Abstract: A mechanism capable of decreasing wires which are not appropriately supplied with power and performing the electrical discharge machining high in uniformity between multiple wires. A wire electrical discharge machining system configured to slice a workpiece at an interval of wires arranged side by side at equally spaced intervals causes the wire to travel in the same direction and includes a power feed contact configured to collectively supply a machining power supply to a plurality of the traveling wires, in which two adjacent power feed contacts respectively come into contact with the plurality of the wires supplied with the machining power supply and arranged without being aligned in the direction vertical to the direction in which the wire travels.

Abstract: A semiconductor testing jig fixes a measurement target while it is held between a chuck stage and the measurement target. The semiconductor testing jig includes a base on which the measurement target is to be installed and which can be attached to the chuck stage. The base includes: a first main surface to become an installation surface for the measurement target; a second main surface opposite the first main surface and which is to contact the chuck stage; and a porous region containing a porous member. The porous region is provided selectively as seen in plan view, and penetrates through the base from the first main surface toward the second main surface.

Abstract: A semiconductor evaluating device includes a chuck stage for holding a semiconductor device serving as a measuring object, a contact probe for evaluating an electrical characteristic of the semiconductor device by getting contact with the semiconductor device held on the chuck stage, and a fluid spraying portion for spraying a fluid onto the semiconductor device.

Abstract: A back surface potential lead-out portion has one end portion disposed in a side of a back surface of a semiconductor wafer held by a semiconductor wafer holding portion and the other end portion disposed in a side of a front surface of the semiconductor wafer held by the semiconductor wafer holding portion. The semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are movable in an in-plane direction of the semiconductor wafer. In a case where the semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are moved in the in-plane direction, a portion of the back surface potential lead-out portion located in the in-plane direction from the semiconductor wafer is fixed close to the outside of a movement region of the semiconductor wafer.

Abstract: A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

Abstract: A connector includes: a press-fit pin wherein the press-fit pin includes a conductive press-fit portion configured to be press-fitted into a through hole formed in a substrate, and a non-conductive guide pin portion extending from a front end portion of the press-fit portion, the guide pin portion being configured to be inserted into the through hole.

Abstract: A wound wire is wound around a core assembly so that both ends are short-circuited. In a coupling pin insertion state in which a coupling pin is inserted in a through hole of the core assembly, outer-peripheral space parts of respective divided core portions of the core assembly are disposed so as to overlap in plan view. Consequently, an air gap is formed in a part of a side surface of the core assembly. Before formation of a covering member, a main wire is caused to pass through the air gap and is thus disposed in a wiring hole of the core assembly. Then, the covering member for closing the air gap is provided on an outer peripheral surface side of the core assembly including the air gap so that a core structure is obtained.

Abstract: A semiconductor testing jig is provided with a conductive stage including a plurality of mounting portions on which a plurality of vertical semiconductor devices are each individually disposed with lower surface electrodes being in contact with the plurality of mounting portions, an insulating frame portion having a lattice pattern that is disposed on the stage and surrounds each of the plurality of mounting portions in plan view to define each of the mounting portions, and an abrasive layer disposed in a position in the frame portion, the position facing each of the vertical semiconductor devices disposed on the mounting portions.

Abstract: A torque sensor includes: a base portion fixed to a metal shaft having a rod shape as a measurement object of strain; a strain detection element of an surface acoustic wave type which is arranged in the base portion, and detects the strain of the metal shaft (10) through the base portion; and a fixing portion that is arranged between the base portion and the strain detection element, and fixes the strain detection element to the base portion.

Abstract: A measuring apparatus includes a stage on which an object to be measured is placed, an insulating base plate, a probe fixed on the insulating base plate, a measuring unit which measures an electrical characteristic of the object to be measured through the probe, a side wall part having such a shape as to surround the probe and smaller in width than the stage, and a supply tube through which an insulating liquid is supplied, wherein when an electrical characteristic of the object to be measured is measured, the stage, the side wall part and the insulating base plate form a measurement region surrounding the object to be measured, and the insulating liquid is applied from the supply tube to the object to be measured in the measurement region.

Abstract: A measuring apparatus includes a measuring unit for measuring an electrical characteristic of a measurement object by applying an electrical signal, and a discharge detection unit connected to the measuring unit, the discharge detection unit obtaining an electrical signal value that is the value of the electrical signal applied to the measurement object, wherein if the electrical signal value is smaller than a predetermined reference value, the discharge detection unit issues a discharge alarm to the outside when a difference value between the electrical signal value and the reference value becomes larger than a predetermined first comparison value after the difference value becomes smaller than the first comparison value, and wherein the reference value is set equal to or larger than the maximum of the electrical signal value when no electric discharge occurs.

Abstract: An inspection apparatus includes an insulating substrate, a socket in which a body portion having a through-hole in a wall thereof is integrally formed with a connection portion secured to the insulating substrate, and a contact probe detachably secured to the socket.

Abstract: A measurement device includes a stage for carrying an object to be measured, an insulating board having a through hole, a probe fixed on the undersurface of the insulating board, a side wall section in a shape surrounding the probe, a pressurizing section provided on the top surface of the insulating board, the pressuring section supplying a gas below the insulating board via the through hole, and a measurement section electrically connected to the probe to control the pressurizing section, wherein the measurement section measures an electric property of the object to be measured via the probe in a state where the pressurizing section is controlled to supply a gas to a measurement space located below the insulating board to increase a pressure in the measurement space, the measurement space surrounded by the stage, the side wall section, and the insulating board.

Abstract: An inspection apparatus includes a probe substrate, a socket secured to the probe substrate, a heating element wire wound around the socket, a probe tip detachably connected to the socket, a stage on which an object to be measured is mounted, and a heating unit for heating the stage.

Abstract: It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe.

Abstract: A semiconductor device comprises: a semiconductor element including an electrode; a leading line electrically connected to the electrode, passing above the electrode, and led to a side thereof; and a current sensor sensing current flowing through the leading line. The current sensor includes a magneto-resistance element placed above the electrode and below the leading line. A resistance value of the magneto-resistance element varies linearly according to magnetic field generated by the current.

Abstract: A semiconductor cleaning device includes an external electrode opposed to a side surface of the semiconductor device; a base configured to allow arrangement of the semiconductor device, and having an opening positioned between the side surface of the semiconductor device in the arranged state and the external electrode, and located below the side surface of the semiconductor device; a frame having an electrically insulating property, being in contact with the external electrode, arranged on the base and opposed to the side surface of the semiconductor device; and suction means connected to the opening in the base and being capable of taking in the foreign matter through the opening. Thereby, the semiconductor cleaning device and a semiconductor cleaning method that can remove the foreign matter adhered to the side surface of the semiconductor device and can prevent re-adhesion of the removed foreign matter can be obtained.

Abstract: A semiconductor wafer is subjected to a protection film formation step process as a process before evaluation of electrical characteristics. In this process, after an insulating film serving as a protection film is formed, a photolithography process and an etching process are performed so as to form a protection film having a plurality of openings exposing an emitter electrode. Then, electrical characteristics are evaluated by bringing a contact probe in contact with the exposed emitter electrode through each opening.

Abstract: Disclosed is a beverage extraction filter that can extract in a plurality of extraction machine types. The beverage extraction filter comprises a filter unit (40) where coffee powder is housed and a planar lid unit (41) mounted to the top section of the filter unit (40). The lid unit (41) is formed in a layer structure created by a non-permeable first sheet member (42) positioned on the filter unit side (40) and a permeable second sheet member (43) layered on top of the first sheet member (42), and a hole section (42a) through which hot water is made to pass is formed in the center of the first sheet member (42).

Abstract: A semiconductor evaluation apparatus includes a jig for evaluation and a probe substrate. The jig for evaluation is provided such that a plurality of semiconductor devices can be placed thereon. The probe substrate is provided so as to face the jig for evaluation, and includes a contact probe. The jig for evaluation includes a plurality of housing portions divided by a frame portion such that the plurality of semiconductor devices can be separately placed on the plurality of housing portions, respectively. The semiconductor evaluation apparatus is configured such that the contact probe can be brought into contact with a plurality of elements in the state where a space is provided by bringing the frame portion and the probe substrate in proximity to each other. In this space, each of the plurality of semiconductor devices is placed between a corresponding one of the plurality of housing portions and the probe substrate.