Patents by Inventor Allen L. D'Ambra
Allen L. D'Ambra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7962990Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.Type: GrantFiled: October 1, 2008Date of Patent: June 21, 2011Assignee: Applied Materials, Inc.Inventors: Hui (Fred) Chen, Joseph Yudovsky, Allen L. D'Ambra
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Publication number: 20100078041Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.Type: ApplicationFiled: October 1, 2008Publication date: April 1, 2010Inventors: Hui (Fred) Chen, Joseph Yudovsky, Allen L. D'Ambra
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Publication number: 20100078044Abstract: Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.Type: ApplicationFiled: October 1, 2008Publication date: April 1, 2010Inventors: Hui (Fred) Chen, Allen L. D'Ambra
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Publication number: 20090320875Abstract: Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.Type: ApplicationFiled: June 23, 2009Publication date: December 31, 2009Applicant: APPLIED MATERIALS, INC.Inventors: RICARDO MARTINEZ, Allen L. D'Ambra, Adrian Blank, Thuy Britcher, Hui Chen
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Publication number: 20090305610Abstract: A method and apparatus for detecting and obtaining a metric indicative of a polishing process is described. The apparatus includes a polishing pad having an optically transparent region adapted to obtain polishing metric from at least one substrate from at least two distinct radial positions of the polishing pad. The method includes obtaining a polishing metric from at least two substrates being polished simultaneously on a single polishing pad.Type: ApplicationFiled: June 5, 2009Publication date: December 10, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Alpay Yilmaz, Allen L. D'Ambra, Hung Chih Chen, Boguslaw A. Swedek
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Publication number: 20090280727Abstract: Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads.Type: ApplicationFiled: May 9, 2008Publication date: November 12, 2009Inventors: LAKSHMANAN KARUPPIAH, Tetsuya Ishikawa, Donald J.K. Olgado, Allen L. D'Ambra, Hung Chih Chen
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Publication number: 20090270015Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.Type: ApplicationFiled: April 21, 2009Publication date: October 29, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Allen L. D'Ambra, Alpay Yilmaz
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Publication number: 20090264049Abstract: The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.Type: ApplicationFiled: April 18, 2008Publication date: October 22, 2009Inventors: Hung Chih Chen, Allen L. D'Ambra, Donald J.K. Olgado
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Publication number: 20090258574Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.Type: ApplicationFiled: April 9, 2009Publication date: October 15, 2009Applicant: APPLIED MATERIALS, INCInventors: Alpay Yilmaz, Allen L. D'Ambra, Jagan Rangarajan, Lakshmanan Karuppiah
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Patent number: 7473339Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.Type: GrantFiled: April 16, 2004Date of Patent: January 6, 2009Assignee: Applied Materials, Inc.Inventors: Allen L. D'Ambra, Arulkumar Shanmugasundram, Michael X. Yang, Yevgeniy (Eugene) Rabinovich, Dmitry Lubomirsky
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Publication number: 20080156359Abstract: Embodiments of the invention generally relate to a modular, configurable system in which distinct cleaning and drying modules can be arranged in different combinations selectable by a user of the system. In one embodiment a configurable system for substrate cleaning is provided. The configurable system provides a frame including first and second bays, the first and second bays each adapted to hold one or more cleaning or drying modules, and a transfer area positioned between the first and second bays including a robot adapted to move substrates to and from the one or more modules positioned within the first and second bays, wherein the frame is adapted to hold a user selectable set of one or more cleaning or drying modules in the first and second bays.Type: ApplicationFiled: December 21, 2007Publication date: July 3, 2008Inventors: DONALD J.K. OLGADO, Ho Seon Shin, Sheshraj L. Tulshibagwale, Roy C. Nangoy, Hui Chen, Allen L. D'Ambra
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Patent number: 7223323Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.Type: GrantFiled: July 8, 2003Date of Patent: May 29, 2007Assignee: Applied Materials, Inc.Inventors: Michael X. Yang, Ming Xi, Russell C. Ellwanger, Eric B. Britcher, Bernardo Donoso, Lily L. Pang, Svetlana Sherman, Henry Ho, Anh N. Nguyen, Alexander N. Lerner, Allen L. D'Ambra, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T. Nguyen
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Patent number: 7155319Abstract: A method for controlling liquid delivery in a processing chamber. The method includes generating an analog input (AI) signal proportional to a process variable and calculating an analog output (AO) signal based on a setpoint and a deadband. The setpoint is a target value of the process variable and the deadband is an allowable tolerance around the setpoint that determines when the control logic is activated to control the process variable. The method further includes transmitting the AO signal to a control device and adjusting the process variable proportional to the value of the AO signal.Type: GrantFiled: February 23, 2005Date of Patent: December 26, 2006Assignee: Applied Materials, Inc.Inventors: Roy C. Nangoy, Allen L. D'Ambra, Yevgeniy Rabinovich, David Z. Chen, Tao Li
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Patent number: 7005046Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.Type: GrantFiled: August 13, 2002Date of Patent: February 28, 2006Assignee: Applied Materials Inc.Inventors: Joseph J. Stevens, Yevgeniy Rabinovich, Sandy S. Chao, Mark R. Denome, Allen L. D'Ambra, Donald J. Olgado
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Patent number: 6869516Abstract: A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.Type: GrantFiled: October 18, 2002Date of Patent: March 22, 2005Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Michael X. Yang, Girish A. Dixit, Vincent E. Burkhart, Allen L. D'Ambra, Yeuk-Fai Edwin Mok, Harald Herchen
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Publication number: 20040206623Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.Type: ApplicationFiled: April 16, 2004Publication date: October 21, 2004Applicant: Applied Materials, Inc.Inventors: Allen L. D'Ambra, Arulkumar Shanmugasundram, Michael X. Yang, Yevgeniy (Eugene) Rabinovich, Dmitry Lubomirsky
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Publication number: 20040074777Abstract: A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.Type: ApplicationFiled: October 18, 2002Publication date: April 22, 2004Applicant: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Michael X. Yang, Girish A. Dixit, Vincent E. Burkhart, Allen L. D'Ambra, Yeuk-Fai Edwin Mok, Harald Herchen
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Publication number: 20040016637Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.Type: ApplicationFiled: July 8, 2003Publication date: January 29, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Michael X. Yang, Ming Xi, Russell C. Ellwanger, Eric B. Britcher, Bernardo Donoso, Lily L. Pang, Svetlana Sherman, Henry Ho, Anh N. Nguyen, Alexander N. Lerner, Allen L. D'Ambra, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T. Nguyen
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Publication number: 20030000841Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.Type: ApplicationFiled: August 13, 2002Publication date: January 2, 2003Applicant: Applied Materials, Inc.Inventors: Joseph J. Stevens, Yevgeniy Rabinovich, Sandy S. Chao, Mark R. Denome, Allen L. D'Ambra, Donald J. Olgado
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Patent number: 6454927Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.Type: GrantFiled: June 26, 2000Date of Patent: September 24, 2002Assignee: Applied Materials, Inc.Inventors: Joseph J. Stevens, Yevgeniy Rabinovich, Sandy S. Chao, Mark R. Denome, Allen L. D'Ambra, Donald J. Olgado