Patents by Inventor Akira Okada

Akira Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10224388
    Abstract: A wound wire is wound around a core assembly so that both ends are short-circuited. In a coupling pin insertion state in which a coupling pin is inserted in a through hole of the core assembly, outer-peripheral space parts of respective divided core portions of the core assembly are disposed so as to overlap in plan view. Consequently, an air gap is formed in a part of a side surface of the core assembly. Before formation of a covering member, a main wire is caused to pass through the air gap and is thus disposed in a wiring hole of the core assembly. Then, the covering member for closing the air gap is provided on an outer peripheral surface side of the core assembly including the air gap so that a core structure is obtained.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: March 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Masayoshi Hirao, Kazushige Matsuo
  • Patent number: 10209273
    Abstract: A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: February 19, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Norihiro Takesako, Takaya Noguchi, Akira Okada
  • Patent number: 10192797
    Abstract: A purpose of the present invention is to provide a semiconductor device that can restrain occurrence of partial discharge in evaluation of electric characteristics and can carry out failure analysis from the upper side of a measurement object. A semiconductor device according to the present invention includes: at least one electrode; a protective layer having at least one opening part provided such that a portion of the electrode is exposed at the opening part, and being formed to cover the other portion of the electrode excluding the portion of the electrode exposed at the opening part, the protective layer being insulative; and a conductive layer formed so as to cover the protective layer and the opening part and be directly connected to the electrode at the opening part.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: January 29, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hajime Akiyama, Akira Okada, Kinya Yamashita
  • Patent number: 10168380
    Abstract: A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: January 1, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaya Noguchi, Akira Okada, Koichi Mochizuki
  • Patent number: 10068814
    Abstract: An apparatus for evaluating a semiconductor device includes: a chuck stage for fixing a semiconductor device; an insulating substrate; a plurality of probes fixed to the insulating substrate; a temperature adjustment unit adjusting temperatures of the plurality of probes; an evaluation/control unit causing a current to flow into the semiconductor device through the plurality of probes to evaluate an electric characteristic of the semiconductor device; an inspection plate having a front surface and a rear surface opposite to each other; a thermal image measurement unit acquiring a thermal image of the inspection plate when distal end portions of the plurality of probes are pressed against the front surface; and a thermal image processing unit performing image processing to the thermal image to obtain in-plane positions and temperatures of the distal end portions of the plurality of probes.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: September 4, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Norihiro Takesako, Hajime Akiyama
  • Publication number: 20180231295
    Abstract: An electronic apparatus includes a slot; a first electronic component which is inserted into the slot; a heat pipe coupled to the first electronic component; a first plate coupled to the heat pipe, and has a heat transferring face facing an insertion direction of the slot; a second plate which is provided in the slot, faces the first plate, and has a heat transferring face with which the first plate comes into contact; and a pipe coupled to the second plate, and in which refrigerant circulates.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 16, 2018
    Applicant: FUJITSU LIMITED
    Inventors: YUSUKE AKIYAMA, Akira Okada, Kouichi Kuramitsu, Hideaki MATSUMOTO
  • Publication number: 20180180660
    Abstract: Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.
    Type: Application
    Filed: August 14, 2017
    Publication date: June 28, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira OKADA, Kinya YAMASHITA, Masaki UENO, Takaya NOGUCHI
  • Publication number: 20180180659
    Abstract: Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.
    Type: Application
    Filed: August 15, 2017
    Publication date: June 28, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira OKADA, Takaya NOGUCHI
  • Patent number: 9995786
    Abstract: An apparatus for evaluating a semiconductor device includes: a chuck stage; an insulating substrate; a plurality of probes; a temperature adjustment unit; an evaluation/control unit; and a probe position/temperature inspection device including an inspection plate, a thermo-chromic material, a photographing unit, and an image processing unit. The photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate. The image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: June 12, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Norihiro Takesako, Hajime Akiyama
  • Patent number: 9974184
    Abstract: A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: May 15, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Mitsuaki Hayashi, Osamu Saito, Akira Okada, Junichi Hayama
  • Publication number: 20180088169
    Abstract: A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.
    Type: Application
    Filed: January 23, 2015
    Publication date: March 29, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takaya NOGUCHI, Akira OKADA, Koichi MOCHIZUKI
  • Publication number: 20180088170
    Abstract: An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.
    Type: Application
    Filed: May 8, 2017
    Publication date: March 29, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira OKADA, Kinya YAMASHITA, Masaki UENO
  • Patent number: 9880196
    Abstract: A semiconductor device inspection apparatus includes probe sockets and an insulating plate that holds probes via the probe sockets. The probe sockets each include an opposing part that opposes the insulating plate in the direction in which the probe is pressed and has a pressure passive member disposed in the opposing part. The insulating plate is transparent. When pressing force is applied to the tips of the probes, the pressure passive members are pressed between the opposing parts of the probe sockets and the insulating plate. The semiconductor device inspection apparatus further includes a camera to capture an image of the pressure passive members from the opposite side of the insulating plate to the side on which the pressure passive members are disposed, and an image processor to process the image captured by the camera to detect the presence or absence of pressure received by the pressure passive members.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: January 30, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hajime Akiyama, Akira Okada
  • Publication number: 20170341648
    Abstract: An autonomous driving control apparatus that achieves autonomous driving by controlling a driving operation of a subject vehicle, based on a situation around the subject vehicle is provided. The autonomous driving control apparatus includes: a driving operation determination part that determines a detail of the driving operation of the subject vehicle, based on the situation; a driving operation control part that controls the driving operation in accordance with the detail; and a driving information output part that shifts a footrest portion of a footrest at a seat on a driver seat side of the subject vehicle by driving a driving part provided on the footrest, to output the detail as driving information. The driving information output part varies a frontward inclination angle in accordance with a level of acceleration or deceleration of the subject vehicle, to output the driving information.
    Type: Application
    Filed: December 1, 2015
    Publication date: November 30, 2017
    Inventors: Norio SANMA, Motoki TACHIIRI, Syunsuke SHIBATA, Akira OKADA, Hiroaki TAKEDA, Sei IGUCHI
  • Patent number: 9804197
    Abstract: A probe position inspection apparatus which incorporates a rotatable internal prism is attached to a supporting unit for supporting semiconductor device, thus making it possible to accurately inspect in-plane positions of tips of probes in a short time and also making it possible to adapt the probe position inspection apparatus to a double-sided prober.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: October 31, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Norihiro Takesako, Akira Okada, Takaya Noguchi
  • Publication number: 20170299630
    Abstract: Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.
    Type: Application
    Filed: December 12, 2016
    Publication date: October 19, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira OKADA, Takaya NOGUCHI, Norihiro TAKESAKO
  • Publication number: 20170251554
    Abstract: A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.
    Type: Application
    Filed: November 18, 2016
    Publication date: August 31, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Mitsuaki HAYASHI, Osamu SAITO, Akira Okada, Junichi HAYAMA
  • Patent number: 9720014
    Abstract: A back surface potential lead-out portion has one end portion disposed in a side of a back surface of a semiconductor wafer held by a semiconductor wafer holding portion and the other end portion disposed in a side of a front surface of the semiconductor wafer held by the semiconductor wafer holding portion. The semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are movable in an in-plane direction of the semiconductor wafer. In a case where the semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are moved in the in-plane direction, a portion of the back surface potential lead-out portion located in the in-plane direction from the semiconductor wafer is fixed close to the outside of a movement region of the semiconductor wafer.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: August 1, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Okada, Kosuke Hatozaki, Kinya Yamashita
  • Patent number: 9722060
    Abstract: In a semiconductor device, an element forming region formed with a semiconductor element for controlling a current is defined on a surface of a semiconductor substrate. A termination region is defined so as to surround the element forming region. In a gate electrode, a probe-contacting region and a wire region are defined. The probe-contacting region and the wire region are separated by an insulator formed on a surface of the gate electrode. Thus, the surface of the probe-contacting region and the surface of the wire region are located at the same height.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: August 1, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroyuki Nakamura, Akira Okada, Eiji Nojiri
  • Publication number: 20170205442
    Abstract: A semiconductor device inspection apparatus includes probe sockets and an insulating plate that holds probes via the probe sockets. The probe sockets each include an opposing part that opposes the insulating plate in the direction in which the probe is pressed and has a pressure passive member disposed in the opposing part. The insulating plate is transparent. When pressing force is applied to the tips of the probes, the pressure passive members are pressed between the opposing parts of the probe sockets and the insulating plate. The semiconductor device inspection apparatus further includes a camera to capture an image of the pressure passive members from the opposite side of the insulating plate to the side on which the pressure passive members are disposed, and an image processor to process the image captured by the camera to detect the presence or absence of pressure received by the pressure passive members.
    Type: Application
    Filed: September 19, 2016
    Publication date: July 20, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hajime AKIYAMA, Akira OKADA