Patents Examined by Tszfung J Chan
  • Patent number: 11521790
    Abstract: A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: December 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Gu Yeo, Byeong Cheol Moon
  • Patent number: 11521788
    Abstract: An inductor includes a plurality of wires disposed about an axis, a first electrode connected to a first end of each of the plurality of wires, and a second electrode connected to a second end of each of the plurality of wires. Each of the wires includes an outer-winding helical portion shifting in an axial direction while gradually increasing a radius thereof, an inner-winding helical portion shifting in the axial direction while gradually reducing a radius thereof, and an outer circumference connection portion that connects an end of the outer-winding helical portion and an end of the inner-winding helical portion at different positions in the axial direction.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: December 6, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Seiji Hidaka
  • Patent number: 11515069
    Abstract: A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: November 29, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Hirotaka Fujii
  • Patent number: 11508513
    Abstract: A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: November 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Toshiro Adachi, Masataka Nakaniwa
  • Patent number: 11501915
    Abstract: There are provided a coil component and a method of manufacturing the same. The coil component includes: a body portion including a magnetic material; a coil portion disposed in the body portion; and an electrode portion disposed on the body portion, wherein the coil portion includes a support member having groove portions formed in at least one surface thereof and a coil conductor layer filling the groove portions and protruding onto the at least one surface of the support member, the groove portions having planar spiral shapes.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Wook Bong, Byeong Cheol Moon, Boum Seock Kim
  • Patent number: 11495390
    Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: November 8, 2022
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 11488761
    Abstract: A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: November 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuto Shiga, Hajime Kato, Kazuya Tobita, Youichi Kazuta, Yuya Ishima, Satoru Okamoto, Shunji Aoki
  • Patent number: 11476029
    Abstract: A coil component includes a drum core and first and second wires. The first wire includes a first extending portion. The second wire includes a third extending portion. The first and third extending portions are not in contact with each other. Each of the first and second wires includes a coat including a first region and a second region. The coat in the first and third extending portions is the second region at least in part. The coat is the first region at a contacting point where the first and second wires are in contact for the first time from a first flange portion in the drum core.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: October 18, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kaori Takezawa, Kohei Kobayashi
  • Patent number: 11469020
    Abstract: A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: October 11, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Shinichiro Banba
  • Patent number: 11469027
    Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: October 11, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shuichi Kezuka, Kuniaki Yosui
  • Patent number: 11462357
    Abstract: A thruster for propelling a marine vessel, the apparatus comprising an upper housing, a lower housing, the lower housing being arranged to rotate relative to the upper housing, a first body arranged within the upper housing, the first body comprising a first inductor to provide a magnetic field, and a second body arranged within the lower housing, the second body comprising a second inductor to generate an electrical current from the magnetic field.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 4, 2022
    Assignee: KONGSBERG MARITIME FINLAND OY
    Inventors: Werner Schiffers, Lars Saarinen
  • Patent number: 11450473
    Abstract: Arrangement of interleaved secondary windings for power transformers that reduces the thickness of secondary windings and allows to build transformers with an odd number of layers.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: September 20, 2022
    Inventor: Julio César Macías Torres
  • Patent number: 11450474
    Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: September 20, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Byeong Cheol Moon, Dong Sik Yoo, Doo Ho Park, Tae Jun Choi, Jeong Hoon Ryou, No Il Park, Tai Yon Cho
  • Patent number: 11443886
    Abstract: A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 11437180
    Abstract: A coil electronic component includes a body having a first surface and a second surface, opposing each other, and a third surface connecting the first surface and the second surface to each other, an insulating substrate disposed inside the body, a coil portion disposed on the insulating substrate, a first lead-out portion extending from one end portion of the coil portion and having a first spaced portion and a second spaced portion separate from each other by a first slit, whereby the first and second spaced portions are respectively exposed to the first surface and the third surface of the body, and a second lead-out portion extending from the other end portion of the coil portion and having a third spaced portion and a fourth spaced portion separate from each other by a second slit, whereby the third and fourth spaced portions are respectively exposed to the second surface and a third surface of the body.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Hui Li, Byung Soo Kang
  • Patent number: 11424058
    Abstract: A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 23, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwan Soo Lee, Yoon Hee Cho, Sung Min Song
  • Patent number: 11424064
    Abstract: A multilayer coil component includes a body including laminated ferrite layers, a coil conductor including conductive layers laminated in the body, and a pair of outer electrodes disposed on the lower surface of the body. Each of the pair of outer electrodes is electrically connected to a corresponding one of the end portions of the coil conductor. The lower surface of the multilayer coil component includes a recessed section between the pair of outer electrodes.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: August 23, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Katsuhisa Imada
  • Patent number: 11398341
    Abstract: An electronic component comprising a main body part including an insulating layer and a conductor layer laminated alternately. The insulating layer and the conductor layer are partially exposed on a side surface of the main body part in a direction orthogonal to a lamination direction. Also, the side surface of the main body part is provided with a metal film extending in the lamination direction to cover the insulating layer and the conductor layer exposed on the side surface.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 26, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshinori Ueda, Koshi Himeda, Hayami Kudo
  • Patent number: 11393621
    Abstract: A winding wire having a stranded wire formed by twisting a plurality of element wires whose a copper wire having a wire diameter of 0.05 to 0.5 mm and an extrusion coating layer coating the plurality of the element wires, wherein at least one of the element wires has a magnetic layer on an outer circumference of the copper wire, and the thickness of the extrusion coating layer is 40 to 400 ?m; as well as a coil and a transformer using the winding wire.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: July 19, 2022
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Hiroyuki Fukai, Isamu Kobayashi
  • Patent number: 11387030
    Abstract: A fluid-cooled magnetic element. A plurality of coils is arranged in a non-toroidal configuration. Each coil may be a hollow cylinder, formed by winding a rectangular wire into a roll. The coils alternate with planer spacers. The coils may alternate in winding orientation, and the inner end of each coil may be connected, through a connection pin, to the inner end of an adjacent coil. Small gaps are formed between the coils and the spacers, e.g. as a result of each spacer having, on its two faces, a plurality of raised ribs, against which the coils abut. Cooling fluid flows through the gaps to cool the coils.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: July 12, 2022
    Assignee: Prippell Technologies, LLC
    Inventors: Eric E. Rippel, Wally E. Rippel