Abstract: A rotation angle detection device that detects a rotation angle of a valve body. The rotation angle detection device includes a shaft, a gear, a magnetic field generator, and a magnetic detection element. The shaft is connected to the valve body. The magnetic field generator is arranged on a gear side and generates a magnetic field. The magnetic detection element is arranged on an extension of the shaft and detects magnetic flux density of the magnetic field that rotates together with the gear.

Abstract: An example test system includes test sites that include sockets for testing devices under test (DUTs), pickers for picking DUTs from the sockets or placing the DUTs in the sockets, and a gantry on which the pickers are mounted. The gantry is configured to move the pickers relative to the test sites to position the pickers for picking the DUTs from the sockets or placing the DUTs into the sockets. The test system also includes one or more LASER range finders mounted on the gantry for movement over the DUTs in the sockets and in conjunction with movement of the pickers. A LASER range finder among the one or more LASER rangefinders mounted on the gantry is configured to detect a distance to a DUT placed into a socket.

Abstract: A method and apparatus for identifying a fault in an alternating current electrical grid is provided.

Abstract: A test system that is compatible with multiple specifications while maintaining a footprint is provided. The test system includes a plurality of test chambers, each test chamber of the plurality of test chambers including a test head used when a substrate on a stage is tested, and a heating medium supply configured to supply a heating medium to the stage. The heating medium supply is disposed in an area lower than a test area in which the plurality of test chambers are disposed.

Abstract: A circuit screening system including a target circuit under test receiving a first testing signal in a first period and a second testing signal in a second period; a power circuit providing a supply voltage to the target circuit under test, the supply voltage maintaining at a first voltage level in the first period and deviating from the first voltage level, and maintaining at the first voltage level in the second period; and a clock generating circuit providing a clock signal to the target circuit under test, the clock signal triggering the target circuit under test to receive the first testing signal in the first period and the second testing signal in the second period; the clock signal having a first profile and a second profile in the first period and the second period, respectively, and the first profile and the second profile having a phase difference.

Abstract: A device for high-voltage or medium-voltage technology includes at least one connection configured for connection to a high-voltage or medium-voltage conductor; a sensor system configured to determine a plurality of different physical and/or chemical measurement values relating to the device and/or the conductor and/or the surroundings; and a communication system, in particular a wireless system, configured to receive the measurement values from the sensor system and to transmit them to an entity in a network. A method for high-voltage or medium-voltage technology is also provided.

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Abstract: A current sensor for detecting a current based on a terminal voltage and a resistance value of a shunt resistor, includes: a resistance value correction circuit having: correction resistors; a signal application unit; a voltage detection unit that detects terminal voltages of the shunt resistor and a part of the correction resistors in a first period, and terminal voltages of all of the correction resistors in a second period; and a correction unit that corrects the resistance value for current detection based on a calculated resistance value of the shunt resistor. Resistance values and resistance accuracies of the correction resistors are higher as the plurality of correction resistors are disposed farther from the shunt resistor.

Abstract: A period estimation apparatus includes processing circuitry configured to extract candidate periods being a target of period determination from an input pulse train, use at least one of the candidate periods extracted to determine whether the at least one of the candidate periods exists as an actual period, and, when determining that the at least one of the candidate periods does not exist as the actual period, suspend the period determination for the at least one of the candidate periods, perform the period determination for the at least one of the candidate periods determined to exist as the actual period, generate a pseudo periodic pulse train, adjust, based on a differential value between the pseudo periodic pulse train generated and the input pulse train, a pulse position of the pseudo periodic pulse train, and detect a periodic pulse train according to results of the period determination and adjustment.

Abstract: The present invention provides an information providing apparatus including a determining unit configured to determine an added value to be provided to a user of a portable electric power supply device including a storage battery that stores electric power to be supplied to electrical equipment detachably connected, wherein in a case where a kind of the electrical equipment is a specified kind of electrical equipment, the determining unit determines the added value to be provided to the user in such a manner that the added value to be provided to the user is higher than an added value in a case where the kind of the electrical equipment is not the specified kind of electrical equipment.

Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.

Abstract: A Multi-Phase Simulation Environment (“MPSE”) is provided. In one embodiment, a simulation environment controller is configured to select a waveform from a waveform playlist and initiate a trigger signal to one or more waveform generators of a plurality of waveform generators to generate the waveform. The plurality of waveform generators are configured to generate the waveform under a phase lock.

Abstract: The magnetic detection system (100) is provided with a magnetic sensor (1) and a waveform pattern classification unit (33c). The waveform pattern classification unit (33c) is configured to classify waveform patterns of magnetic signals acquired by the magnetic sensor (1) based on a waveform pattern distribution (60) generated based on a plurality of fully connected layers (52c) generated by weighting and connecting respective features in waveform patterns for each waveform pattern by machine-learning, and features in the waveform patterns of the magnetic signals.

Abstract: The test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. A test probe card is configured such that it can make probe contact with the wafer under test in the test process. A wafer connection HiFix is arranged between the test probe card and a test head. A magnetic field application apparatus is provided to the wafer connection HiFix. In the test process, the magnetic field application apparatus applies a magnetic field BEX to the wafer under test.

Abstract: Disclosed herein is an integrated heater and measurement (IHM) device comprising heating-sensing element(s) and heating-sensing circuit(s). A heating-sensing element generates heat and determines the temperature of the IHM device. In some embodiments, the heating-sensing element may operate in a plurality of modes: heating mode, sensing mode, and/or off mode. A controller may dynamically adjust the properties of the operation mode and/or time periods based on the determined temperature. The adjusted properties may include the duration of the heating mode, the ON time for a heating-sensing element, etc. The controller may adjust the duration of heating mode based on the temperature difference between the determined temperature and a set point temperature, such as decreasing the duration of the heating mode when there is a low temperature difference, and increasing the duration of the heating mode when there is a high temperature difference.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an on-chip current sensor. The on-chip current sensor includes: a vertical Hall sensor; and a current carrying conductor in a first wiring layer above the vertical Hall sensor.

Abstract: The device for monitoring internal pipe deposit accumulation is a capacitance-based sensor for monitoring changes in thickness of deposits accumulating on an internal surface of a pipe. The device includes a pipe segment having opposed first and second open ends with at least one valve releasably sealing at least one of the first and second open ends. A first electrode, in the form of an electrically conductive cylindrical shell, is mounted on and surrounds a portion of an external surface of the pipe segment. A second electrode, in the form of an electrically conductive rod, is mounted coaxially within an interior of the pipe segment. An electrical power source is electrically connected across the first and second electrodes to form a cylindrical capacitor and changes in capacitance of the cylindrical capacitor are monitored by a controller.

Abstract: The present disclosure describes techniques for detecting foreign objects. In some aspects, an apparatus for detecting objects is provided. The apparatus includes a plurality of sense circuits, each of the plurality of sense circuits including a primary sense coil having a first terminal and a second terminal, a secondary sense coil having a first terminal and a second terminal, and a capacitor having a first terminal and a second terminal. The first terminal of the capacitor is electrically connected to the second terminals of each of the primary sense coil and the secondary sense coil. The apparatus further includes a driver circuit electrically connected to the first terminal of the primary sense coil of each of the plurality of sense circuits. The apparatus further includes a measurement circuit electrically connected to the first terminal of the secondary sense coil of each of the plurality of sense circuits.

Abstract: A semiconductor integrated circuit device and an inspection method for a semiconductor integrated circuit device capable of improving burn-in screening quality by improvement in an activation rate of a DSP without operating a diagnostic circuit at the time of wafer level burn-in in a semiconductor integrated circuit device incorporating an analog circuit and the diagnostic circuit for the analog circuit are provided.

Abstract: A probe apparatus for testing a semiconductor device is provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.