Patents by Inventor Akira Kaneko
Akira Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9896003Abstract: A shoulder support adjuster includes a shoulder support, a bending angle adjusting mechanism, and a bending position adjusting mechanism. The bending angle adjusting mechanism and the bending position adjusting mechanism are provided within the shoulder support of a vehicle seat. At the bending angle adjusting mechanism, a bending angle of the seatback is adjusted by inflating an airbag. Further, at the bending position adjusting mechanism, by inflating the airbag and airbags, a flexed position of a shoulder plate is moved downward, and a bending position of the seatback changes downward. The bending position of the seatback is thereby adjusted.Type: GrantFiled: August 27, 2014Date of Patent: February 20, 2018Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroshi Tamura, Akira Kaneko
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Patent number: 9868370Abstract: A seatback frame structure includes a reclining mechanism, a joining member that is joined to the reclining mechanism, a fastening member, a seatback frame, and a restricting member. The seatback frame forms a frame of a seatback that can support a back of a seated occupant. The seatback frame is fastened to the joining member by the fastening member. The restricting member includes a restricting portion. The restricting portion is fastened, together with the seatback frame, to the joining member by the fastening member. The restricting portion is configured to restrict relative movement of the seatback frame with respect to the joining member when a vehicle is involved in a rear collision. The seatback frame is made of resin, and the seatback frame is fixed in a state sandwiched by the restricting member and the joining member.Type: GrantFiled: August 26, 2014Date of Patent: January 16, 2018Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akira Kaneko, Hiroshi Tamura, Takuya Ishikawa
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Publication number: 20170197525Abstract: A slide rail includes a fixed-side rail, a movable-side rail, and a reinforcing structure that prevents detachment of the movable-side rail from the fixed-side rail. The reinforcing structure includes a fixed-side engaging portion attached to the fixed-side rail, and a movable-side engaging portion attached to the movable-side rail. The fixed-side and the movable-side engaging portions are configured, while allowing sliding of the movable-side rail, to come in contact with each other due to an action by a large load in a detaching direction input between the fixed-side rail and the movable-side rail, and to be engaged with each other to restrict movement of the movable-side rail in the detaching direction. A contact surface, that comes in contact with the movable-side engaging portion, of the fixed-side engaging portion includes surface regions that have mutually different positions in the detaching direction and are provided side by side in a sliding direction.Type: ApplicationFiled: January 4, 2017Publication date: July 13, 2017Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuki HATTORI, Tomokazu FUKUDA, Eiji MIZUTANI, Taro FUKUTA, Akira KANEKO
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Publication number: 20170120778Abstract: A vehicle seat includes: a seat cushion; a base provided on a vehicle body; a seat lifter configured to adjust a height of the seat cushion by a rotational motion of a link connecting the seat cushion to the base; and a fixture of a seat belt, the fixture being attached to the link.Type: ApplicationFiled: October 28, 2016Publication date: May 4, 2017Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kazuya SUZUKI, Masato ARASHI, Akira KANEKO
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Publication number: 20160339814Abstract: In an initial position, a movable plate (50) is rotatably connected to a fixed plate (40) by a connecting mechanism (70) (a shaft member (80) and a groove (72)). In a switching position, the movable plate (50) is slidably connected to the fixed plate (40) by the connecting mechanism (70) in a manner that enables the movable plate (50) to slide toward a seat width direction center side. When the movable plate (50) is pushed toward the seat width direction center side by the bladder (60), the movable plate (50) and a support pad are rotated from the initial position to the switching position. Then, the movable plate (50) that has rotated to the switching position is pushed toward the seat width direction center side, by the bladder (60), and the movable plate (50) and the sup port pad slide from the switching position toward the seat width direction center side.Type: ApplicationFiled: December 5, 2014Publication date: November 24, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Ken TANAKA, Akira KANEKO, Hiroshi TAMURA
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Patent number: 9434341Abstract: In a vehicular seat, a side airbag module and a side support bladder are arranged inside a shell frame that constitutes a skeleton of a seat back. A base bracket of a support body is disposed between the side support bladder and the side airbag module. This base bracket is supported by the shell frame. The base bracket supports the side support bladder from outside in a seat width direction at the time of inflation of the side support bladder, and is rotated inward in the seat width direction around a hinge together with the side support bladder due to an inflation pressure of a side airbag at the time of inflation and deployment of the side airbag.Type: GrantFiled: February 12, 2014Date of Patent: September 6, 2016Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akira Kaneko, Shunsuke Tanaka
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Publication number: 20160229316Abstract: A shoulder support adjuster includes a shoulder support, a bending angle adjusting mechanism, and a bending position adjusting mechanism. The bending angle adjusting mechanism and the bending position adjusting mechanism are provided within the shoulder support of a vehicle seat. At the bending angle adjusting mechanism, a bending angle of the seatback is adjusted by inflating an airbag. Further, at the bending position adjusting mechanism, by inflating the airbag and airbags, a flexed position of a shoulder plate is moved downward, and a bending position of the seatback changes downward. The bending position of the seatback is thereby adjusted.Type: ApplicationFiled: August 27, 2014Publication date: August 11, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroshi TAMURA, Akira KANEKO
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Publication number: 20160207425Abstract: A seatback frame structure includes a reclining mechanism, a joining member that is joined to the reclining mechanism, a fastening member, a seatback frame, and a restricting member. The seatback frame forms a frame of a seatback that can support a back of a seated occupant. The seatback frame is fastened to the joining member by the fastening member. The restricting member includes a restricting portion. The restricting portion is fastened, together with the seatback frame, to the joining member by the fastening member. The restricting portion is configured to restrict relative movement of the seatback frame with respect to the joining member when a vehicle is involved in a rear collision. The seatback frame is made of resin, and the seatback frame is fixed in a state sandwiched by the restricting member and the joining member.Type: ApplicationFiled: August 26, 2014Publication date: July 21, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akira KANEKO, Hiroshi TAMURA, Takuya ISHIKAWA
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Publication number: 20160200232Abstract: A vehicle seat (10) comprising a seat cushion frame (72) that configures a seat cushion (70); a seat back frame (14) that configures a seat back (12), the seat back frame (14) being formed in a panel shape and having, on a lower portion thereof on both sides in a seat width direction, coupling portions (46) that are coupled to the seat cushion frame (72); fixing portions (20) that are formed in an upper portion of the seat back frame (14) and fix a headrest (60); and load transmitting portions (40) that are disposed in the seat back frame (14), are each formed in a substantially L-shape opening toward the seat rear side and outward in the seat width direction, and couple together the fixing portions (20) and the coupling portions (46).Type: ApplicationFiled: August 15, 2014Publication date: July 14, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroshi TAMURA, Akira KANEKO, Takuya ISHIKAWA
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Publication number: 20150360636Abstract: In a vehicular seat, a side airbag module and a side support bladder are arranged inside a shell frame that constitutes a skeleton of a seat back. A base bracket of a support body is disposed between the side support bladder and the side airbag module. This base bracket is supported by the shell frame. The base bracket supports the side support bladder from outside in a seat width direction at the time of inflation of the side support bladder, and is rotated inward in the seat width direction around a hinge together with the side support bladder due to an inflation pressure of a side airbag at the time of inflation and deployment of the side airbag.Type: ApplicationFiled: February 12, 2014Publication date: December 17, 2015Inventors: Akira KANEKO, Shunsuke TANAKA
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Patent number: 9087151Abstract: A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection.Type: GrantFiled: August 11, 2009Date of Patent: July 21, 2015Assignee: Mitsubishi Electric CorporationInventors: Satoru Nakai, Hirohisa Furuta, Akira Ishihara, Kimiaki Sato, Takashi Tsuboi, Akira Kaneko
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Patent number: 9034124Abstract: A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 ?m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 ?m is laminated to the metal foil.Type: GrantFiled: November 11, 2009Date of Patent: May 19, 2015Assignees: TOYO KOHAN CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hironao Okayama, Akira Kaneko, Takeshi Kato, Masaya Konishi
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Patent number: 8993064Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.Type: GrantFiled: November 12, 2010Date of Patent: March 31, 2015Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuhiko Hayashi, Kazuya Ohmatsu
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Patent number: 8815777Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.Type: GrantFiled: July 8, 2010Date of Patent: August 26, 2014Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.Inventors: Hironao Okayama, Teppei Kurokawa, Kouji Nanbu, Yoshihiko Isobe, Takashi Koshiro, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuya Ohmastu
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Publication number: 20130040821Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.Type: ApplicationFiled: November 12, 2010Publication date: February 14, 2013Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYO KOHAN CO., LTD.Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuhiko Hayashi, Kazuya Ohmatsu
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Publication number: 20120208703Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.Type: ApplicationFiled: July 8, 2010Publication date: August 16, 2012Applicants: Sumitomo Electric Industries, Ltd., Toyo Kohan Co., Ltd.Inventors: Hironao Okayama, Teppei Kurokawa, Kouji Nanbu, Yoshihiko Isobe, Takashi Koshiro, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuya Ohmastu
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Publication number: 20120040840Abstract: [Problem] A metal laminated substrate for an oxide superconducting wire is provided at a low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction. [Means for Resolution] A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 ?m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 ?m is laminated to the metal foil.Type: ApplicationFiled: November 11, 2009Publication date: February 16, 2012Inventors: Hironao Okayama, Akira Kaneko, Takeshi Kato, Masaya Konishi
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Publication number: 20110290380Abstract: Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150° C. and not higher than 1000° C.Type: ApplicationFiled: October 20, 2009Publication date: December 1, 2011Applicant: TOYO KOHAN CO., LTD.Inventors: Hironao Okayama, Akira Kaneko, Kouji Nanbu
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Publication number: 20110290378Abstract: Disclosed are a polymer laminated substrate for forming an epitaxial growth film having a highly-crystal-oriented surface and a method of manufacturing the polymer laminated substrate. The method of manufacturing a polymer laminated substrate for forming an epitaxial growth film includes the steps of: activating at least one surface of a polymer sheet T1; activating at least one surface of a metal foil T2 which is made of Cu or a Cu alloy and is formed by cold rolling at a draft of 90% or more; laminating the polymer sheet and the metal foil such that an activated surface of the polymer sheet and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the polymer sheet and the metal foil which are laminated to each other; and biaxially orienting crystals of the metal foil by heat treatment.Type: ApplicationFiled: October 20, 2009Publication date: December 1, 2011Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko
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Publication number: 20110270424Abstract: A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection.Type: ApplicationFiled: August 11, 2009Publication date: November 3, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Satoru Nakai, Hirohisa Furuta, Akira Ishihara, Kimiaki Sato, Takashi Tsuboi, Akira Kaneko