Patents by Inventor Allen L. D'Ambra
Allen L. D'Ambra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190148160Abstract: Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments herein provide a flow splitter manifold configured to enable monitoring of the pressure of the polishing fluid disposed therein. Monitoring the fluid pressure in the flow splitter manifold enables the detection of clogs in the delivery lines and/or dispense nozzles that inhibit and/or prevent the flow of polishing fluid therethrough or therefrom.Type: ApplicationFiled: October 29, 2018Publication date: May 16, 2019Inventors: Roy C. NANGOY, Chad POLLARD, Allen L. D'AMBRA
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Publication number: 20190070639Abstract: Disclosed herein is an apparatus for cleaning a process kit comprising a body, a cleaning source, and a control system. The body is formed from multiple modules configured to couple to, and receive therein, a process kit part. A plurality of cleaning agents may be sequentially delivered to the body in order to remove the particles disposed on the process part.Type: ApplicationFiled: October 16, 2017Publication date: March 7, 2019Inventors: Roy C. NANGOY, Allen L. D'AMBRA, Kevin A. PAPKE
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Publication number: 20180061696Abstract: The present invention generally relates method and apparatus for detecting erosion to a ring assembly used in an etching or other plasma processing chamber. In one embodiment, a method begins by obtaining a metric indicative of wear on a ring assembly disposed on a substrate support in a plasma processing chamber prior to processing with plasma in the plasma processing chamber. The metric for the ring assembly is monitored with a sensor. A determination is made if the metric exceeds a threshold and generating a signal in response to the metric exceeding the threshold.Type: ApplicationFiled: August 16, 2017Publication date: March 1, 2018Inventors: Allen L. D'AMBRA, Sheshraj L. TULSHIBAGWALE
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Patent number: 9646859Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: GrantFiled: April 30, 2010Date of Patent: May 9, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Publication number: 20160101497Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.Type: ApplicationFiled: December 17, 2015Publication date: April 14, 2016Applicant: Applied Materials, Inc.Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian, Dominic J. Benvegnu, Harry Q. Lee, Allen L. D'Ambra, Jagan Rangarajan
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Patent number: 9227293Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.Type: GrantFiled: March 8, 2013Date of Patent: January 5, 2016Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian, Dominic J. Benvegnu, Harry Q. Lee, Allen L. D'Ambra, Jagan Rangarajan
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Patent number: 8968055Abstract: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.Type: GrantFiled: April 28, 2012Date of Patent: March 3, 2015Assignee: Applied Materials, Inc.Inventors: Hui Chen, Allen L. D'Ambra, Jim Atkinson, Hung Chen
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Publication number: 20150050105Abstract: Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.Type: ApplicationFiled: July 25, 2012Publication date: February 19, 2015Applicant: APPLIED MATERIALS, INC.Inventors: Dan Zhang, Hui Chen, Jim K. Atkinson, Hung Chih Chen, Allen L. D'Ambra
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Patent number: 8869422Abstract: The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.Type: GrantFiled: April 27, 2012Date of Patent: October 28, 2014Assignee: Applied Materials, Inc.Inventors: Edwin Velazquez, Allen L. D'Ambra, Jim K. Atkinson
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Patent number: 8844546Abstract: Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.Type: GrantFiled: October 1, 2008Date of Patent: September 30, 2014Assignee: Applied Materials, Inc.Inventors: Hui (Fred) Chen, Allen L. D'Ambra
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Publication number: 20140141695Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.Type: ApplicationFiled: March 8, 2013Publication date: May 22, 2014Applicant: Applied Materials, Inc.Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian, Dominic J. Benvegnu, Harry Q. Lee, Allen L. D'Ambra, Jagan Rangarajan
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Publication number: 20140141696Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.Type: ApplicationFiled: March 8, 2013Publication date: May 22, 2014Applicant: Applied Materials, Inc.Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian, Dominic J. Benvegnu, Harry Q. Lee, Allen L. D Ambra, Jagan Rangarajan
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Publication number: 20130288578Abstract: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.Type: ApplicationFiled: April 28, 2012Publication date: October 31, 2013Applicant: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Jim K. Atkinson, Hung Chen
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Publication number: 20130283634Abstract: The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.Type: ApplicationFiled: April 27, 2012Publication date: October 31, 2013Applicant: APPLIED MATERIALS, INC.Inventors: Edwin Velazquez, Allen L. D'Ambra, Jim K. Atkinson
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Publication number: 20130111678Abstract: Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.Type: ApplicationFiled: November 8, 2011Publication date: May 9, 2013Applicant: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Lakshmanan Karuppiah, Thomas H. Osterheld
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Patent number: 8308529Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.Type: GrantFiled: April 21, 2009Date of Patent: November 13, 2012Assignee: Applied Materials, Inc.Inventors: Allen L. D'Ambra, Alpay Yilmaz
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Publication number: 20120208438Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.Type: ApplicationFiled: April 19, 2012Publication date: August 16, 2012Applicant: Applied Materials, Inc.Inventors: ALPAY YILMAZ, Allen L. D'Ambra, Jagan Rangarajan, Lakshmanan Karuppiah
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Patent number: 8172643Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.Type: GrantFiled: April 9, 2009Date of Patent: May 8, 2012Assignee: Applied Materials, Inc.Inventors: Alpay Yilmaz, Allen L. D'Ambra, Jagan Rangarajan, Lakshmanan Karuppiah
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Publication number: 20110265816Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Patent number: 7988535Abstract: The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.Type: GrantFiled: April 18, 2008Date of Patent: August 2, 2011Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Allen L. D'Ambra, Donald J. K. Olgado