Abstract: An integrated circuit may include integrated memory that is formed from a chain of memory blocks. Each memory block may have configurable input and output circuits. The configurable input and output circuits may be interposed between memory circuitry such as a memory array from circuitry external to the memory circuitry. The configurable input and output circuits may have upstream and downstream memory block connection ports. In such a way, configurable input and output circuits in a first memory block may pass control and address signals and data to configurable input and output circuits in a second memory block. By using the configurable input and output circuits, the integrated memory in the integrated circuit may operate to accommodate large bandwidth flows without using the general routing fabric of the integrated circuit.

Abstract: Apparatuses, methods, and systems for generating patterns for memory using threshold voltage difference are disclosed. An embodiment includes circuitry and a memory array including a plurality of memory cells. The circuitry can select a group of memory cells from the plurality of memory cells, program each memory cell of the group to a first data state, determine a first threshold voltage of each memory cell of the group, program each memory cell of the group to a second data state, perform a number of snapback events on each memory cell of the group, program each memory cell of the group to the first data state, determine a second threshold voltage of each memory cell of the group having the first data state, and generate a pattern for the memory array based, at least in part, on a difference between the first threshold voltage and the second threshold voltage.

Abstract: An integrated circuit chip includes a first through electrode and a second through electrode formed through the integrated circuit chip, a transmission circuit suitable for selecting one of signals transmitted through the first and second through electrodes, respectively, and transmitting the selected signal to a data line, in response to a selection signal, and a selection signal generation circuit suitable for generating the selection signal by toggling the selection signal, during a test operation.

Abstract: A memory device includes a first pillar coupled with a first data line, a second pillar coupled with a second data line, wordlines coupled with first and second pillars. Control logic is to cause: wordlines to be discharged after a program pulse is applied to selected wordline; a supply voltage be applied to second data line to cause a voltage of second pillar to float; a ground voltage be applied to first data line to inhibit soft erase via first pillar; unselected wordlines be charged to boost channel voltages in memory cells coupled with the second pillar; and one of the ground voltage or a negative voltage be applied to the selected wordline to increase soft erase voltage between a channel of a memory cell coupled with the second pillar and the selected wordline, causing a threshold voltage stored in the memory cell to be erased.

Abstract: Technology is disclosed herein for a memory system that compensates for different programming speeds in two sets of memory cells when reading those two sets of memory cells. The memory system programs a group of the memory cells to one or more data states. In one aspect, the memory cells are not verified during programming. The group has a first set of memory cells that program at a first speed and a second set of memory cells that program at a second speed. The memory system reads the first set of the memory cells with a first set of read parameters and reads the second set of the memory cells with a second set of read parameters. The first set of read parameters are different from the second set of read parameters to compensate for the different programming speeds.

Abstract: A system on a chip includes a first subsystem comprising a first memory; a second subsystem comprising a second memory; and an always-on subsystem. The always-on subsystem can comprise processing circuitry configured to: in response to a first activation event, signal the first subsystem to initiate repair operations on the first memory, and in response to a second activation event occurring after the first event, signal the second subsystem to initiate repair operations on the second memory.

Abstract: Memory having an array of memory cells might include control logic configured to cause the memory to program each memory cell of a plurality of memory cells whose respective data state is higher than or equal to a first particular data state of a plurality of data states while inhibiting programming of each memory cell of the plurality of memory cells whose respective data state is lower than the first particular data state, and program each memory cell of the plurality of memory cells whose respective data state is lower than or equal to a second particular data state of the plurality of data states after programming each memory cell of the plurality of memory cells whose respective data state is higher than or equal to the first particular data state.

Abstract: An apparatus includes a control circuit configured to connect to memory cells connected in series in NAND strings. Each NAND string includes a plurality of data memory cells coupled to a plurality of data word lines in series with a plurality of dummy memory cells connected to a plurality of dummy word lines. The control circuit configured to apply a first dummy word line voltage to one or more dummy word lines of the plurality of dummy word lines in a verify step of a program operation to program data memory cells. The control circuit is configured to apply a second dummy word line voltage to the one or more dummy word lines in a read operation to read the data memory cells.

Abstract: A memory device might include a controller configured to cause the memory device to generate a first sum of expected peak current magnitudes for a plurality of memory devices, and generate a second sum of expected peak current magnitudes for a subset of the plurality of memory devices, if the memory device were to initiate a next phase of an access operation in a selected operating mode; to compare the first sum to a first current demand budget for the plurality of the memory devices; to compare the second sum to a second current demand budget for the subset of memory devices; and to initiate the next phase of the access operation in the selected operating mode in response to the first sum being less than or equal to the first current demand budget and the second sum being less than or equal to the second current demand budget.

Abstract: Methods of optimizing the placement of memories in a memory device including a substrate and an electrical component, and associated devices and systems, are disclosed herein. A representative method includes first testing the memories to determine at least one parameter for each of the memories indicating an ability of the memory to process signals from the electrical component. The method can further include labeling each memory with a label based on the parameter, the labels including at least a first label and a second label. The first label can indicate that the memories with the first label are better able to process signals from the electrical component than the memories with the second label. The method can further include electrically coupling the memories to the substrate such that the memories with the second label are positioned closer to the electrical component than the memories with the first label.

Abstract: An apparatus includes a host and a memory device connected to the host through a bus. The bus is used to communicate a data clock controlling data write timing during a write operation executed by the memory device and a read clock controlling data read timing during a read operation executed by the memory device. The memory device performs first duty cycle monitoring that monitors a duty cycle of the data clock, generates a first result, and provides a timing-adjusted data clock, performs second duty cycle monitoring that monitors a duty cycle of the read clock, generates a second result, and provides a timing-adjusted read clock, calculates an offset of the read clock based on the timing-adjusted data clock, the result and the second result, and corrects a duty error of the read clock using a read clock offset code derived from the offset of the read clock.

Abstract: A pseudo dual port memory device in which an operating speed is improved and stability is increased is provided. The pseudo dual port memory device may include a memory cell, a pair of bit lines connected to the memory cell, a write driver, a sense amp, and a column multiplexer which is connected to the bit lines, receives a write multiplexer control signal and a read multiplexer control signal, connects the bit lines to the write driver in response to the write multiplexer control signal, and connects the bit lines to the sense amp in response to the read multiplexer control signal. A precharge control signal generation circuit which is connected to the column multiplexer may generate a precharge control signal on the basis of the read and write multiplexer control signals, and a bit line precharge circuit may precharge the bit lines based on the precharge control signal.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for bad row mode. The memory may prevent proper access operations (e.g., read operations) from being performed on a selected bad row of the memory as part of a bad row mode. For example, the memory may store a bad row address and when an access address matches the bad row address, may suppress one or more signals, change data read from the address, or combinations thereof. The bad row mode may be used to provide a positive control for post package repair (PPR) operations on the memory. A controller may enter the memory into bad row mode and then test the memory to determine if the selected bad row can be located and repaired via PPR.

Abstract: Prior knowledge of access pattern is leveraged to improve energy dissipation for general matrix operations. This improves memory access energy for a multitude of applications such as image processing, deep neural networks, and scientific computing workloads, for example. In some embodiments, prior knowledge of access pattern allows for burst read and/or write operations. As such, burst mode solution can provide energy savings in both READ (RD) and WRITE (WR) operations. For machine learning or inference, the weight values are known ahead in time (e.g., inference operation), and so the unused bytes in the cache line are exploited to store a sparsity map that is used for disabling read from either upper or lower half of the cache line, thus saving dynamic capacitance.

Abstract: A memory controller includes an over-program controller that preprograms and then erases the memory cells such that each of the memory cells has a first threshold voltage level, wherein fast cells are detected among the memory cells according to a threshold voltage less than or equal to a second threshold voltage less than the first threshold voltage, and a processor that generates fast cell information identifying the fast cells among the memory cells and stores the fast cell information in a buffer. The over-program controller controls the over-programming of the fast cells and normal programming of normal cells among the memory cells based on the fast cell information stored in the buffer.

Abstract: A memory device stores data for a host device. In one approach, a method includes: selecting, by the memory device, a first mode of operation for a host interface that implements a communication protocol for communications between the memory device and the host device. The host interface is configured to implement the communication protocol using a mode selected by the memory device from one of several available modes. In response to selecting the first mode, resources of the memory device are configured to customize the host interface for operation in the first mode.

Abstract: Methods of operating a number of memory devices are disclosed. A method may include receiving, at each of a number of memory devices, a refresh command. The method may also include refreshing, at each of the number of memory devices and in response to the refresh command, a number of memory cells based on a count of an associated refresh address counter, wherein a count of a refresh address counter of at least one memory device of the number of memory devices is offset from a count of a refresh address counter of at least one other memory device of the number of memory devices. Related systems and memory modules are also described.

Abstract: A storage device includes 3D NAND including layers of multi-level cells. When a shutdown command is received, whether a block is partially written is evaluated. If so, dummy lines are written after the last written wordline of the block. Partially written blocks may be those having a fill percentage less than a threshold. The threshold may be a function of the PEC count of the block. If a maximum retention time is exceeded by data stored in a partially written block, dummy lines may also be written to the block.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a transistor and a memory device. The transistor includes a source, a drain, and a gate. The memory device is disposed at a drain side of the transistor and coupled to the drain. The memory device includes a first electrode, a switch layer, a memory layer, and a second electrode disposed sequentially. The first electrode is coupled to the drain.

Abstract: A memory device according to the present invention comprises: a memory cell array in which memory cells are connected to wordlines and bitlines in a matrix form; and a control circuit for programming the memory cells or controlling a read operation, according to a start address, a burst length, a latency length, and a program or read command which are transmitted from a host, wherein the control circuit may comprise: a pulse generation unit for generating register pulses and counter pulses in synchronization with an operation clock; and a counter that sets the start address in synchronization with the register pulses, counts the number of counter pulses corresponding to the sum of the latency length and the burst length, and increases an address from the start address to the sum of the start address and the burst length.