Patents by Inventor Akira Kaneko

Akira Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9896003
    Abstract: A shoulder support adjuster includes a shoulder support, a bending angle adjusting mechanism, and a bending position adjusting mechanism. The bending angle adjusting mechanism and the bending position adjusting mechanism are provided within the shoulder support of a vehicle seat. At the bending angle adjusting mechanism, a bending angle of the seatback is adjusted by inflating an airbag. Further, at the bending position adjusting mechanism, by inflating the airbag and airbags, a flexed position of a shoulder plate is moved downward, and a bending position of the seatback changes downward. The bending position of the seatback is thereby adjusted.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: February 20, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi Tamura, Akira Kaneko
  • Patent number: 9868370
    Abstract: A seatback frame structure includes a reclining mechanism, a joining member that is joined to the reclining mechanism, a fastening member, a seatback frame, and a restricting member. The seatback frame forms a frame of a seatback that can support a back of a seated occupant. The seatback frame is fastened to the joining member by the fastening member. The restricting member includes a restricting portion. The restricting portion is fastened, together with the seatback frame, to the joining member by the fastening member. The restricting portion is configured to restrict relative movement of the seatback frame with respect to the joining member when a vehicle is involved in a rear collision. The seatback frame is made of resin, and the seatback frame is fixed in a state sandwiched by the restricting member and the joining member.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: January 16, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira Kaneko, Hiroshi Tamura, Takuya Ishikawa
  • Publication number: 20170197525
    Abstract: A slide rail includes a fixed-side rail, a movable-side rail, and a reinforcing structure that prevents detachment of the movable-side rail from the fixed-side rail. The reinforcing structure includes a fixed-side engaging portion attached to the fixed-side rail, and a movable-side engaging portion attached to the movable-side rail. The fixed-side and the movable-side engaging portions are configured, while allowing sliding of the movable-side rail, to come in contact with each other due to an action by a large load in a detaching direction input between the fixed-side rail and the movable-side rail, and to be engaged with each other to restrict movement of the movable-side rail in the detaching direction. A contact surface, that comes in contact with the movable-side engaging portion, of the fixed-side engaging portion includes surface regions that have mutually different positions in the detaching direction and are provided side by side in a sliding direction.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 13, 2017
    Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuki HATTORI, Tomokazu FUKUDA, Eiji MIZUTANI, Taro FUKUTA, Akira KANEKO
  • Publication number: 20170120778
    Abstract: A vehicle seat includes: a seat cushion; a base provided on a vehicle body; a seat lifter configured to adjust a height of the seat cushion by a rotational motion of a link connecting the seat cushion to the base; and a fixture of a seat belt, the fixture being attached to the link.
    Type: Application
    Filed: October 28, 2016
    Publication date: May 4, 2017
    Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kazuya SUZUKI, Masato ARASHI, Akira KANEKO
  • Publication number: 20160339814
    Abstract: In an initial position, a movable plate (50) is rotatably connected to a fixed plate (40) by a connecting mechanism (70) (a shaft member (80) and a groove (72)). In a switching position, the movable plate (50) is slidably connected to the fixed plate (40) by the connecting mechanism (70) in a manner that enables the movable plate (50) to slide toward a seat width direction center side. When the movable plate (50) is pushed toward the seat width direction center side by the bladder (60), the movable plate (50) and a support pad are rotated from the initial position to the switching position. Then, the movable plate (50) that has rotated to the switching position is pushed toward the seat width direction center side, by the bladder (60), and the movable plate (50) and the sup port pad slide from the switching position toward the seat width direction center side.
    Type: Application
    Filed: December 5, 2014
    Publication date: November 24, 2016
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Ken TANAKA, Akira KANEKO, Hiroshi TAMURA
  • Patent number: 9434341
    Abstract: In a vehicular seat, a side airbag module and a side support bladder are arranged inside a shell frame that constitutes a skeleton of a seat back. A base bracket of a support body is disposed between the side support bladder and the side airbag module. This base bracket is supported by the shell frame. The base bracket supports the side support bladder from outside in a seat width direction at the time of inflation of the side support bladder, and is rotated inward in the seat width direction around a hinge together with the side support bladder due to an inflation pressure of a side airbag at the time of inflation and deployment of the side airbag.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: September 6, 2016
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira Kaneko, Shunsuke Tanaka
  • Publication number: 20160229316
    Abstract: A shoulder support adjuster includes a shoulder support, a bending angle adjusting mechanism, and a bending position adjusting mechanism. The bending angle adjusting mechanism and the bending position adjusting mechanism are provided within the shoulder support of a vehicle seat. At the bending angle adjusting mechanism, a bending angle of the seatback is adjusted by inflating an airbag. Further, at the bending position adjusting mechanism, by inflating the airbag and airbags, a flexed position of a shoulder plate is moved downward, and a bending position of the seatback changes downward. The bending position of the seatback is thereby adjusted.
    Type: Application
    Filed: August 27, 2014
    Publication date: August 11, 2016
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi TAMURA, Akira KANEKO
  • Publication number: 20160207425
    Abstract: A seatback frame structure includes a reclining mechanism, a joining member that is joined to the reclining mechanism, a fastening member, a seatback frame, and a restricting member. The seatback frame forms a frame of a seatback that can support a back of a seated occupant. The seatback frame is fastened to the joining member by the fastening member. The restricting member includes a restricting portion. The restricting portion is fastened, together with the seatback frame, to the joining member by the fastening member. The restricting portion is configured to restrict relative movement of the seatback frame with respect to the joining member when a vehicle is involved in a rear collision. The seatback frame is made of resin, and the seatback frame is fixed in a state sandwiched by the restricting member and the joining member.
    Type: Application
    Filed: August 26, 2014
    Publication date: July 21, 2016
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira KANEKO, Hiroshi TAMURA, Takuya ISHIKAWA
  • Publication number: 20160200232
    Abstract: A vehicle seat (10) comprising a seat cushion frame (72) that configures a seat cushion (70); a seat back frame (14) that configures a seat back (12), the seat back frame (14) being formed in a panel shape and having, on a lower portion thereof on both sides in a seat width direction, coupling portions (46) that are coupled to the seat cushion frame (72); fixing portions (20) that are formed in an upper portion of the seat back frame (14) and fix a headrest (60); and load transmitting portions (40) that are disposed in the seat back frame (14), are each formed in a substantially L-shape opening toward the seat rear side and outward in the seat width direction, and couple together the fixing portions (20) and the coupling portions (46).
    Type: Application
    Filed: August 15, 2014
    Publication date: July 14, 2016
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi TAMURA, Akira KANEKO, Takuya ISHIKAWA
  • Publication number: 20150360636
    Abstract: In a vehicular seat, a side airbag module and a side support bladder are arranged inside a shell frame that constitutes a skeleton of a seat back. A base bracket of a support body is disposed between the side support bladder and the side airbag module. This base bracket is supported by the shell frame. The base bracket supports the side support bladder from outside in a seat width direction at the time of inflation of the side support bladder, and is rotated inward in the seat width direction around a hinge together with the side support bladder due to an inflation pressure of a side airbag at the time of inflation and deployment of the side airbag.
    Type: Application
    Filed: February 12, 2014
    Publication date: December 17, 2015
    Inventors: Akira KANEKO, Shunsuke TANAKA
  • Patent number: 9087151
    Abstract: A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: July 21, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoru Nakai, Hirohisa Furuta, Akira Ishihara, Kimiaki Sato, Takashi Tsuboi, Akira Kaneko
  • Patent number: 9034124
    Abstract: A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 ?m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 ?m is laminated to the metal foil.
    Type: Grant
    Filed: November 11, 2009
    Date of Patent: May 19, 2015
    Assignees: TOYO KOHAN CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hironao Okayama, Akira Kaneko, Takeshi Kato, Masaya Konishi
  • Patent number: 8993064
    Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: March 31, 2015
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuhiko Hayashi, Kazuya Ohmatsu
  • Patent number: 8815777
    Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: August 26, 2014
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hironao Okayama, Teppei Kurokawa, Kouji Nanbu, Yoshihiko Isobe, Takashi Koshiro, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuya Ohmastu
  • Publication number: 20130040821
    Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
    Type: Application
    Filed: November 12, 2010
    Publication date: February 14, 2013
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYO KOHAN CO., LTD.
    Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuhiko Hayashi, Kazuya Ohmatsu
  • Publication number: 20120208703
    Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
    Type: Application
    Filed: July 8, 2010
    Publication date: August 16, 2012
    Applicants: Sumitomo Electric Industries, Ltd., Toyo Kohan Co., Ltd.
    Inventors: Hironao Okayama, Teppei Kurokawa, Kouji Nanbu, Yoshihiko Isobe, Takashi Koshiro, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuya Ohmastu
  • Publication number: 20120040840
    Abstract: [Problem] A metal laminated substrate for an oxide superconducting wire is provided at a low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction. [Means for Resolution] A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 ?m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 ?m is laminated to the metal foil.
    Type: Application
    Filed: November 11, 2009
    Publication date: February 16, 2012
    Inventors: Hironao Okayama, Akira Kaneko, Takeshi Kato, Masaya Konishi
  • Publication number: 20110290380
    Abstract: Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150° C. and not higher than 1000° C.
    Type: Application
    Filed: October 20, 2009
    Publication date: December 1, 2011
    Applicant: TOYO KOHAN CO., LTD.
    Inventors: Hironao Okayama, Akira Kaneko, Kouji Nanbu
  • Publication number: 20110290378
    Abstract: Disclosed are a polymer laminated substrate for forming an epitaxial growth film having a highly-crystal-oriented surface and a method of manufacturing the polymer laminated substrate. The method of manufacturing a polymer laminated substrate for forming an epitaxial growth film includes the steps of: activating at least one surface of a polymer sheet T1; activating at least one surface of a metal foil T2 which is made of Cu or a Cu alloy and is formed by cold rolling at a draft of 90% or more; laminating the polymer sheet and the metal foil such that an activated surface of the polymer sheet and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the polymer sheet and the metal foil which are laminated to each other; and biaxially orienting crystals of the metal foil by heat treatment.
    Type: Application
    Filed: October 20, 2009
    Publication date: December 1, 2011
    Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko
  • Publication number: 20110270424
    Abstract: A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection.
    Type: Application
    Filed: August 11, 2009
    Publication date: November 3, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Satoru Nakai, Hirohisa Furuta, Akira Ishihara, Kimiaki Sato, Takashi Tsuboi, Akira Kaneko