Abstract: A cooling device includes a plurality of side wall fins formed on an outer surface of a first side wall of a housing, and a plurality of bottom fins formed on a bottom surface of a bottom portion of the housing. A cover member covers the side wall fins and bottom fins from an outer side to form side wall and bottom cooling channels. A chamber is provided that forms a fluid introduction chamber in a direction facing a second side wall so as to communicate with the side wall cooling channel and the bottom cooling channel. A coolant supply device is externally attached to the chamber so as to supply a coolant to the fluid introduction chamber. The side wall fins and the bottom fins are formed in predetermined shapes to adjust an amount of the coolant in the side wall cooling channel and the bottom cooling channel.

Abstract: An electronic device is provided. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes a heat sink with air current generating electric device assembly, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink with air current generating electric device assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. The heat sink with air current generating electric device assembly further includes an air current generating electric device disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board.

Abstract: Technologies are generally described for a pocket junction box system. In an example, a pocket junction box is configured to fit inside a meter collar. The pocket junction box includes a first set of electrical terminals on a rear surface of the pocket junction box for interfacing with wire leads inside the meter collar, and a second set of electrical terminals on a front surface of the pocket junction box for interfacing with field wire leads outside the meter collar. The pocket junction box may further include at least one current transducer and at least one microprocessor for monitoring the power flow through the pocket junction box. A front casing is attached to the front surface of the pocket junction box and connected to the second set of electrical terminals. The front casing may include a communications circuit board for communicating with a meter data management system.

Abstract: The disclosed apparatus may include (1) an access surface that provides access to ports used to connect devices to a telecommunications network via the line card, (2) a back opposite the access surface, (3) a row of ports arranged along the access surface to house a set of transceivers, and (4) a recessed row of ports arranged along the access surface to house an additional set of transceivers, such that the recessed row of ports is recessed inward toward the back relative to the row of ports. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A cooling and power delivery system for a computer system includes a first fluid, a second fluid conduit, and a power supply thermally connected to at least one of the first and second fluid conduits. A first board receiving member is fluidically connected to the first and second fluid conduits and electrically connected to the power supply. A second board receiving member is fluidically connected to the first and second fluid conduits and electrically connected to the power supply. An electronics board is supported between the first board receiving member and the second board receiving member. The electronics board is electrically connected to the power supply through at least one of the first and second board receiving members.

Abstract: Fabrication of a latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: A system and method for provisioning within a system design to allow the storage and IO resources to scale with compute resources are provided.

Abstract: A display module with heat dissipation structure and a handheld device thereof. The display module includes a touch panel, a display panel and a vapor chamber. One face of the display panel is correspondingly attached to the touch panel, while the other face of the display panel is correspondingly attached to the vapor chamber. The vapor chamber serves to support the touch panel and the display panel. Moreover, the vapor chamber serves to absorb the heat generated by the electronic component and quickly and uniformly spread the heat to dissipate the heat to achieve a heat spreading effect.

Abstract: A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

Abstract: A contactor interconnect includes a lead post, a bus bar post and a plurality of electrically conductive heat rejection components. The lead post electrically connects to the bus bar post in series through the plurality of heat rejection components. The heat rejection components in turn connect electrically in parallel with one another between the lead post and the bus bar post for conducting current between the posts and passively dissipating heat conveyed from the lead post toward the bus bar post.

Abstract: A data center includes two or more rack computing systems, a free cooling system, and an electrical power system. The free air cooling system includes air moving devices external to the rack computing systems. The electrical power system includes switchgear and one or more power panels. The switchgear receives power from a utility power feed. The power panels receive power from the switchgear. The power panels supply electrical power to the computing devices.

Abstract: Provided are a window member for a display device of a portable terminal and a method for fabricating the window member. An inner surface of the window member is formed as a flat surface from a first end portion to a position adjacent to a second end portion, and an inner surface of the second end portion is formed inclined with respect to the flat surface in a direction toward an outer surface. According to the window member and the method for fabricating the same, shrinkage is minimized during hardening of melt resin by sufficiently delivering injection pressure for the melt resin over the entire molding space of a mold, thereby improving a product defect rate.

Abstract: An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing.

Abstract: An information handling system cooling fan has a vibration filter that tunes out predetermined fan vibration frequencies to reduce fan vibration transfer from the cooling fan to an information handling system chassis in a targeted frequency range. For example, a leaf spring and damper are biased between the cooling fan and a fan bay support so that stiffness of the spring attenuates selected vibration frequency ranges of the cooling fan bay subsystem, such as frequency ranges where the vibrations have the greatest amplitude or frequency ranges where the vibrations tend to damage other components of the information handling system. In one embodiment, a vibration source generates out-of-phase vibrations that cancel cooling fan vibrations to further reduce overall system vibration output.

Abstract: A computer system using 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level is kept constant to ensure heat exchanger work at optimal condition. The simple approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.

Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

Abstract: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.

Abstract: A rack for electronic plug-in boards has board cages on the front and rear sides and at least one vertical backplane arranged between the board cages. The rack has an installation space provided underneath or above the board cages and into which fan modules can be horizontally inserted from the front side. A power supply module with an electronics unit supplies power to the backplane. The installation space continuously extends up to the region of the board cage on the rear side. The electronics unit is arranged in the region of the rear side of the rack underneath or above the board cage and defines the installation space toward the rear. The electronics unit is connected to the backplane by rigid electric conductors horizontally extending between the board cage on the rear side and the installation space parallel and at a distance from one another.

Abstract: A rack mountable network switch, the rack mountable network switch comprising: a faceplate; a switch chassis coupled to the faceplate, the switch chassis including a plurality of connector openings on a surface of the switch chassis that is perpendicular to the faceplate; a plurality of moveable plug receptacles coupled to a printed circuit board (‘PCB’) mounted inside the switch chassis; and a mechanical positioning component coupled to the moveable plug receptacles, the mechanical positioning component configured to position the moveable plug receptacles to extrude from the switch chassis via the connector openings when the mechanical positioning component is in a first position, the mechanical positioning component further configured to position the moveable plug receptacles inside the switch chassis when the mechanical positioning component is in a second position.

Abstract: A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.