Patents Examined by Yasser Abdelaziez
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Patent number: 11978656Abstract: Semiconductor devices are described that have a metal interconnect extending vertically through a portion of the device to the back side of a semiconductor substrate. A top region of the metal interconnect is located vertically below a horizontal plane containing a metal routing layer. Method of fabricating the semiconductor device can include etching a via into a semiconductor substrate, filling the via with a metal material, forming a metal routing layer subsequent to filling the via, and removing a portion of a bottom of the semiconductor substrate to expose a bottom region of the metal filled via.Type: GrantFiled: August 3, 2020Date of Patent: May 7, 2024Assignee: Micron Technology, Inc.Inventors: Kyle K. Kirby, Kunal R. Parekh
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Patent number: 11970387Abstract: A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.Type: GrantFiled: March 21, 2022Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chun-wen Cheng, Chi-Hang Chin, Kuei-Sung Chang
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Patent number: 11974458Abstract: An organic light-emitting diode (OLED) display panel and an OLED display device are provided. In a second display area of the OLED display panel, a light transmission enhancement layer is disposed on a side of a light-emitting layer away from a driving circuit layer. By disposing the light transmission enhancement layer on the light-emitting layer, a resonant microcavity of the OLED display panel can be changed by the light transmission enhancement layer. Therefore, light transmittance of the OLED display panel is increased, thereby improving an imaging effect of an under-screen camera.Type: GrantFiled: April 30, 2021Date of Patent: April 30, 2024Assignees: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.Inventor: Yuanyuan Zhao
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Patent number: 11972997Abstract: Semiconductor device (A10) includes conductive substrate (20) and semiconductor element (40). The conductive substrate (20) has obverse surface (20A) facing in thickness direction (z) and reverse surface (20B) facing opposite from the obverse surface (20A). The semiconductor element (40) is electrically bonded to the obverse surface (20A). The conductive substrate (20) includes first base layer (211), second base layer (212) and metal layer (22). The first base layer (211) and second base layer (212) are made of graphite composed of stacked graphenes. The metal layer (22) is between the first base layer (211) and the second base layer (212). The graphenes of the first base layer (211) are stacked in first stacking direction perpendicular to the thickness direction (z). The graphenes of the second base layer (212) are stacked in second stacking direction perpendicular to the thickness direction (z) and crossing the first stacking direction.Type: GrantFiled: November 14, 2019Date of Patent: April 30, 2024Assignee: ROHM CO., LTD.Inventor: Takukazu Otsuka
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Patent number: 11967596Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.Type: GrantFiled: August 5, 2021Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
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Patent number: 11968866Abstract: A second connection wire is electrically connected to a first connection wire via a display-side contact portion and terminal-side contact portion in a bending section. The first connection wire and the second connection wire do not overlap each other at least partly between the display-side contact portion and terminal-side contact portion.Type: GrantFiled: June 20, 2019Date of Patent: April 23, 2024Assignee: SHARP KABUSHIKI KAISHAInventors: Yohsuke Kanzaki, Yi Sun, Takao Saitoh, Masahiko Miwa, Masaki Yamanaka
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Patent number: 11968885Abstract: An organic photodetector including an electron blocking layer, where the electron blocking layer prevents and/or reduces dark current by preventing electrons traveling from the organic photodetector's anode to the organic photodetector's photoactive layer during dark, photon-less conditions. The electron blocking layer is formed from a compound having the formula: [M]a+[X]a— (General Formula (I)) where: M is a metal; X is CN, SCN, Se CN or TeCN; and a is at least 1.Type: GrantFiled: July 2, 2019Date of Patent: April 23, 2024Assignee: Sumitomo Chemical Company LimitedInventors: Nir Yaacobi-Gross, Michael Mellor, Ken Ominiabohs
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Patent number: 11952263Abstract: A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.Type: GrantFiled: February 5, 2020Date of Patent: April 9, 2024Assignee: ROBERT BOSCH GMBHInventors: Mike Schwarz, Pascal Gieschke, Valentina Kramer-Sinzinger
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Patent number: 11957002Abstract: An array substrate, a preparing method thereof, a display panel and a display apparatus are disclosed. The array substrate includes: a base substrate (1); a driving circuit structure (2) on the base substrate (1); a planarization layer (3) and a plurality of electrode structures (4) successively located on a side, facing away from the base substrate (1), of the driving circuit structure (2); insulation structures (5) in gap areas between adjacent electrode structures (4); and pixel defining structures (6) on a side, facing away from the base substrate (1), of the insulation structures (5). The thickness of the insulation structures (5) is not smaller than the thickness of the electrode structures (4). An orthographic projection of the pixel defining structures (6) on the base substrate (1) at least completely covers the insulation structures (5).Type: GrantFiled: December 29, 2020Date of Patent: April 9, 2024Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Wei Li, Jingjing Xia, Bin Zhou, Shengping Du, Yang Zhang, Wei Song, Qinghua Guo
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Patent number: 11952266Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.Type: GrantFiled: October 8, 2020Date of Patent: April 9, 2024Assignee: X-Celeprint LimitedInventor: Pierluigi Rubino
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Patent number: 11952268Abstract: A free-standing microstructure may be formed from an engineered substrate including a first silicon layer, a second silicon layer, and an intermediate layer. The second silicon layer may include a monocrystalline silicon film. The intermediate layer may be between the first silicon layer and the second silicon layer. The intermediate layer may include a silicon- or germanium-based material having a different lattice constant than the first silicon layer or the second silicon layer. The intermediate layer of the free-standing microstructure may further include one or more voids wherein at least a portion of the silicon- or germanium-based material is absent between the first silicon layer and the second silicon layer.Type: GrantFiled: June 14, 2021Date of Patent: April 9, 2024Assignee: Lawrence Semiconductor Research Laboratory, Inc.Inventors: Chantal Arena, Nupur Bhargava, Alec Fischer
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Patent number: 11952267Abstract: A modification to rough polysilicon using ion implantation and silicide is provided herein. A method can comprise depositing a hard mask on a single crystal silicon, patterning the hard mask, and depositing metal on the single crystal silicon. The method also can comprise forming silicide based on causing the metal to react with exposed silicon of the single crystal silicon. Further, the method can comprise removing unreacted metal and stripping the hard mask from the single crystal silicon. Another method can comprise forming a MEMS layer based on fusion bonding a handle MEMS with a device layer. The method also can comprise implanting rough polysilicon on the device layer. Implanting the rough polysilicon can comprise performing ion implantation of the rough polysilicon. Further, the method can comprise performing high temperature annealing. The high temperature can comprise a temperature in a range between around 700 and 1100 degrees Celsius.Type: GrantFiled: January 26, 2022Date of Patent: April 9, 2024Assignee: INVENSENSE, INC.Inventors: Alan Cuthbertson, Daesung Lee
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Patent number: 11955394Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.Type: GrantFiled: December 13, 2019Date of Patent: April 9, 2024Assignee: Nippon Kayaku Kabushiki KaishaInventors: Tadashi Naito, Nao Honda, Yoshihiro Hakone, Hiroki Oshida, Mamoru Sunada
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Patent number: 11948808Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.Type: GrantFiled: December 6, 2021Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
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Patent number: 11943978Abstract: A display device includes first power supply terminal electrodes and second power supply terminal electrodes. The first power supply terminal electrodes in a first terminal portion of a frame area at least partially overlap, in a plan view, at least a part of the second power supply terminal electrodes in a second terminal portion of a flexible printed board. The second power supply terminal electrodes are electrically connected to the first power supply terminal electrodes. Either the first power supply terminal electrodes or the second power supply terminal electrodes are inclined from the others.Type: GrantFiled: February 6, 2019Date of Patent: March 26, 2024Assignee: SHARP KABUSHIKI KAISHAInventor: Shigetsugu Yamanaka
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Patent number: 11937518Abstract: One example includes a superconducting circuit. The circuit superconducting circuitry fabricated on a first surface of a circuit layer. The circuit layer includes a dielectric material. The circuit also includes a metal layer formed on a second surface of the circuit layer opposite the first surface and a through-substrate via (TSV) conductively coupled to the metal layer and extending through the circuit layer to the first surface. The circuit further includes a flux gasket conductively coupled to and extending from the TSV on the first surface proximal to the superconducting circuitry. The flux gasket can be configured to divert magnetic fields away from the superconducting circuitry.Type: GrantFiled: May 20, 2022Date of Patent: March 19, 2024Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventor: Daniel Robert Queen
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Patent number: 11923384Abstract: The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a first transistor. The first transistor includes a first semiconductor layer, and the first semiconductor layer includes bismuth selenium oxide materials to enhance mobility of the first transistor and improve electrical performance of the display panel, so that the display panel meets requirements of high refresh rate and high transmittance.Type: GrantFiled: November 19, 2020Date of Patent: March 5, 2024Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Yu Zhang, Miao Jiang, Jiangbo Yao, Lixuan Chen, Xin Zhang
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Patent number: 11916169Abstract: An active matrix LED array precursor forming a precursor to a micro LED array is provided. The active matrix LED array precursor comprises a common first semiconducting layer comprising a substantially undoped Group III-nitride, a plurality of transistor-driven LED precursors, and a common source contact. Each transistor-driven LED precursor comprises a monolithic light emitting diode (LED) structure comprising a plurality of III-nitride semiconducting layers, a barrier semiconducting layer, and a gate contact. Each monolithic LED structure is formed on a portion of the common semiconducting layer. The barrier semiconducting is layer formed on a portion of the common semiconducting layer encircling the LED structure and configured to induce a two-dimensional electron channel layer at the interface between the common semiconducting layer and the barrier semiconducting layer. The gate contact is formed over a portion of the two-dimensional electron channel layer, the gate contact encircling the LED structure.Type: GrantFiled: December 12, 2019Date of Patent: February 27, 2024Assignee: Plessey Semiconductors LimitedInventors: Andrea Pinos, Samir Mezouari
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Patent number: 11917927Abstract: A production line device prepares a superconducting circuit layer on a substrate. The device prepares an under bump metallization (UBM) layer on an upper surface of the superconducting circuit layer. A superconducting connection is formed between the UBM layer and the superconducting circuit layer. The production device prepares a welding spot on an upper surface of the UBM layer to obtain a qubit assembly configured for a flip-chip superconducting quantum chip. A superconducting electrical connection is formed between the welding spot and the UBM layer.Type: GrantFiled: October 24, 2022Date of Patent: February 27, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Chenji Zou, Yarui Zheng, Hui Wang
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Patent number: 11917894Abstract: Provided are a method for preparing an organic electroluminescent device, an organic electroluminescent device and a display apparatus.Type: GrantFiled: March 4, 2019Date of Patent: February 27, 2024Assignee: GUANGZHOU NEW VISION OPTO-ELECTRONIC TECHNOLOGY CO., LTD.Inventors: Jianhua Zou, Miao Xu, Hong Tao, Lei Wang, Hongmeng Li, Wencong Liu, Hua Xu, Min Li, Junbiao Peng