Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

Abstract: In an electronics system, an adjustable airflow guide assembly and methods of deploying it facilitate dissipating heat. The assembly includes an extendable plate having a first coupling capable of rotatably attaching the extendable plate to a chassis, a link, including a second coupling, capable of translatably attaching the link to the chassis, and a third coupling capable of rotatably attaching the link to the extendable plate. The extendable plate presents a guide to deflect airflow and is capable of being swung into multiple different fixed positions to divert airflow within the electronics system toward portions of the chassis configured with electronic components that produce heat, such as board solid state drives (BSSDs).

Abstract: A combined inverter is arranged, which includes at least two separate box bodies connected detachably, all components of the combined inverter are placed into the box bodies separately, and at least one electrical connection terminal is arranged outside each of the box bodies, and the electrical connection terminal of one of the box bodies is capable of being connected to the electrical connection terminal of another of the box bodies. Therefore, a structure connection and an electrical connection of the combined inverter is achieved, weight of the whole combined inverter is dismantled effectively on the premise of ensuring normal operation of the combined inverter, construction difficult of installation and transportation is reduced, and the combined inverter has high applicability even when having high power.

Abstract: The present invention provides a hybrid cooled blade server enclosure having a liquid-cooled insert having a chilled surface for contacting a heat exchange block on the blade server and an electric fan for removing heated air from the enclosure.

Abstract: A power converter includes a housing, a circuit element, and a cover. The housing includes a first space and a second space. In the first space, a circuit substrate is disposed. In the second space, a passage for a cooling fluid is disposed. The circuit element is disposed on the circuit substrate in the first space and protrudes into the second space. The cover covers at least a portion of the circuit element and includes a first portion and a second portion. The first portion protrudes from near the circuit substrate into the second space, and defines a first region that has a first area. The second portion protrudes from the first portion, and defines a second region that has a second area. The first area is larger than the second area as viewed from a direction in which the circuit element protrudes.

Abstract: An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.

Abstract: A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.

Abstract: A power module for a power converter includes a first busbar with a first surface and a second surface opposite the first surface, a first semiconductor component on the first surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection, to the first surface of the first busbar in an electrically conductive and mechanical fashion over an area, and a second semiconductor component on the second surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection of the second semiconductor component, to the second surface of the first busbar in an electrically conductive and mechanical fashion over an area.

Abstract: A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.

Abstract: A power conversion apparatus includes: a casing that houses an electronic component; a heat sink where the casing is installed, the heat sink dissipating a heat from the electronic component; a substrate disposed on an opposite side of the heat sink in the casing, the substrate including a power converter circuit; a pressing member housed in the casing, the pressing member pressing the electronic component to the heat sink side; and an insulating cover member included in the casing, the insulating cover covering at least a part of the substrate side of the pressing member.

Abstract: A system and method for provisioning within a system design to allow the storage and IO resources to scale with compute resources are provided.

Abstract: In accordance with some implementations of this invention, an electronic assembly is formed with a thermal channel that controls an air flow for the purpose of dissipating heat generated in the electronic assembly. The electronic assembly includes a top board, a bottom board and a subassembly that further includes a rail, an airflow tab and an interconnect. The subassembly couples the top and bottom boards together. The rail has an opening through which air passes. The interconnect faces the airflow tab, carries electrical signals between the top board and the bottom board, and is configured to channel air directed through the opening of the rail.

Abstract: A fixing device for a card fluid cooling structure of an interface includes: a water cooling device, adapted to cool an interface card; a cold drainage tube, configured on the water cooling device; a hot drainage tube, configured on the water cooling device and positioned at one side of the cold drainage tube; a first quick connector, configured on one end of the cold drainage tube far away from the water cooling device; a second quick connector, configured on one end of the hot drainage tube far away from the water cooling device; and a fixing structure, configured on one side of the interface card for the fixation of the hot and cold drainage tubes in position. Whereby, a user uses the fixing structure to fix the hot and cold drainage tubes in position, and the water cooling device can then be installed on the interface card conveniently.

Abstract: An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.

Abstract: A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: This breaker panel comprises a plurality of circuit breakers, each circuit breaker having a head comprising a frustroconical seal made of an elastomer, this frustroconical seal having a first frustroconical face; and a conic frustum made of a material that is harder than the material of the frustroconical seal, this conic frustum having a second frustroconical face; in which: the distance, in a plug-in direction, between an upper edge of the first frustroconical face and the shoulder is at least two times smaller than the distance, in the plug-in direction, between the upper and lower edges of the second frustroconical face; and the upper edge of the first frustroconical face is set back, towards the interior of the circuit breaker, relative to the lower edge of the second frustroconical face.

Abstract: An electronic equipment includes a refrigerant tank that contains a refrigerant, an electronic component, a through card electrically coupled to the electronic component, and a pouch of which one end side is in a close contact with the through card so as to seal the electronic component, wherein the electronic component is immersed in the refrigerant of the refrigerant tank in a state of being sealed in the pouch.