Patents by Inventor Amit Kumar Srivastava

Amit Kumar Srivastava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200409881
    Abstract: Embodiments of the present disclosure may relate to a host controller that includes processing circuitry to identify an inter-integrated circuit (I2C) out-of-band interrupt (OBI) received on a general purpose input-output (GPIO) pin from an I2C device that is unable to generate an improved inter-integrated circuit (I3C) bus an I3C in-band interrupt (IBI). The processing circuitry may further generate, based on the I2C OBI, an I3C IBI that includes information related to the I2C OBI. The host controller may further include transmission circuitry to transmit the I3C IBI on an I3C bus. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 31, 2020
    Inventors: Kenneth P. Foust, Duane G. Quiet, Amit Kumar Srivastava
  • Publication number: 20200379528
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Application
    Filed: February 20, 2020
    Publication date: December 3, 2020
    Applicant: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Publication number: 20200379530
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Application
    Filed: July 30, 2020
    Publication date: December 3, 2020
    Applicant: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Patent number: 10853289
    Abstract: In one embodiment, a host controller includes: a first credit tracker comprising at least one credit counter to maintain credit information for a first device; and a first credit handler to send a command code having a first predetermined value to indicate a credit request to request credit information from the first device, where the first credit tracker is to update the at least one credit counter based on receipt of an in-band interrupt from the first device having the credit information. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 1, 2020
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Asad Azam, Rajesh Bhaskar, Mikal Hunsaker, Enrico D. Carrieri
  • Patent number: 10817454
    Abstract: An apparatus includes physical layer circuitry with lanes to couple the apparatus to endpoint devices. a first input/output (I/O) controller to couple a first processor to the physical layer circuitry, and a second I/O controller to couple a second processor to the physical layer circuitry. The first and second I/O controllers are compatible with a Peripheral Component Interconnect Express (PCIe)-based protocol. The apparatus also includes a flexible input/output adapter (FIA) coupling the first and second I/O controllers to the lanes. The FIA selectively assigns access to each lane of the lanes by either the first or second I/O controller. The apparatus also includes a power management controller (PMC) communicably coupled to the FIA. The PMC causes the FIA to dynamically assign access to at least one of the lanes by the first or second I/O controller without a reboot cycle.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: October 27, 2020
    Assignee: Intel Corporation
    Inventors: Chih-Cheh Chen, Janusz P. Jurski, Amit Kumar Srivastava, Malay Trivedi, James Mitchell, Piotr Michael Kwidzinski, David N. Lombard
  • Patent number: 10769084
    Abstract: Embodiments of the present disclosure may relate to a host controller that includes processing circuitry to identify an inter-integrated circuit (I2C) out-of-band interrupt (OBI) received on a general purpose input-output (GPIO) pin from an I2C device that is unable to generate an improved inter-integrated circuit (I3C) bus an I3C in-band interrupt (IBI). The processing circuitry may further generate, based on the I2C OBI, an I3C IBI that includes information related to the I2C OBI. The host controller may further include transmission circuitry to transmit the I3C IBI on an I3C bus. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: September 8, 2020
    Assignee: Intel Corporation
    Inventors: Kenneth P. Foust, Duane G. Quiet, Amit Kumar Srivastava
  • Patent number: 10745023
    Abstract: A voltage monitoring framework is proposed to predict, report, and correct actions for performance impacting voltage droop due to power supplies in a system-on-a-chip. Both the amplitude and duration of the voltage droop are monitored. By predicting serious voltage droops early, power supplies cross check against each other to avoid catastrophic error, thus ensuring that integrated circuits making up the system-on-a-chip will maintain functional reliability.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 18, 2020
    Assignee: INTEL CORPORATION
    Inventors: Amit Kumar Srivastava, Asad Azam, Jagannadha Rapeta
  • Publication number: 20200257601
    Abstract: Techniques and mechanisms for exchanging debug information with a repeater and multiplex logic of a platform. In an embodiment, the multiplex logic can be configured to any of multiple modes including a first mode to exchange debug information between the repeater and debug client logic of the platform. Another of the multiple modes may provide an alternate communication path for exchanging functional data, other than any debug information, between the repeater and a physical layer interface of the platform. In another embodiment, the repeater is compatible with a repeater architecture identified by a universal serial bus standard. The physical layer interface is compatible with an interface specification identified by the same universal bus standard.
    Type: Application
    Filed: October 13, 2016
    Publication date: August 13, 2020
    Inventors: Amit Kumar SRIVASTAVA, Huimin CHEN
  • Patent number: 10739836
    Abstract: In one embodiment, an apparatus includes: at least one processing circuit; at least one array associated with the at least one processing circuit; a power controller to manage power consumption of the apparatus; and a fabric bridge coupled to the power controller. The fabric bridge and power controller may be configured to implement a handshaking protocol to enable the fabric bridge to receive data from the at least one array via a sideband communication path and send the data to a system memory coupled to the apparatus via a primary communication path, prior to entry of the apparatus into a first low power state. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 11, 2020
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert Milstrey, Amit Kumar Srivastava
  • Publication number: 20200249276
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for in-field safety tests on system-level and circuit-level, providing real-time and on-chip tests with respect to, including but not limited to, circuit reliability, power consumption, and system safety. The in-field safety tests may include implementing voltage droop monitors (VDMs) and signature collectors with authentication-enabled launching. Other embodiments may be described and claimed.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 6, 2020
    Inventors: Lakshminarayana Pappu, Amit Kumar Srivastava, Robert Milstrey
  • Publication number: 20200244269
    Abstract: An apparatus is provided which comprises: a first ring oscillator comprising at least one aging tolerant circuitry; a second ring oscillator comprising a non-aging tolerant circuitry; a first counter coupled to the first ring oscillator, wherein the first counter is to count a frequency of the first ring oscillator; a second counter coupled to the second ring oscillator, wherein the second counter is to count a frequency of the second ring oscillator; and logic to compare the frequencies of the first and second ring oscillators, and to generate one or more controls to mitigate aging of one or more devices.
    Type: Application
    Filed: February 3, 2020
    Publication date: July 30, 2020
    Applicant: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Patent number: 10705594
    Abstract: A Universal Serial Bus 2.0 (USB2 or eUSB2) device includes an integrated circuit (IC) having a physical layer to send and receive data on a pair of signal lines, a repeater communicatively coupled to the physical layer via the pair of signal lines, and having a port to send and receive data on a second pair of signal lines and a power management unit to provide power to the physical layer and the repeater during an active state and to gate power to the physical layer and the repeater during a low power state.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: July 7, 2020
    Assignee: INTEL CORPROATION
    Inventor: Amit Kumar Srivastava
  • Patent number: 10664027
    Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 26, 2020
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Rao Jagannadha Rapeta, Asad Azam
  • Patent number: 10615893
    Abstract: An apparatus is provided, where the apparatus includes a transmitter comprising a first stage and a second stage, wherein the first stage is to receive an input voltage and generate bias for the second stage, and wherein the second stage comprises a driver circuitry to transmit data using the bias voltage; and a control circuitry to control generation of the bias, based on receiving a feedback of the input voltage.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: April 7, 2020
    Assignee: Intel Corporation
    Inventors: Chenchu Punnarao Bandi, Amit Kumar Srivastava, Michael W. Altmann
  • Publication number: 20200106535
    Abstract: An apparatus is provided, where the apparatus includes a transmitter comprising a first stage and a second stage, wherein the first stage is to receive an input voltage and generate bias for the second stage, and wherein the second stage comprises a driver circuitry to transmit data using the bias voltage; and a control circuitry to control generation of the bias, based on receiving a feedback of the input voltage.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Applicant: Intel Corporation
    Inventors: Chenchu Punnarao BANDI, Amit Kumar SRIVASTAVA, Michael W. ALTMANN
  • Patent number: 10572437
    Abstract: An apparatus is provided which comprises: a data circuitry to send and receive data to and from one or more devices coupled to the data circuitry via a first transmission line; and a first adjustable clock buffer coupled to the data circuitry, wherein the first adjustable clock buffer is to adjust a delay to an edge of a read clock according to a response time of the one or more devices.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Publication number: 20200050571
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Patent number: 10554209
    Abstract: An apparatus is provided which comprises: a first ring oscillator comprising at least one aging tolerant circuitry; a second ring oscillator comprising a non-aging tolerant circuitry; a first counter coupled to the first ring oscillator, wherein the first counter is to count a frequency of the first ring oscillator; a second counter coupled to the second ring oscillator, wherein the second counter is to count a frequency of the second ring oscillator; and logic to compare the frequencies of the first and second ring oscillators, and to generate one or more controls to mitigate aging of one or more devices.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventor: Amit Kumar Srivastava
  • Patent number: 10528103
    Abstract: A microelectronic assembly may include a first microelectronic device, a second microelectronic device, a first signal link, a second signal link, and a first power connection. The first microelectronic device may include a first interface powered at a first voltage. The second microelectronic device may include a second interface powered at a second voltage. The first signal link may supply a first signal at the first voltage from the first interface to the second interface. The second signal link may supply a second signal at the second voltage from the second interface to the first interface. The first power connection may supply a first reference signal at the first voltage from the first interface to the second interface.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 7, 2020
    Assignee: Intel Corporation
    Inventors: Chenchu Punnarao Bandi, Amit Kumar Srivastava
  • Publication number: 20200001887
    Abstract: A voltage monitoring framework is proposed to predict, report, and correct actions for performance impacting voltage droop due to power supplies in a system-on-a-chip. Both the amplitude and duration of the voltage droop are monitored. By predicting serious voltage droops early, power supplies cross check against each other to avoid catastrophic error, thus ensuring that integrated circuits making up the system-on-a-chip will maintain functional reliability.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 2, 2020
    Applicant: INTEL CORPORATION
    Inventors: Amit Kumar Srivastava, Asad Azam, Jagannadha Rapeta