Abstract: A vacuum processing apparatus which includes a conveyor structure for transferring a substrate from a substrate storage device held on a substrate storage device mount table. The apparatus further includes a vacuum loader provided with an additional conveyor structure and a vacuum processing chamber for sequentially loading substrate to be processed. The conveyor structures are each provided with a robot.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A wafer conveyor system for use in a vacuum processing apparatus wherein the conveyor structure is provided with a transfer structure, and a robot apparatus is arranged on the transfer structure. The robot provides for rotation of the wafer in a horizontally from a position in a cassette to an opposite position of the cassette.

Abstract: A vacuum processing apparatus which includes a means for transferring substrates from a loader with a transferring device to a double lock chamber and then to a selected vacuum processing chamber. The substrates are then returned to a substrate by the vacuum loader and back into the substrate table. The surfaces of the substrates are maintained in a horizontal position during processing.

Abstract: A substrate surface cleaning liquid medium and a cleaning method using the cleaning liquid medium are capable of removing finely particulate contaminants more efficiently than conventional techniques from substrates for devices in the production of semiconductor devices, display devices, etc., which cleaning liquid medium contains the following ingredients (A), (B), (C), and (D), has a pH of 9 or higher, and a content of ingredient (C) of 0.

Abstract: A vacuum processing apparatus includes a means for transferring wafer cassettes from a transferring chamber to a lock chamber. The wafer cassettes are mounted within a cassette table and are arranged in a single line. The vacuum processing apparatus further includes lock chambers connected to a plurality of processing chambers with each substrate being carried into and out of the lock chambers.

Abstract: A vacuum processing apparatus which includes a cassette mount table for holding at least one cassette, a conveying structure which includes a robot for conveying a wafer held on the cassette mount table, a vacuum loader which includes an additional robot, an additional conveying structure and a plurality of lock chambers.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage maeans after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing system for use in a vacuum processing apparatus. The system has a cassette mount unit for holding a cassette of, e.g., wafers; a vacuum loader having a conveyor and at least one vacuum processing chamber; a conveyor structure for conveying a wafer from the cassette; and at least one lock chamber between the conveyor structure and the conveyor of the vacuum holder. The conveyor structure, which is between the cassette mount unit and the lock chamber, includes a track and a robot (having a robot arm) traveling on the track. The robot can transfer a wafer from the cassette mount unit to the lock chamber.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A substrate changing-over mechanism in a vacuum processing apparatus which includes a substrate supporting means arranged within a vacuum tank which has at least two openings at a side wall of the tank, the openings being openable or closable by gate valves, the substrate supporting sections in upper and lower spaces and an ascending or descending driver section for driving the substrate supporting means; thereby allowing the supporting means to be stopped in a vertical direction at a plurality of predetermined positions.

Abstract: A wafer conveyor system for used in a vacuum processing apparatus wherein the conveyor structure is provided with a transfer structure and a robot apparatus is arranged on the transfer structure. The robot provides for rotation of the wafer horizontally from a position in a cassette to an opposite postion of the cassette.

Abstract: A wafer conveyor system for use in a vacuum processing apparatus wherein the conveyor structure is provided with a robot disposed in the conveyor chamber of the vacuum loader. The robot includes an arm which is extendible into the lock chambers which are connected to the conveyor structure.

Abstract: A vacuum processing apparatus which includes a cassette mount table for holding at least one cassette, a conveying structure that includes a robot, a cassette table for holding the cassette, an additional conveying structure for transferring a wafer held on the cassette table. Further, the apparatus is provided with a vacuum loader which is connected to the additional conveying device by a lock chamber. a controller system controls the second conveyor structure and manages the replacement of the cassette on the cassette table; and further, instructs the replacement of the cassette.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A transferring device for a semiconductor wafer which transfers a wafer storing structure to a table and/or other positions within the vicinity of a vacuum processing apparatus and removes wafers from the wafer storing structure. The transfer devices maintain a horizontally transferring state of both the wafer storing structure and of the wafers in the wafer storing structure.

Abstract: A vacuum processing system, including a vacuum processing chamber for processing wafers, provides a controller for controlling a wafer processing mode and a cleaning mode for the processing chamber. The vacuum processing system further provides for a wafer moving mechanism which is controlled by the controller and allows for the transferring of a dummy wafer into the processing chamber when the cleaning mode is started and then returning the dummy wafer when the cleaning mode is finished.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.