Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: A chassis input/output (I/O) module adapted for use in a front region of a mass storage chassis assembly is provided. The chassis I/O module in one example includes an I/O module shell, a main I/O connector externally available on the I/O module shell, a plurality of sub-assembly connectors externally available on the I/O module shell, one or more power supply modules, and an interface module electrically coupled to the main I/O connector, the plurality of sub-assembly connectors, and the one or more power supply modules, with the interface module configured to regulate operations of one or more mass storage sub-assemblies installed in the mass storage chassis assembly, regulate provision of electrical power from the one or more power supply modules to the one or more mass storage sub-assemblies, and facilitate exchange of electrical signals between the one or more mass storage sub-assemblies and the main I/O connector.

Abstract: An integrated power rack for use in a data center is provided. The integrated power rack includes a top, a base, a first side and a second side extending between the base and the top, a back member extending between the top, the base, the first side, and the second side, a divider extending from the top to the base, the divider positioned between the first side and the second side, a revenue sub-compartment defined between the first side and the divider, the revenue sub-compartment configured to receive a plurality of revenue producing devices, and a power sub-compartment defined between the second side and the divider, the power sub-compartment housing power equipment that is configured to provide direct-current (DC) power to the revenue sub-compartment.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.

Abstract: A wearable computer system that provides for convenient and efficient use of all fingers while the user is standing, reclining or using hands intermittently for other tasks. The central unit hangs from a neck strap and communicates with a head mounted display. The central unit's front surface has keys, accessible from opposite edges by each hand. Typing is similar to the traditional, but rotated 90 degrees on each side. Keys are individually assignable to any letter, symbol, musical note, color, action, or macro. Back panels have thumb keys and controls, and can be modified to accept alternate thumb controls and additional hardware, such as sensors, circuits, cameras, and auxiliary connectors for specific tasks such as musical instrument performance or augmented reality game play. Smartphones, can be incorporated within or connected to the central unit. Desktop use can be accomplished by unfolding the panels of one embodiment.

Abstract: Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.

Abstract: A portable electronic apparatus assembly includes a tabular electronic device and a supporting device. The supporting device includes a base, a connecting member pivotally connected to the base, and a supporting member pivotally connected to the connecting member. The connecting member can rotate about a first rotation axis relative to the base. The supporting member can rotate about a second rotation axis relative to the connecting member. The first rotation axis and the second rotation axis are nonparallel. The supporting device can support the tabular electronic device by accommodating the tabular electronic device in an accommodating slot of the supporting member. Thereby, unfolding and folding of the supporting member relative to the base is more flexible. The whole thickness of the supporting device after folded can avoid being restrained by the thickness of the tabular electronic device.

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Abstract: A cooling module is used to cool an electronic component, the cooling module includes a shell and a radiator which is received in the shell. The shell includes a receiving portion which is used to receive the radiator. Two sides of the receiving include two latch pieces, the latch piece defines a latch hole. Two sides of the radiator include two protrusive blocks, the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell.

Abstract: A method for assembling a power conversion device is provided. The method includes mounting an electronic component on a heat-dissipating base, and electrically connecting a printed wiring board with the electronic component mounted on the heat-dissipating base.

Abstract: A heat dissipating component includes a plurality of heat absorbers each provided for a corresponding one of a plurality of electronic components and to absorb heat from the corresponding one of the plurality of electronic components, and a heat dissipator thermally connected to the plurality of heat absorbers and to dissipate the heat absorbed by the plurality of heat absorbers. The heat dissipating component may be incorporated in an electronic device.

Abstract: An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.

Abstract: A container data center includes a cabinet and a function module. The cabinet includes a plurality of sides and a bottom. A first one of the sides defines a plurality of spaced openings. At least one door is rotatably attached to the side beside each opening. A support member is rotatably attached to the sides near a bottom edge of each opening. The door and the support members are rotated to open each opening and the support members are aligned with the bottom to allow the function modules to slide on the bottom and the support members.

Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

Abstract: An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is separated from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.

Abstract: A companion integrated circuit (IC) and a mobile device having the same are provided. The companion IC may include a decoupling capacitor that stably supplies voltage to an application processor, at least one auxiliary semiconductor device that communicates with the application processor, and a multi-chip package that includes the decoupling capacitor and the auxiliary semiconductor device.

Abstract: An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

Abstract: A server chassis, including: a first compartment configured to receive one or more central electronics complexes (‘CECs’); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.