jet printing.
Type:
Grant
Filed:
January 28, 2016
Date of Patent:
May 29, 2018
Assignee:
PPG INDUSTRIES OHIO, INC.
Inventors:
Krishna K. Uprety, Alexander Bimanand, Khushroo H. Lakdawala
Abstract: A stranded electrical conductor includes a single center strand in aluminum or aluminum alloy (10, 20, 30, 40A, 50A) and a plurality of conductor strands (11, 21, 31, 41, 51) arranged in at least one layer around said center strand. The relation between the diameter of said center strand in aluminum or aluminum alloy and the diameter of said peripheral conductor strands is greater than or equal to 3.
Type:
Grant
Filed:
December 9, 2016
Date of Patent:
May 29, 2018
Assignee:
NEXANS
Inventors:
Patrick Rybski, Sébastien Dablement, Werner Wilcken
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of first and second internal electrodes, the capacitor body having a first surface and a second surface opposing each other, the capacitor body having a third surface and a fourth surface connected to the first surface and the second surface and opposing each other, and first and second band portions extended from the first and second connection portions to portions of the first surface and the second surface of the capacitor body and portions of a fifth surface and a sixth surface of the capacitor body, respectively, an insulating layer covering the first and second band portions, and a first terminal electrode and a second terminal electrode covering the first and second external electrodes, and portions of the insulating layer disposed on the first surface of the capacitor body and spaced apart from each other.
Type:
Grant
Filed:
July 17, 2017
Date of Patent:
May 22, 2018
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventors:
Heung Kil Park, Jong Hwan Park, Se Hun Park
Abstract: A flexible display panel includes a display area to display an image, and a non-display area disposed outside the display area. The non-display area includes a first portion and a second portion. The first portion extends from the display area, and includes a support layer disposed on a flexible substrate. The second portion extends from the first portion, and is bent from a plane of the first portion. A property of a material of the support layer in the first portion is different than the property of the material of the support layer in the second portion.
Type:
Grant
Filed:
November 11, 2016
Date of Patent:
May 22, 2018
Assignee:
Samsung Display Co., Ltd.
Inventors:
Ohjune Kwon, Seungyong Song, Jeongdo Yang, Seung-Hwa Ha, Sanghyeon Song, Jungyun Jo, Jeongho Hwang
Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.
Abstract: A communication cable may include a plurality of twisted pairs and a plurality of discrete components of insulation material positioned in the interstices between the plurality of twisted pairs. Each of the discrete components may have a largest dimension that is no greater than approximately 250 microns. The discrete components may provide separation between two or more of the twisted pairs. A jacket may be formed around the plurality of twisted pairs and the plurality of discrete components.
Abstract: An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and a cell pattern is made by forming penetrating holes through the core layer in some of the cells but not in remaining ones of the cells, wherein the penetrating holes are filled with resin, and an end face of the resin is exposed on the same side as the first surface such that the interconnection layer is situated in a surrounding area of the end face but not over the end face, and wherein a number of interconnection layers over the end face is smaller than a number of interconnection layers in the surrounding area of the end face.
Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.
Abstract: Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.
Type:
Grant
Filed:
May 4, 2016
Date of Patent:
May 15, 2018
Assignee:
Apple Inc.
Inventors:
Daniel D. Sunshine, Daniel A. Podhajny, Kathryn P. Crews, Kirk M. Mayer, John Arthur Maasberg
Abstract: The present invention provides a system and method for producing superconducting joints between superconductive segments of a Bi-2212 high-temperature superconducting (HTS) conductor, thereby eliminating the heat generating resistive joints that are commonly known in the art for connecting two or more smaller Bi-2212 conductive segments to create an Bi-2212 conductor of adequate length.
Type:
Grant
Filed:
February 24, 2016
Date of Patent:
May 8, 2018
Assignee:
The Florida State University Research Foundation, Inc.
Inventors:
Ulf Peter Trociewitz, Peng Chen, David K. Hilton, Dmytro V. Abraimov, William L. Starch, David C. Larbalestier, Jianyi Jiang, Eric E. Hellstrom, Ernesto S. Bosque, Maxime Matras
Abstract: An electric wire and a shielding member configured to electrically shield the electric wire by enclosing an outer circumference thereof. A core wire of the electric wire has a single-core portion which is formed by applying pressure to a portion of a conductor obtained by twisting a plurality of strands together to reduce their cross section. This causes the strands to be brought into intimate contact with each other and form a single body, and a stranded wire portion in which the strands remain in a twisted-together state with no pressure having been applied thereto. The shielding member has a first shielding portion enclosing a portion of the electric wire where the core wire constitutes the single-core portion, and a second shielding portion enclosing a portion of the electric wire where the core wire constitutes the stranded wire portion. The second shielding portion has higher flexibility than the first shielding portion.
Abstract: An insulating component having a first core accommodating section that receives a first magnetic body core, a second core accommodating section that receives a second magnetic body core, and a locking section. The first core accommodating section has two parallel core leg section accommodating sections that individually surround one of at least two leg sections of the first magnetic body core. The second core accommodating section is configured to surround the second magnetic body core. An aperture section is formed in the insulating component between the two parallel core leg section accommodating sections. The locking section is configured to be locked to a bus bar inserted into that aperture section.
Abstract: A hollow cover boot formed of an elastomeric material includes, in merging succession, a cable collar, a main section, a transition section, and an interconnection section, wherein the main section has a diameter greater than the cable collar and the interconnection section, and the transition section tapers between the main section and the cable collar.
Abstract: An electronic device is disclosed. An electronic device comprises a first magnetic sheet, a coil, and a board. The first magnetic sheet has a first surface and a second surface opposite to the first surface. The coil is located on the first surface. The board has a third surface facing the second surface and has a first component on the third surface. The first magnetic sheet has a through hole that penetrates therethrough from the first surface to the second surface in a region of the first surface, the region being surrounded by the coil. The first component has a first portion facing the through hole.
Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.
Type:
Grant
Filed:
April 29, 2016
Date of Patent:
May 8, 2018
Assignee:
KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventors:
Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
Abstract: A package substrate including an insulating layer having a top surface and a bottom surface opposite to the top surface, at least one first copper pattern disposed in the insulating layer and adjacent to the top surface of the insulating layer, at least one second copper pattern disposed on the bottom surface of the insulating layer, and at least one embedded aluminum pad disposed on the at least one first copper pattern, the at least one embedded aluminum pad disposed in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer may be provided.
Abstract: A shielded wire is connected to a high-voltage system and conducting high-voltage communication. The shielded wire includes a wire section and a first shielding layer. The first shielding layer covers the wire section. The first shielding layer is grounded to the high-voltage system or an object with the same potential as the high-voltage system.