Abstract: Memory devices and systems with partial array refresh control over memory regions in a memory array, and associated methods, are disclosed herein. In one embodiment, a memory device includes a memory array having a first memory region and a second memory region. The memory device is configured to write data to the memory array in accordance with a programming sequence by initially writing data to unutilized memory cells of the first memory region before initially writing data to unutilized memory cells of the second memory region. The memory device is further configured to determine that the data stored on the first and/or second memory regions is not consolidated, and to consolidate at least a portion of the data by rewriting the portion of the data to physically or logically contiguous memory cells of the first memory region and/or the second memory region.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a memory array including a plurality of memory cells, each memory cell having an impedance that varies in accordance with a respective data value stored therein; and a tracking memory cell having an impedance based on a tracking data value stored therein; and a read circuit coupled to the memory array, the read circuit configured to determine an impedance of a selected memory cells with respect to the impedance of the tracking memory cell; read a data value stored within the selected memory cell based upon a voltage change of a signal node voltage corresponding to the impedance of the selected memory cell.

Abstract: A semiconductor memory device includes first conductive layers arranged in a first direction, a second conductive layer disposed at a position overlapping with the first conductive layers viewed from the first direction, a third conductive layer disposed at a position overlapping with the first conductive layers viewed from the first direction and arranged with the second conductive layer in a second direction intersecting with the first direction, a first semiconductor column opposed to the first conductive layers and the second conductive layer, a second semiconductor column opposed to the first conductive layers and the third conductive layer, and a fourth conductive layer disposed between the second conductive layer and the third conductive layer. The fourth conductive layer has a length in the second direction smaller than a length of the second conductive layer in the second direction and a length of the third conductive layer in the second direction.

Abstract: A memory is provided. The memory includes banks, each bank includes a U half bank and a V half bank; a first error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of output data of the U half banks and the V half banks; and a second error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of the output data of the U half banks and the V half banks.

Abstract: Methods, systems, and devices for accessing a multi-level memory cell are described. The memory device may perform a read operation that includes pre-read portion and a read portion to access the multi-level memory cell. During the pre-read portion, the memory device may apply a plurality of voltages to a plurality of memory cells to identify a likely distribution of memory cells storing a first logic state. During the read portion, the memory device may apply a first read voltage to a memory cell based on performing the pre-read portion. The memory device may apply a second read voltage to the memory cell during the read portion that is based on the first read voltage. The memory device may determine the logic state stored by the memory cell based on applying the first read voltage and the second read voltage.

Abstract: A Fail Bit (FB) repair method and device can be applied to repairing an FB in a chip. The method includes: a bank to be repaired including multiple target repair regions in a chip to be repaired is determined; first repair processing is performed on a first FB in each target repair region by using a redundant circuit; a second FB position determination step is executed to determine a bit position of a second FB, and second repair processing is performed on the second FB; unrepaired FBs in each target repair region is determined, and the second FB position determination step is recursively executed to obtain a test repair position of each unrepaired FB to perform third repair processing on the unrepaired FB according to the test repair position.

Abstract: A memory device includes a cell group and a control circuit. The cell group includes plural non-volatile memory cells capable of storing data. The control circuit performs a program operation for programming data in the plural non-volatile memory cells through a plurality of program loops, each program loop including a unit program operation for applying a program pulse to the plural non-volatile memory cells and a verification operation for verifying a result of the unit program operation. The control circuit uses a current detection circuit for detecting whether a threshold voltage distribution of the plural non-volatile memory cells satisfies a reference in a specific program loop of the plurality of program loops. The control circuit terminates the program operation after applying a preset program pulse to the plural non-volatile memory cells in a next program loop following the specific program loop.

Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.

Abstract: According to one embodiment, a semiconductor memory device includes: a first memory cell; a second memory cell; a first word line; a second word line; and a first bit line. The device is configured to execute a first operation, a second operation, and a third operation to write data into the first memory cell. In the first operation, a first voltage is applied to the second word line. In the second operation, after the first operation, a second voltage higher than the first voltage is applied to the second word line. In the third operation, after the second operation, a third voltage higher than the second voltage is applied to the first word line, and a fourth voltage lower than both the second voltage and the third voltage is applied to the second word line.

Abstract: Sensing devices might include a first voltage node configured to receive a first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, a p-type field-effect transistor (pFET) selectively connected to a data line, and a sense node selectively connected to the pFET. The pFET might be connected between the first voltage node and the data line, between the second voltage node and the data line, and between the first voltage node and the data line. Memories might have controllers configured to cause the memories to determine whether a memory cell has an intended threshold voltage using similar sensing devices.

Abstract: A command to program data to a memory device is received. Target charge levels of a set of memory cells in the memory device for a first programming step are determined based on the data. A first set of indicators are provided to the memory device. The first set of indicators indicate the target charge levels for the first programming step. Target charge levels of the set of memory cells for a second programming step are determined based on the data. A second set of indicators are provided to the memory device. The second set of indicators indicate the target charge levels for the second programming step.

Abstract: A method of operating a storage device including a non-volatile memory includes storing program and erase counts of the non-volatile memory as metadata in units of super blocks, wherein each of the super blocks includes a pre-defined number of blocks of the non-volatile memory, performing a read operation on a first block included in a first super block based on a first read level, storing the first read level as a history read level of the first super block in a history buffer when the read operation on the first block is successful, receiving a read request for a second block of the first super block and an address of the second block from a host, and performing a read operation on the second block based on the history read level stored in the history buffer. The pre-defined number is at least two.

Abstract: Embodiments of the disclosure provide a circuit structure and related method to provide a radiation resistant memory cell. A circuit structure may include a first latch having an input node and an output node. A second latch has an input node and an output node, in which the output node of the second latch is coupled to the input node of the first latch, and the input node of the second latch is coupled to the output node of the first latch. A read/write (R/W) circuit includes a plurality of transistors coupling a word line, a bit line, and an inverted bit line to at least two outputs. One of the at least two outputs is coupled to the input node of the first latch and another of the outputs is coupled to the input node of the second latch.

Abstract: A scheme for non-parametric optimal read threshold estimation of a memory system. The memory system includes a memory device including pages and a controller including a neural network. The controller performs read operations on a selected page using a read threshold set; obtain the read threshold set, a checksum value and an asymmetric ratio of ones count and zeros count which are associated with decoding of the selected page according to each of the read operations; provide the obtained read threshold set, the checksum value and the asymmetric ratio as input information to the neural network; and estimate, by the neural network, an optimal read threshold voltage based on the input information and weights including a combination of multiple matrices and bias vectors.

Abstract: The application provides a sense amplifier and an operation method thereof. The operation method for the sense amplifier includes: during a first phase, initializing a first sensing input voltage and a second input sensing voltage; and recording a first sensing output voltage and a second sensing output voltage of a previous round by charges stored in a plurality of transistors of the sense amplifier; during a second phase, sampling the first sensing output voltage and the second sensing output voltage of a current round as a plurality of transit points; during a first sub-phase of a third phase, amplifying a voltage difference between an input signal and a first reference voltage; and during a second sub-phase of the third phase, pulling the first sensing output voltage and the second sensing output voltage into a full-swing voltage range, and recording charges to the transistors of the sense amplifier.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell, first, second, and third data lines, and first and second access lines. Each of the first, second, and third data lines includes a length extending in a first direction. Each of the first and second access lines includes a length extending in a second direction. The memory cell includes a first transistor including a charge storage structure, and a first channel region electrically separated from the charge storage structure, and a second transistor including a second channel region electrically coupled to the charge storage structure. The first data line is electrically coupled to the first channel region. The second data line is electrically coupled to the first channel region. The third data line is electrically coupled to the second channel region, the second channel region being between the charge storage structure and the third data line.

Abstract: An exemplary semiconductor device includes circuitry to implement data mask operations by sending bit-specific, write enable signals (WREN) to control connection of a main or global data line to local data lines during a write operation. For example, a plurality of even sense amplifier stripes each receive a first set of WREN signals to control a corresponding passgate responsible for coupling one global data line to one local data line and a plurality of odd sense amplifier stripes each receive a second set of WREN signals to control a corresponding passgate responsible for coupling one global data line to one local data line.

Abstract: The disclosure provides a novel system and method of storing multi-bit information, including providing a nano-channel-based polymer memory device, the device having at least one memory cell comprising at least two addition nano-channels, each of the addition nano-channels arranged to add a unique chemical construct (or codes) to the polymer when the polymer enters the respective addition nano-channel, the polymer having a bead or origami on a non-writing end of the polymer; each nano-channel having a nano-port constriction having a port width which allows the polymer to pass through the nano-port, and does not allow the bead or origami to pass through and does not allow addition or deblocking enzymes (or beads attached thereto) to pass through the nano-port; successively steering the polymer through the nanopore into the addition nano-channels to add the codes to the polymer based on a predetermined digital data pattern to create the digital data pattern on the polymer.

Abstract: The application provides a Content Addressable Memory (CAM) cell, a CAM memory device and an operation method thereof. The CAM cell includes: a plurality of parallel-coupled flash memory cells: wherein a storage data of the CAM cell is based on a combination of a plurality of threshold voltages of the parallel-coupled flash memory cells.

Abstract: A test method includes: providing an initialization command to a ZQ calibration module such that the resistance value of a termination resistor is a first extreme value; providing a ZQ calibration command to the ZQ calibration module such that the resistance value of the termination resistor increases or decreases to a second extreme value from the first extreme value, one of the first extreme value and the second extreme value being a maximum value while the other one being a minimum value; acquiring a first time node, the first time node being a transmitting time for the ZQ calibration command; acquiring a second time node; and acquiring the ZQ calibration time based on the second time node and the first time node.