Abstract: A system, a memory device and a method are contemplated in which the apparatus may include a plurality of memory cells, a plurality of voltage reduction circuits, and control circuitry. The plurality of voltage reduction circuits may be configured to reduce a voltage level of a power supply coupled to the plurality of memory cells. The control circuitry may be configured to select one of the voltage reduction circuits based on one or more operating parameters. The control circuitry may be further configured to activate the selected voltage reduction circuit upon receiving a write command directed towards the memory cells. The control circuitry may be further configured to execute the write command. Upon completion of the write command, the control circuitry may be further configured to de-activate the selected one of the voltage reduction circuits.

Abstract: An element according to an embodiment can transit between at least two states including a low-resistance state and a high-resistance state. The element comprises a first electrode, a second electrode, a first layer and a second layer. The first electrode includes metal elements. The first layer is located between the first electrode and the second electrode while contacting with the first electrode. The second layer is located between the first layer and the second electrode. At the low-resistance state, a density of the metal elements in the first layer is higher than that of the metal elements in the second layer. The density of the metal elements in the first layer at the low-resistance state is higher than that of the metal elements in the first layer at the high-resistance state. A relative permittivity of the second layer is higher than a relative permittivity of the first layer.

Abstract: A resistance memory includes a resistance memory cell having a resistance memory element and a two-terminal access device in series. The two-terminal access device affects the current-voltage characteristic of the resistance memory cell. The resistance memory additionally includes a circuit to apply across the resistance memory cell a set pulse having a set polarity to set the resistance memory cell to a low-resistance state that is retained after application of the set pulse, a reset pulse having a reset polarity, opposite to the set polarity, to reset the resistance memory cell to a high-resistance state that is retained after application of the reset pulse, and a read pulse of the reset polarity and smaller in magnitude than the reset pulse to determine the resistance state of the resistance memory cell without changing the resistance state of the resistance memory cell.

Abstract: According to one embodiment, a resistance change type memory includes a first and a second bit lines, a memory cell connected between the first and second bit lines and including a variable resistance element as a memory element and a first select element including a first control terminal connected to a word line, and an auxiliary circuit connected to the first bit line and including a second select element including a second control terminal connected to a control line. When data is read from the memory cell, a first current in a read current supplied to the first bit line is supplied to the memory element and the first select element, and a second current in the read current is supplied to the second select element.

Abstract: Embodiments of the present invention include an apparatus, method, and system for integrating data processing logic with memory. An embodiment of a memory integrated circuit is designed to execute a task on the data in a memory array within a memory integrated circuit. The memory integrated circuit can include a memory array, a data access component, a data holding component, and a logic component. The data access component can be coupled to the memory array and configured to provide an address to the memory array. The data holding component can be coupled to the memory array and configured to temporarily store the data in the memory array located at the address. The logic component can be coupled to both the data access component and the data holding component, and be configured to execute a task using data received from the data holding component. The logic component can include combinational or sequential logic.

Abstract: A semiconductor includes a plurality of memory cell arrays each of which includes a plurality of memory cells. Bitlines extend in one direction in the memory cell arrays to transfer data stored in the memory cells. Wordlines extend perpendicular to the bitlines in the memory cell arrays to select at least one of the memory cells. Local data lines extend parallel to the wordlines outside of the memory cell arrays and convey signals from bitlines. Global data lines convey signals from the local data lines. The global data lines include a part extending parallel to the wordlines and the part is disposed over another one of the memory cell arrays other than a selected memory cell array.

Abstract: To provide a semiconductor device with such a new structure that the effect of variation in transistor characteristics can be reduced to achieve less variation in the output voltage of a memory cell. A memory cell includes a source follower (common drain) transistor for reading data held in a gate. A voltage applied to a transistor generating a reference current flowing through the memory cell is determined so that a gate-source voltage is approximately equal to the threshold voltage of the transistor. With such a structure, data stored in the memory cell can be read as a voltage that is less influenced by variation of transistors such as the field-effect mobility and the size.

Abstract: Apparatus and methods utilize a replica circuit to generate a voltage for programming of a memory cell, such as a memory cell of a phase-change memory (PCM). Current passing through a circuit including the memory cell to be programmed is mirrored in a scaled or unscaled manner, and provided as an input to the replica circuit. The replica circuit represents voltage drops that should be encountered when programming the memory cell. An input voltage is also provided to the replica circuit, which affects the voltage drop within the replica circuit that represents the voltage drop of the cell. The voltage drop across the replica circuit can then be mirrored and provided to bias the circuit including the memory cell.

Abstract: Semiconductor memories are provided. The Semiconductor memory includes a plurality of sense amplifiers, plurality sets of master data line segments and a plurality of memory segments. The plurality sets of master data line segments are arranged in a column direction. Each memory segment includes a plurality of memory cells, and is coupled to a set of corresponding master data line segments via a corresponding sense amplifier. Adjacent sets of corresponding master data line segments are coupled together. When accessing memory data, the memory data are transferred by the adjacent sets of corresponding master data line segments which are coupled together.

Abstract: Designs and programming schemes can be used to form memory arrays having low power, high density and good data retention. High resistance interconnect lines can be used to partition the memory array can be partitioned into areas of high data retention and areas of low data retention. Variable gate voltages can be used in control transistors to store memory values having different data retention characteristics.

Abstract: A method of reading a memory device having rows and columns of memory cells formed on a substrate, where each memory cell includes spaced apart first and second regions with a channel region therebetween, a floating gate disposed over a first portion of the channel region, a select gate disposed over a second portion of the channel region, a control gate disposed over the floating gate, and an erase gate disposed over the first region. The method includes placing a small positive voltage on the unselected source lines, and/or a small negative voltage on the unselected word lines, during the read operation to suppress sub-threshold leakage and thereby improve read performance.

Abstract: The semiconductor memory device may include a power control signal generator and a sense amplifier circuit. The power control signal generator may generate a first power control signal in response to a detection signal generated from detecting a level of a power supply voltage signal. The sense amplifier circuit may generate a first power signal driven to have a first drive voltage in response to the first power control signal. The sense amplifier circuit may sense and amplify a level of a bit line using the first power signal as a power supply voltage.

Abstract: Decoding blocks, memories, and methods for decoding pre-decoded address information are disclosed. One such decoding block includes a first latch and voltage shift circuit configured to receive first pre-decoded address information at first voltage levels and further configured to latch the first pre-decoded address information and shift the voltage levels of the same to second voltage levels. An address decoder includes a second latch and voltage shift circuit configured to receive second pre-decoded address information at the first voltage levels and latch and shift the voltage levels of the same to the second voltage levels. The address decoder is further configured to select control gates of the memory cells of the memory based at least in part on the first and second pre-decoded address information.

Abstract: A ultra-violet sensor has a gate on a substrate, a dielectric formed over the gate and the substrate, an oxide semiconductor formed over the dielectric, and a source electrode and a drain electrode formed at the edges of the oxide semiconductor. A memory device has an array of ultra-violet sensors, each sensor having a gate on a substrate, a dielectric formed over the gate and the substrate, an oxide semiconductor formed over the dielectric, and a source electrode and a drain electrode formed at the edges of the oxide semiconductor, an array of ultra-violet light sources corresponding to the array of ultra-violet sensors, an array of detectors electrically coupled to the array of ultra-violet sensors, driving circuitry attached to the array of sensors and the ultra-violet light sources to allow addressing of the arrays, and a reset mechanism.

Abstract: Disclosed herein is a device includes first and second memory mats. The first memory mat includes first and defective memory cells and first local bit lines coupled to a first global bit line. Each of the first local bit lines is coupled to associated ones of the first memory cells, one of the first local bit lines is further coupled to the defective memory cell. The second memory mat includes second and redundant memory cells and second local bit lines coupled to a second global bit line. Each of the second local bit lines is coupled to associated ones of the second memory cells, one of the second local bit lines is further coupled to the redundant memory cell. The device further includes a control circuit accessing the redundant memory cell when the access address information coincides with the defective address information that designates the defective memory cell.

Abstract: A semiconductor memory device includes two memory cell arrays, a sense amplifier shared by the two memory cell arrays; and a control circuit configured to control data readout from the two memory cell arrays. Each memory cell array includes word lines, two or more bit lines, a dummy word line, memory cells provided at intersections of the bit lines and the word lines, and dummy cells provided at intersections of selected bit lines and the dummy word line. When the control circuit reads data from one memory cell array, the control circuit activates the dummy word line included in the other memory cell array and generates, with the dummy cell included in the other memory cell array, a reference level of the sense amplifier.

Abstract: A semiconductor device may include a write control block configured to generate a plurality of write enable signals for controlling a write operation, and a write delay block configured to apply delay times to a plurality of write data which are transmitted through a write global input/output line. The semiconductor device may also include a plurality of banks configured to operate in response to the plurality of write enable signals and receive the plurality of write data, wherein the plurality of write data have different delay times according to physical positions of the plurality of banks.

Abstract: A non-volatile memory, such as a one-time programmable memory, with a dual purpose read/write cache. The read/write cache is used as a write cache during programming, and stores the data to be written for a full row of the memory array. The programming operation simultaneously programs all cells in the selected row based on the contents of the write cache. In subsequent read operations, the read/write cache is used as a read cache. A full row of the array is simultaneously read in a read access, and the contents of that row are stored in the read cache. Subsequent access to that same row causes the data to be read from the read cache rather than requiring access of the array.

Abstract: A method is disclosed for setting or modifying a threshold voltage in a NAND flash memory, using an optimization method and based on an error, such as stored in a threshold voltage table. In an embodiment, a method is provided to optimize the read voltage on a NAND flash memory in order to minimize the errors on the NAND flash memory in the fewest reads operations as possible. Advantageously, the method of the present disclosure is more reliability as the method minimizes a Raw Bit Error Rate (RBER) on the NAND flash memory. In an embodiment, a NAND controller adjusts an existing cell read threshold voltage for a selected cell, using an iterative optimization method, based on a difference between first and second error rates, or a difference between first and second probabilities, to generate an adjusted cell read threshold voltage.

Abstract: A write-assisted memory includes a pre-charge assist circuit that assists the pre-charge of the power supply voltage on a power supply lead for an accessed memory cell in a bit-line-multiplexed group of memory cells subsequent to a write-assist period by coupling charge from the power supply leads for the remaining non-accessed memory cells in the bit-line-multiplexed group of memory cells.