Abstract: A single/Multi-phase PMIC built on silicon substrate with coil layers processed on top of the PMIC layers' is provided. The integrated coil is in a spiral form, with a gap at the center of the coil, making additional metal routing not required. The integrated coil has connection pads located in the center gap of the spiral form, limiting the overall inductor resistance to the device only. The on-die inductor may have a magnetic core wrapping the windings. The spiral form may be implemented in a circular design, or a racetrack (elongated spiral) design. The coil layers may be implemented as multiple coil layers or as a single coil layer, connected in parallel (with the same I/O pads), reducing the resistance and maintaining the inductance.

Abstract: Disclosed herein is an apparatus that includes a substrate having first and second surfaces opposite to each other, a first coil pattern formed on the first surface of the substrate, and a second coil pattern formed on the second surface of the substrate. The first coil pattern includes first and second lines, and the second coil pattern includes third and fourth lines. The first line is greater in a number of turn than the second line, and the third line is greater in a number of turn than the fourth line. The first line is connected to the fourth line, and the third line is connected to the second line.

Abstract: Magnetic layers of the multilayer coil component are constituted by: soft magnetic alloy grains 21 containing Fe, Si, and at least one of Cr and Al, as constituent elements; and an oxide layer 22 formed around the soft magnetic alloy grains to bond the soft magnetic alloy grains together, and also containing Si as well as at least one of Cr and Al as constituent elements, where the content of Si based on mass is higher than the total content of Cr and Al. The multilayer coil component can have a small thickness and offer excellent magnetic properties.

Abstract: An inductor component includes a substantially rectangular parallelepiped device body including a first lateral surface and includes a coil conductor layer formed into a spiral wound more than one turn on a main surface parallel to the first lateral surface inside the device body. In the coil conductor layer, a wiring spacing between two wiring portions adjacent to each other (straight portions) in a first direction from an inner side portion to an outer side portion of the coil conductor layer differs from a wiring spacing of two wiring portions adjacent to each other (curved portions) in a second direction from the inner side portion to the outer side portion of the coil conductor layer, the second direction differing from the first direction.

Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.

Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.

Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.

Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.

Abstract: In a multilayer coil component 1, a coil 7 includes a first connection part 22a and a second connection part 26a, the first connection part 22a is connected to one end part of the coil 7, which part is placed on a side of one principal surface 2c, and is arranged in an identical dielectric layer 6 with a conductor 22 included in the one end part, the second connection part 26a is connected to the other end part of the coil 7, which part is placed on a side of the other principal surface 2d, and is arranged in an identical dielectric layer 6 with a conductor 26 included in the other end part, and recessed parts 8a and 8b and recessed parts 9a and 9b are respectively provided in the first terminal electrode 4 and the second terminal electrode 5 in the element body 2.

Abstract: A multilayer coil array includes an element body including a magnetic layer; first and second built-in coils; and first to fourth outer electrodes connected to the first and second coils. A non-magnetic layer is provided between the first and second coils. The first and second coils are each formed by a plurality of coil conductors being connected to each other. At least one out of a coil conductor of the first coil that is closest to the second coil among the plurality of coil conductors of the first coil and a coil conductor of the second coil that is closest to the first coil among the plurality of coil conductors of the second coil contacts the non-magnetic layer. The length of a coil conductor layer that contacts the non-magnetic layer of the coil conductor contacting the non-magnetic layer is different from the length of the other coil conductor layers.

Abstract: An electronic package includes a mounting platform for mounting an electrically small device, at least one coil, and an insulator. The coil regulates a magnetic field through the electrically small device at the mounting platform. The coil is adapted to conduct a current for nullifying the magnetic field through the electrically small device at the mounting platform. The insulator is between the mounting platform and the coil for isolating the electrically small device from the coil. An electronic circuit includes this electronic package and the electrically small device mounted at the mounting platform of the electronic package. The electrically small device can be a quantum device and/or a topological device when cooled to a cryogenic temperature. The magnetic field is nullified to prevent the magnetic field from adversely affecting the electrically small device.

Abstract: A coil element according to one embodiment includes: an insulator body including first insulating layers and second insulating layers laminated in a stacking direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region situated at a top in the stacking direction, a second end region situated at a bottom in the stacking direction, and an intermediate region situated between the first end region and the second end region. The insulator body includes a first portion and a second portion that is an area other than the first portion. The first portion covers upper and lower surfaces of one or more intermediate first conductive patterns in the intermediate region among the plurality of first conductive patterns. The electrical resistivity of the first portion is higher than that of the second portion.

Abstract: An electrical induction device includes a housing and a contact arrangement in the housing of the electrical induction device for electrically contacting an electrical conductor. The contact arrangement includes a conductor tube, a receiver contact which is fastened to the conductor tube and configured to receive and electrically connect with the electrical conductor, and a resilient suspension arrangement fastened to the housing and connected to an outside of the conductor tube such that the receiver contact is resiliently movable in a plane which is parallel to a cross section of the conductor tube while being substantially immovable in an axial direction of the conductor tube.

Abstract: New and Useful magnetic structures are provided. One feature of the magnetic structures is that they are configured to help minimize the air gap reluctance, improving the magnetic structure's coupling coefficient. Another feature is that reducing the windings AC impedance of a magnetic structure is produced by shielding the winding under ears formed of magnetic material. Still another feature is that leakage inductance of a magnetic structure is reduced, by making ears with cuts which converge toward the magnetic rods that are used in the formation of the structure.

Abstract: A coil component includes a coil portion embedded in a body, first and second lead-out portions connection to both end of the coil portion, respectively, and exposed from one surface of the body to be spaced apart from each other, and a support substrate supporting the coil portion and the first and second lead-out portions, and exposed from the one surface of the body. Each of the first and second lead-out portions includes a lead-out pattern and an auxiliary lead-out pattern disposed on one surface and the other surface of the support substrate, opposing each other, and exposed from the one surface of the body, respectively, and a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other, and exposed from the one surface of the body.

Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.

Abstract: A multilayer coil component includes a component element assembly in which an inner conductor is disposed and an outer electrode disposed on the surface of the component element assembly. The component element assembly includes a first dielectric glass layer in which the inner conductor is embedded and second dielectric glass layers that are thin layers disposed on respective principal surfaces of the first dielectric glass layer. The primary component of each of the first dielectric glass layer and the second dielectric glass layers is formed of a glass material and has a filler component containing at least quartz, and the second dielectric glass layers have a lower quartz content than the first dielectric glass layer.

Abstract: A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion.

Abstract: A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.