Abstract: A stationary induction apparatus includes a core, a winding, a tank, a refrigerant, a radiator, and a unit cooler. The winding is wound around the core as a central axis. The tank contains the core and the winding. The refrigerant is filled into the tank. The radiator is mounted to the tank and includes a first heat exchange unit capable of naturally air-cooling the refrigerant that is naturally convecting while allowing the refrigerant to flow therethrough. The unit cooler is mounted to the tank and includes a pump to forcibly circulate the refrigerant, and a second heat exchange unit to forcibly air-cool the refrigerant that is being forcibly circulated while allowing the refrigerant to flow therethrough.

Abstract: A coil component includes an element and a coil disposed in the element. The element includes a plurality of first magnetic layers and second magnetic layers laminated. The coil includes a plurality of coil conductive layers laminated. Each of the coil conductive layers is disposed between a corresponding one of the first magnetic layers and a corresponding one of the second magnetic layers. A pore area proportion in the second magnetic layers is smaller than a pore area proportion in the first magnetic layers. A void is present between the coil conductive layer and the corresponding one of the second magnetic layers.

Abstract: A transformer comprising a primary winding and a secondary winding. The primary winding has N2 number turns and having a first terminal and a second terminal. The secondary winding has having N1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N2:(N3/N1) where N2 is an integer equal to or greater than 1, N1 is an integer greater than or equal to 2, and N3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.

Abstract: An electronic component includes: a multilayer body; an inductor constituted of a plurality of inductor conductor layers and a via hole conductor, the inductor having a helical shape; a first outer electrode provided on a first end surface formed by contiguous outer edges of the insulation layers; and a second outer electrode provided on a second end surface. The plurality of inductor conductor layers have a first inductor conductor layer connected to the first outer electrode, and a second inductor conductor layer adjacent to the first inductor conductor layer on another side in the lamination direction. The via hole conductor connecting the first inductor conductor layer and the second inductor conductor layer is provided closer to the first outer electrode than the second outer electrode, and when viewed in plan view from a normal direction of the first end surface, does not overlap with the first outer electrode.

Abstract: A common-mode choke coil includes a core having a winding core portion, a first winding and a second winding. A winding start side region ranges from one end portion to a position where a first winding is brought into contact with the winding core portion, and a winding finish side region ranges from the other end portion to a position where a second winding is brought into contact with the winding core portion. The first winding is wound on the winding core portion such that the first winding is positioned on a negative direction side in an x axis direction with respect to the second winding at the same turn in the winding start side region and the second winding is interposed between the first winding and the winding core portion in the winding finish side region.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 ?m or less and a plating layer disposed on the seed layer.

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.

Abstract: A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

Abstract: The primary coil assembly, which includes a primary coil interposed between a pair of secondary coils and configured to perform electromagnetic mutual induction, and includes: a bonding coil having both ends connected to primary-side terminal pins of the transformer; a first PCB member provided on an upper surface of the bonding coil and configured to constitute an upper-side auxiliary winding of the primary coil; and a second PCB member provided on a lower surface of the bonding coil and configured to constitute a lower-side auxiliary winding of the primary coil.

Abstract: A high voltage power supply is disclosed. The high voltage power supply comprises a primary winding and one or more secondary windings. In one embodiment, a single secondary winding is used and the high voltage doubler circuit comprises a capacitor string and a diode string. In another embodiment, a plurality of secondary windings are used and the high voltage doubler circuit comprises a plurality of low voltage doubler circuits arranged in series. To create a more uniform distribution of voltage across the capacitors in the high voltage doubler circuit, one or more shields are disposed on the printed circuit board. In certain embodiments, a high voltage shield is disposed at the high voltage output and a low voltage shield is disposed at the low voltage end of the high voltage doubler circuit. One or more intermediate shields may be disposed in the high voltage doubler circuit.

Abstract: A surface mount inductor includes a molded body made of a composite material containing magnetic powder, and a metal plate including a first metal plate portion embedded in the molded body and a second metal plate portion extending from the first metal plate portion to an outside of the molded body. The second metal plate portion is extended from a side surface or mounting surface side of the molded body, is arranged along the molded body with a bent portion, and forms an external terminal arranged at least on the mounting surface side of the molded body. The external terminal includes a plating layer on a surface on an opposite side from a surface facing the molded body, and does not include a plating layer on the surface facing the molded body.

Abstract: A coil electronic component includes a support substrate having a first surface and a second surface opposing each other, a coil pattern disposed on the first surface of the support substrate, first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively, an encapsulant encapsulating the support substrate and the coil pattern, and first and second external electrodes disposed on a lower surface of the encapsulant and electrically connected to the first and second conductive vias, respectively. The support substrate is disposed between the lower surface of the encapsulant and the coil pattern.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.

Abstract: An inductor device includes first trace, second trace, third trace, fourth trace, first capacitor, and second capacitor. One terminal of each of the at least two sub-traces of first trace are coupled to each other at first node. One terminal of each of the at least two sub-traces of second trace are coupled to each other at second node. One terminal of third trace is coupled to second trace, and another terminal of third trace is coupled to first input/output terminal. One terminal of fourth trace is coupled to first trace, and another terminal of fourth trace is coupled to second input/output terminal. First capacitor is coupled to first node and second node. Second capacitor is coupled between first node and first input/output terminal, or coupled between first node and second input/output terminal, or coupled between first input/output terminal and second input/output terminal.

Abstract: A resonant coil with integrated capacitance includes at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner. Each of the plurality of conductor layers includes a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers. Adjacent conductor layers of the plurality of conductor layers have different orientations.

Abstract: A single/Multi-phase PMIC built on silicon substrate with coil layers processed on top of the PMIC layers' is provided. The integrated coil is in a spiral form, with a gap at the center of the coil, making additional metal routing not required. The integrated coil has connection pads located in the center gap of the spiral form, limiting the overall inductor resistance to the device only. The on-die inductor may have a magnetic core wrapping the windings. The spiral form may be implemented in a circular design, or a racetrack (elongated spiral) design. The coil layers may be implemented as multiple coil layers or as a single coil layer, connected in parallel (with the same I/O pads), reducing the resistance and maintaining the inductance.

Abstract: Disclosed herein is an apparatus that includes a substrate having first and second surfaces opposite to each other, a first coil pattern formed on the first surface of the substrate, and a second coil pattern formed on the second surface of the substrate. The first coil pattern includes first and second lines, and the second coil pattern includes third and fourth lines. The first line is greater in a number of turn than the second line, and the third line is greater in a number of turn than the fourth line. The first line is connected to the fourth line, and the third line is connected to the second line.