Patents by Inventor Amit Kumar Srivastava

Amit Kumar Srivastava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927537
    Abstract: The present invention relates to a cost effective and single step process for rapid manufacturing of paper-based SERS substrates (100), wherein chitosan is used for direct in situ reduction of the metallic precursor solutions for production of metallic nanoparticles on the substrates. The crucial step in the process involves the incubation of the paper-based substrates under humidifying conditions at an elevated temperature for a predetermined duration. The metal nanoparticles thus produced are homogenously deposited over the paper-based substrate making the paper-based substrate suitable for SERS analysis. The paper-based substrate thus developed is cost-effective, flexible, easy to load and is demonstrated to have exceptional sensitivity with detection limits of up to 1 pM.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: March 12, 2024
    Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
    Inventors: Amit Asthana, Mohan Rao Chintalagiri, Saurabh Kumar Srivastava, Gopi Suresh Oggu
  • Patent number: 11921652
    Abstract: In one embodiment, a host controller includes: a first input/output (I/O) buffer to couple to a first communication line of an interconnect; a second I/O buffer to couple to a second communication line of the interconnect; and a device group selection circuit to dynamically cause the first communication line to communicate a clock signal to a first device group including one or more first devices to couple to the interconnect and dynamically cause the second communication line to communicate a data signal to the first device group when a communication is to be addressed to at least one of the one or more first devices of the first device group, such that the communication is transparent to at least another device group to couple to the interconnect. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: March 5, 2024
    Assignee: Intel Corporation
    Inventors: Kenneth P. Foust, Amit Kumar Srivastava, George Vergis
  • Patent number: 11704274
    Abstract: In one embodiment, an apparatus includes a host controller to couple to an interconnect to which a plurality of devices may be coupled. The host controller may include: a first driver to drive first information onto a first line of the interconnect; a second driver to drive a clock signal onto a second line of the interconnect; and a mode control circuit to cause the second driver to drive the clock signal onto the second line of the interconnect in a first mode and to cause the first driver and the second driver to drive differential information onto the first line and the second line of the interconnect in a second mode. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Patent number: 11567895
    Abstract: In an embodiment, a host controller includes a clock control circuit to cause the host controller to communicate a clock signal on a clock line of an interconnect, the clock control circuit to receive an indication that a first device is to send information to the host controller and to dynamically release control of the clock line of the interconnect to enable the first device to drive a second clock signal onto the clock line of the interconnect for communication with the information. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Kenneth P. Foust, Amit Kumar Srivastava, Nobuyuki Suzuki
  • Patent number: 11506702
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Publication number: 20220300608
    Abstract: Hardware based unsupervised based machine-learning (ML) approach to identify a security threat to the processor (e.g., caused by probing of a power supply rail). An apparatus is provided which includes an on-die power supply droop detector as a feature extractor. The droop detector detects a droop in the power supply caused by a probe physically coupling to the power supply rail. The droop detector in combination with machine-learning logic detects change in power supply rail impedance profile due to a probe coupled to the power supply rail. A deep-neural network (DNN) is provided for feature classification that classifies a security threat from normal operation and from operations caused by aging of devices in the processor. The DNN is trained in a training phase or production phase of the processor. An aging sensor is used to distinguish classification of aged data vs. normal data and data from security attack.
    Type: Application
    Filed: March 16, 2021
    Publication date: September 22, 2022
    Applicant: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Publication number: 20220302918
    Abstract: A digital phase spacing detector with programmable delay lines is described. Each programmable delay line receives a clock. The output of the programmable delay lines is compared by a logic and then passed through a glitch detector. Each of the clocks pass through the programmable delay lines that are tuned to a point where the clock edges at the output of the delay lines are aligned and glitches start appearing at the output of the logic. A calibration scheme uses replica cells (replica of VCO cells) in the measurement path. The calibration scheme calculates the average of clock phase differences through a digital control replica buffer, and this average clock phase difference is applied to the VCO delay stage cells. The PLL is then allowed to relock with the calibrated VCO delay stage cells. This process can be repeated several times to reduce the phase errors between the clock phases.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Applicant: Intel Corporation
    Inventors: Amit Kumar Srivastava, Noam Familia
  • Patent number: 11425101
    Abstract: In one embodiment, an apparatus includes: a first controller to couple to an interconnect to which a plurality of devices may be coupled, the first controller to communicate first information via the interconnect according to the native communication protocol; a first transceiver to drive the first information onto a first line of the interconnect; a second transceiver to drive a clock signal onto a second line of the interconnect; and a second controller to communicate second information via the interconnect. In an embodiment, the native communication protocol is a single-ended communication protocol and the second controller is to communicate the second information differentially via the interconnect. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Publication number: 20220214981
    Abstract: In one embodiment, a host controller includes: a first input/output (I/O) buffer to couple to a first communication line of an interconnect; a second I/O buffer to couple to a second communication line of the interconnect; and a device group selection circuit to dynamically cause the first communication line to communicate a clock signal to a first device group including one or more first devices to couple to the interconnect and dynamically cause the second communication line to communicate a data signal to the first device group when a communication is to be addressed to at least one of the one or more first devices of the first device group, such that the communication is transparent to at least another device group to couple to the interconnect. Other embodiments are described and claimed.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 7, 2022
    Inventors: Kenneth P. Foust, Amit Kumar Srivastava, George Vergis
  • Patent number: 11334511
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Patent number: 11314668
    Abstract: In one embodiment, a host controller includes: a first input/output (I/O) buffer to couple to a first communication line of an interconnect; a second I/O buffer to couple to a second communication line of the interconnect; and a device group selection circuit to dynamically cause the first communication line to communicate a clock signal to a first device group including one or more first devices to couple to the interconnect and dynamically cause the second communication line to communicate a data signal to the first device group when a communication is to be addressed to at least one of the one or more first devices of the first device group, such that the communication is transparent to at least another device group to couple to the interconnect. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: April 26, 2022
    Assignee: Intel Corporation
    Inventors: Kenneth P. Foust, Amit Kumar Srivastava, George Vergis
  • Patent number: 11301406
    Abstract: In an embodiment, a host device includes: a transceiver to communicate information on an interconnect; a controller to control operation of the transceiver and to be a master for the interconnect; and a role transfer logic to cause a secondary device to be the master for the interconnect when at least a portion of the host device is to enter into a low power. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: April 12, 2022
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Duane G. Quiet, Kenneth P. Foust
  • Patent number: 11294846
    Abstract: In one embodiment, an apparatus includes: a processing circuit to execute instructions; and a host controller coupled to the processing circuit to perform a key exchange with a second device to couple to the apparatus via a bus to which a plurality of devices may be coupled, and in response to a successful completion of the key exchange, enable secure communication with the second device. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Kenneth P. Foust
  • Publication number: 20220070522
    Abstract: Embodiments relate to a controller subsystem that includes a virtual reality (VR) subsystem to: identify data received from a peripheral device as related to an audio/visual (A/V) function of the peripheral device; direct, based on the identification that the data is related to the A/V function of the peripheral device, the data to be stored in a memory subsystem of the controller subsystem; and facilitate transmission of an indication of a storage location of the data in the memory subsystem to a host system that is communicatively coupled with the controller subsystem. The controller subsystem further includes a graphics engine to: identify, in a message received from the host system based on the transmission of the indication of the storage location of the data, instructions related to rendering the data; and generate, based on the data received from the peripheral device, rendered data. Other embodiments may be described and claimed.
    Type: Application
    Filed: November 10, 2021
    Publication date: March 3, 2022
    Inventors: Lakshminarayana Pappu, Nausheen Ansari, Howard Heck, Amit Kumar Srivastava
  • Patent number: 11243585
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: February 8, 2022
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Patent number: 11231927
    Abstract: In one embodiment, an apparatus includes: an accelerator to execute instructions; an accelerator request decoder coupled to the accelerator to perform a first level decode of requests from the accelerator and direct the requests based on the first level decode, the accelerator request decoder including a memory map to identify a first address range associated with a local memory and a second address range associated with a system memory; and a non-coherent request router coupled to the accelerator request decoder to receive non-coherent requests from the accelerator request decoder and perform a second level decode of the non-coherent requests, the non-coherent request router to route first non-coherent requests to a sideband router of the first die and to direct second non-coherent requests to a computing die. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert D. Adler, Amit Kumar Srivastava, Aravindh Anantaraman
  • Patent number: 11232060
    Abstract: In one embodiment, an apparatus includes an input/output (I/O) circuit to communicate information at a selected voltage via an interconnect to which a plurality of devices may be coupled, and a host controller to couple to the interconnect. The host controller may include a supply voltage policy control circuit to initiate a supply voltage policy exchange with a first device to obtain a first supply voltage capability of the first device and to cause the I/O circuit and the first device to be configured to communicate via the interconnect at a first supply voltage based on the first supply voltage capability. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Kenneth P. Foust
  • Patent number: 11226912
    Abstract: Embodiments of the present disclosure may relate to a host controller that includes processing circuitry to identify an inter-integrated circuit (I2C) out-of-band interrupt (OBI) received on a general purpose input-output (GPIO) pin from an I2C device that is unable to generate an improved inter-integrated circuit (I3C) bus an I3C in-band interrupt (IBI). The processing circuitry may further generate, based on the I2C OBI, an I3C IBI that includes information related to the I2C OBI. The host controller may further include transmission circuitry to transmit the I3C IBI on an I3C bus. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: January 18, 2022
    Assignee: Intel Corporation
    Inventors: Kenneth P. Foust, Duane G. Quiet, Amit Kumar Srivastava
  • Publication number: 20220004516
    Abstract: In one embodiment, an apparatus includes a host controller to couple to an interconnect to which a plurality of devices may be coupled. The host controller may include: a first driver to drive first information onto a first line of the interconnect; a second driver to drive a clock signal onto a second line of the interconnect; and a mode control circuit to cause the second driver to drive the clock signal onto the second line of the interconnect in a first mode and to cause the first driver and the second driver to drive differential information onto the first line and the second line of the interconnect in a second mode. Other embodiments are described and claimed.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventor: Amit Kumar Srivastava
  • Publication number: 20210318981
    Abstract: An apparatus may include a controller for a system management bus. The controller may be to: detect a trigger event associated with the system management bus; in response to a detection of the trigger event, transmit a broadcast address on the system management bus, where the broadcast address is not used in a first communication protocol; and in response to a determination that the transmitted broadcast address was acknowledged, use a second communication protocol for transmissions on the system management bus. Other embodiments are described and claimed.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Janusz Jurski, Amit Kumar Srivastava, Matthew A. Schnoor, Myron Loewen, Tim McKee