Patents by Inventor A-Tzu Chen
A-Tzu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240160958Abstract: A data driven system and a data driven method are provided. The data driven system includes a storage device and a processor. The storage device stores a data change sensing module, a data driven module, and a data footprint module. The processor is coupled to the storage device. The processor executes the data change sensing module to detect changed data. The processor executes the data driven module to obtain business data according to the changed data, and executes a task according to the business data to generate an execution result. The processor executes the data footprint module to record processing data generated during execution of the task.Type: ApplicationFiled: February 10, 2023Publication date: May 16, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Tzu-Chen Yeh, Hsiuchun Chen, Guoxin Sun, Xiaoliang Ma, Lei Feng, Chu Yang Wang
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Publication number: 20240161023Abstract: The disclosure provides a data-driven system and a data-driven method based on a data-driven model. The data-driven system includes a storage device storing a data-driven module, a knowledge map module, and a data footprint module and a processor being coupled to the storage device. The processor executes the data-driven module to provide the current data status and feature description information corresponding to the changed business data to the knowledge map module. The processor executes the knowledge map module to analyze the current data status and feature description information, and returns the corresponding data-driven model to the data-driven module, and the data-driven module executes the task in the data-driven model. The processor executes the data footprint module to record the task execution result generated by the data-driven module executing the task.Type: ApplicationFiled: February 7, 2023Publication date: May 16, 2024Applicants: Digiwin Software Co., Ltd, DATA SYSTEMS CONSULTING CO., LTD.Inventors: Tzu-Chen Yeh, Hsiuchun Chen, Guoxin Sun, Xiaoliang Ma, Lei Feng, Chu Yang Wang
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Patent number: 11982802Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.Type: GrantFiled: March 31, 2022Date of Patent: May 14, 2024Assignee: Chung Yuan Christian UniversityInventors: Cheng-An Lin, Tzu-Yin Hou, You-Wei Li, Yuh-Show Tsai, Ming-Chen Wang
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Publication number: 20240154532Abstract: A control method in use of a flyback power converter is disclosed to provide an operation power source supplying power to a power controller controlling a main power switch. The flyback power converter has a transformer with a primary winding and an auxiliary winding. The main power switch and the primary winding are connected in series. A chopper switch and a buffer inductor are connected in series between the auxiliary winding and the power controller. The power controller turns ON the main power switch for an ON time to energize the transformer, and turns ON the chopper switch for at least a time period during the ON time, so that during the time period the buffer inductor conducts an induced current flowing from the auxiliary winding and through the chopper switch, to build up the operation power source.Type: ApplicationFiled: December 13, 2022Publication date: May 9, 2024Inventors: Tzu Chen LIN, Ming-Chang TSOU
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Publication number: 20240152032Abstract: A dynamic aperture module includes a blade set and a driving portion. The blade set includes a plurality of blades, which are disposed around an optical axis to form a light through hole and rotatable for adjusting the light through hole. The driving portion includes a rotating element, at least one magnet and at least one coil. The rotating element corresponds to the blades and is configured to drive the blades to rotate, so that a dimension of the light through hole is variable. The magnet includes four polarities. The polarities of the magnet are relatively distributed along a direction surrounding the optical axis and a direction parallel to the optical axis, respectively. The coil corresponds to the magnet, and one of the magnet and the coil is disposed on the rotating element. The magnet and the coil are disposed along the direction parallel to the optical axis.Type: ApplicationFiled: November 2, 2023Publication date: May 9, 2024Inventors: Yu-Tzu CHANG, Hao-Jan CHEN, Hsiu-Yi HSIAO, Ming-Ta CHOU
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Publication number: 20240153895Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.Type: ApplicationFiled: April 19, 2023Publication date: May 9, 2024Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
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Patent number: 11977693Abstract: A position indicator that is used with a position detection device including a position detection sensor, the position indicator including a first function module and a second function module. The first function module includes a core body that, in operation, is brought into contact with an input surface for position detection in the position detection sensor, and a position detection signal transmission circuit, in operation, that transmits a position detection signal to the position detection sensor. The second function module includes a first function circuit that, in operation, generates characteristic selection information corresponding to a characteristic of the core body or a characteristic of the input surface and transmits the characteristic selection information, or a second function circuit that, in operation, generates a stimulus corresponding to the characteristic selection information such that a user who is holding the position indicator audibly or tactilely perceives the stimulus.Type: GrantFiled: March 7, 2023Date of Patent: May 7, 2024Assignee: Wacom Co., Ltd.Inventors: Nobutaka Ide, Koji Yano, Takahiko Hoen, Mu-Tzu Chen, Tadakuni Tsubota
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Patent number: 11977274Abstract: An optical photographing lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements of the optical photographing lens assembly has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is concave in a paraxial region thereof. The object-side surface of the first lens element is aspheric and has at least one critical point in an off-axis region thereof.Type: GrantFiled: November 2, 2022Date of Patent: May 7, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Cheng-Chen Lin, Yu-Tai Tseng, Tzu-Chieh Kuo
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Publication number: 20240142544Abstract: A testing system includes: a dividing circuit configured to receive a testing signal and provide a plurality of input signals according to the testing signal; and a plurality of integrated power-amplifiers coupled to the dividing circuit, each of the plurality of integrated power-amplifiers being configured to be tested by receiving a respective input signal of the plurality of input signals and generating a respective output signal for a predetermined testing time.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Inventors: HSIEH-HUNG HSIEH, WU-CHEN LIN, YEN-JEN CHEN, TZU-JIN YEH
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Publication number: 20240139262Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.Type: ApplicationFiled: October 13, 2023Publication date: May 2, 2024Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
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Patent number: 11972562Abstract: A method for determining a plant growth curve includes obtaining color images and depth images of a plant to be detected at different time points, performing alignment processing on each color image and each depth image to obtain an alignment image, detecting the color image through a pre-trained target detection model to obtain a target bounding box, calculating an area ratio of the target bounding box in the color image, determining a depth value of all pixel points in the target boundary frame according to the aligned image, performing denoising processing on each depth value to obtain a target depth value, generating a first growth curve of the plant to be detected according to the target depth values and corresponding time points, and generating a second growth curve of the plant to be detected according to the area ratios and the corresponding time points.Type: GrantFiled: January 7, 2022Date of Patent: April 30, 2024Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chih-Te Lu, Chin-Pin Kuo, Tzu-Chen Lin
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Publication number: 20240136247Abstract: In at least one aspect, a method can include shaping a block of flexible spacer material. The method can include shaping a portion of the block of flexible spacer material to receive a solid metal block. The method can include coupling the solid metal block to the portion of the block of flexible spacer material.Type: ApplicationFiled: December 11, 2023Publication date: April 25, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Liangbiao CHEN, Yong LIU, Tzu-Hsuan CHENG, Stephen ST. GERMAIN, Roger ARBUTHNOT
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Publication number: 20240130243Abstract: Embodiments of present invention provide a magnetic tunnel junction (MTJ) structure. The MTJ structure includes a MTJ stack, the MTJ stack including a tunnel barrier layer on a reference layer and a free layer on the tunnel barrier layer, wherein the free layer includes multiple sub free layers, the multiple sub free layers being multiple ferromagnetic strips placed parallel to each other on the tunnel barrier layer, the multiple ferromagnetic strips having respective first ends connected to a first electrode and respective second ends connected to a second electrode. A method of forming the MTJ structure is also provided.Type: ApplicationFiled: October 17, 2022Publication date: April 18, 2024Inventors: Timothy Mathew Philip, Ching-Tzu Chen, Kevin W. Brew, JIN PING HAN, Injo Ok
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Patent number: 11959101Abstract: A cell activation reactor and a cell activation method are provided. The cell activation reactor includes a body, a rotating part, an upper cover, a microporous film, and multiple baffles. The body has an accommodating space, which is suitable for accommodating multiple cells and multiple magnetic beads. The rotating part is disposed in the accommodating space and includes multiple impellers. The microporous film is disposed in the accommodating space and covers multiple holes of the accommodating space. The baffles are disposed in the body. When the rotating part is driven to rotate, the interaction between the baffles and the impellers separates the cells and the magnetic beads.Type: GrantFiled: November 26, 2021Date of Patent: April 16, 2024Assignee: Industrial Technology Research InstituteInventors: Ting-Hsuan Chen, Kuo-Hsing Wen, Ya-Hui Chiu, Nien-Tzu Chou, Ching-Fang Lu, Cheng-Tai Chen, Ting-Shuo Chen, Pei-Shin Jiang
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Patent number: 11954875Abstract: A method for determining a height of a plant, an electronic device, and a storage medium are disclosed. In the method, a target image is obtained by mapping an obtained color image with an obtained depth image. The electronic device processes the color image by using a pre-trained mobilenet-ssd network, obtains a detection box appearance of the plant, and extracts target contours of the plant to be detected from the detection box. The electronic device determines a depth value of each of pixel points in the target contour according to the target image. Target depth values are obtained by performing a de-noising on depth values of the pixel points, and a height of the plant to be detected is determined according to the target depth value. The method improves accuracy of height determination of a plant.Type: GrantFiled: January 10, 2022Date of Patent: April 9, 2024Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Tzu-Chen Lin, Chih-Te Lu, Chin-Pin Kuo
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Publication number: 20240113024Abstract: An interconnect structure including conducting layers of topological semi-metals and/or topological insulators. To increase charge carrier density in the conducting layers, a charge carrier doping layer present on at least one surface of the one or more conductive layers of topological semi-metals. The charge carrying doping layers have a charge carrier density greater than the topological semi-metals and/or topological insulators of the one or more conductive layers.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Ching-Tzu Chen, Christian Lavoie, Guy M. Cohen, Utkarsh Bajpai, Nicholas Anthony Lanzillo, Teodor Krassimirov Todorov, Oki GUNAWAN, NATHAN P. MARCHACK, Peter Kerns
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Publication number: 20240113166Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.Type: ApplicationFiled: February 15, 2023Publication date: April 4, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
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Publication number: 20240107900Abstract: A phase change memory structure with improved sidewall heater and formation thereof may be presented. Phase change materials are capable of being switched between a first structural state in which the material is in a generally amorphous solid phase, and a second structural state in which the material is in a generally crystalline solid phase in the active region of the cell. Presented herein may be a side wall heater, where the upper section extends through bilayer dielectric to contact a phase change material layer and the lower section of the sidewall heater has conductive layers in contact with the bottom electrode. The width of the sidewall heater may reflect an inverted T shape reducing the current requirement to reset the phase change material.Type: ApplicationFiled: September 22, 2022Publication date: March 28, 2024Inventors: Juntao Li, Kangguo Cheng, Carl Radens, Ching-Tzu Chen
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Publication number: 20240097661Abstract: A scan flip-flop circuit includes a selection circuit including first and second input terminals coupled to first and second I/O nodes, a flip-flop circuit coupled to the selection circuit, a first driver coupled between the flip-flop circuit and the first I/O node, and a second driver coupled between the flip-flop circuit and the second I/O node. The selection circuit and drivers receive a scan direction signal. In response to a first logic level of the scan direction signal, the selection circuit responds to a first signal received at the first input terminal, and the second driver outputs a second signal responsive to a flip-flop circuit output signal. In response to a second logic level of the scan direction signal, the selection circuit responds to a third signal received at the second input terminal, and the first driver outputs a fourth signal responsive to the flip-flop circuit output signal.Type: ApplicationFiled: January 9, 2023Publication date: March 21, 2024Inventors: Huaixin XIAN, Tzu-Ying LIN, Liu HAN, Jerry Chang Jui KAO, Qingchao MENG, Xiangdong CHEN
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Publication number: 20240096734Abstract: A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.Type: ApplicationFiled: November 27, 2023Publication date: March 21, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Tzu-Hsuan CHENG, Yong LIU, Liangbiao CHEN