Patents by Inventor Aurelie Humbert
Aurelie Humbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120260732Abstract: A sensor (2) for sensing a first substance and a second substance, the sensor comprising first (3) and second (5) sensor components each comprising a first material (20), the first material being sensitive to both the first substance and the second substance, the sensor further comprising a barrier (18) for preventing the second substance from passing into the second sensor component (5).Type: ApplicationFiled: July 16, 2010Publication date: October 18, 2012Applicant: NXP B.V.Inventors: Aurelie Humbert, Youri Victorovitch Ponomarev, Roel Daamen, Matthias Merz
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Publication number: 20120249168Abstract: Disclosed is a liquid immersion sensor comprising a substrate (10) carrying a conductive sensing element (20) and a corrosive agent (30) for corroding the conductive sensing element, said corrosive agent being immobilized in the vicinity of the conductive sensing element and being soluble in said liquid.Type: ApplicationFiled: November 29, 2010Publication date: October 4, 2012Applicant: NXP B.V.Inventors: Aurelie Humbert, Matthias Merz, Roel Daamen, Youri Victorovitch Ponomarev
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Publication number: 20120234079Abstract: Disclosed is a sensor for detecting a component (20) of an atmosphere, the sensor comprising a sensing surface (14, 16) covered by a barrier layer (18) of a material switchable between respective layer orientations that have permeability to the component. A NFC device comprising such a sensor, a package incorporating the NFC device and a method of manufacturing the sensor are also disclosed.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: NXP B.V.Inventors: Aurelie Humbert, Dirk Gravesteijn, Pit Teunissen, Cornelis Wilhelmus Maria Bastiaansen
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Publication number: 20120112294Abstract: A method of manufacturing an integrated circuit having a substrate comprising a plurality of components and a metallization stack over the components, the metallization stack comprising a first sensing element and a second sensing element adjacent to the first sensing element.Type: ApplicationFiled: November 4, 2011Publication date: May 10, 2012Applicant: NXP B.V.Inventors: Marcus Van Dal, Aurelie Humbert, Matthias Merz, Youri Victorovitch Ponomarev
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Publication number: 20110303829Abstract: The light dose received by perishable goods is an important parameter in determining the lifetime of those goods. A light sensor (30) is described having a photosensitive element (18) which changes its material property according to the light dose received. This change can be detected electrically by electrodes (12, 14) in the light sensor. Because the change in material property is permanent, this removes the need for a memory to store a value representing the light dose received by the light sensor.Type: ApplicationFiled: June 9, 2011Publication date: December 15, 2011Applicant: NXP B.V.Inventors: David Tio Castro, Aurelie Humbert
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Publication number: 20110296912Abstract: Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.Type: ApplicationFiled: December 7, 2010Publication date: December 8, 2011Applicant: NXP B.V.Inventors: Matthias Merz, Roel Daamen, Aurelie Humbert, Youri Victorovitch Ponomarev
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Publication number: 20110185810Abstract: A sensor senses a magnitude of a physical parameter of the sensor's environment. The sensor has first and second electrodes, and a material layer between them. The material has an electrical property, e.g., capacitance or resistance, whose value depends on the magnitude of the physical parameter. The first electrode is formed in a first layer, and the second electrode is formed in a second layer, different from the first layer. The first layer has a trench and an elevation next to the trench. The trench has a bottom wall and a side wall. The material is positioned on the bottom wall and on the side wall and on top of the elevation. The trench accommodates at least a part of the second electrode. The second electrode leaves exposed the material formed on top of the elevation.Type: ApplicationFiled: September 10, 2009Publication date: August 4, 2011Applicant: NXP B.V.Inventors: Aurelie Humbert, Matthias Merz
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Publication number: 20110146400Abstract: A capacitive sensor for detecting the presence of a substance includes a plurality of upstanding conductive pillars arranged within a first layer of the sensor, a first electrode connected to a first group of the pillars, a second electrode connected to a second, different group of the pillars, and a dielectric material arranged adjacent the pillars, for altering the capacitance of the sensor in response to the presence of said substance.Type: ApplicationFiled: December 16, 2010Publication date: June 23, 2011Applicant: NXP B.V.Inventors: Aurelie HUMBERT, Matthias MERZ, Youri Victorovitch PONOMAREV, Roel DAAMEN, Marcus Johannes Henricus van DAL
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Publication number: 20110079649Abstract: A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other.Type: ApplicationFiled: September 24, 2010Publication date: April 7, 2011Applicant: NXP B.V.Inventors: Roel DAAMEN, Aurelie HUMBERT, Matthias MERZ, Youri Victorovitch PONOMAREV
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Publication number: 20110018097Abstract: Disclosed is an integrated circuit (IC) comprising a substrate (10) including a plurality of circuit elements and a metallization stack (20) covering said substrate for providing interconnections between the circuit elements, wherein the top metallization layer of said stack carries a plurality of metal portions (30) embedded in an exposed porous material (40) for retaining a liquid, said porous material laterally separating said plurality of metal portions. An electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.Type: ApplicationFiled: July 26, 2010Publication date: January 27, 2011Applicant: NXP B.V.Inventors: Youri Ponomarev, Aurelie Humbert, Roel Daamen
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Publication number: 20110006352Abstract: A read only memory is manufactured with a plurality of transistors (4) on a semiconductor substrate (2). A low-k dielectric (10) and interconnects (14) are provided over the transistors (4). To program the read only memory, the low-k dielectric is implanted with ions (22) in unmasked regions (20) leaving the dielectric unimplanted in masked regions (18). The memory thus formed is difficult to reverse engineer.Type: ApplicationFiled: March 5, 2009Publication date: January 13, 2011Applicant: NXP B.V.Inventors: Aurelie Humbert, Pierre Goarin, Romain Delhougne
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Patent number: 7829449Abstract: An electronic integrated circuit is fabricated by forming on a substrate, of which a part is composed of absorbing material, a portion made of a sacrificial material. The sacrificial material includes cobalt, nickel, titanium, tantalum, tungsten, molybdenum, gallium, indium, silver, gold, iron and/or chromium. A rigid portion is then formed in fixed contact with the substrate, on one side of the portion of sacrificial material opposite to the part of the substrate composed of absorbing material. The circuit is heated such that the sacrificial material is absorbed into the part of the substrate composed of absorbing material. A substantially empty volume is thus created in place of the portion of sacrificial material. The volume that is substantially empty can replace a dielectric material situated between the electrodes of a capacitor.Type: GrantFiled: February 10, 2005Date of Patent: November 9, 2010Assignees: STMicroelectronics (Crolles 2) SAS, Koninklijke Phillips Electronics N.V.Inventors: Christophe Regnier, Aurelie Humbert
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Publication number: 20100192688Abstract: A sensor senses a characteristic of an environment, e.g., humidity. The sensor has a substrate with strips of material that is sensitive to corrosion as a result of the characteristic. The strips are configured to respond differently to the characteristic. By means of repeatedly measuring the resistances of the strips, the environment can be monitored in terms of accumulated exposure to the characteristic. The strips are manufactured in a semiconductor technology so as to generate accurate sensors that behave predictably.Type: ApplicationFiled: July 30, 2008Publication date: August 5, 2010Applicant: NXP B.V.Inventors: Aurelie Humbert, Youri Victorovitch Ponomarev, Matthias Merz, Romano Hoofman
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Publication number: 20100001409Abstract: The invention relates to a semiconductor device comprising: a substrate (1), the substrate (1) comprising a body (5), the body (5) having a surface, the substrate (1) being provided with an insulating layer (10) on the surface of the body (1);—a conductor (25) with insulating sidewall spacers (22) located in the insulating layer (10), the conductor (25) having a current-flow direction during operation, the conductor (25) having a first width, the insulating sidewall spacers (22) each having a second width being smaller than the first width of the conductor (25), the first width and the second width being measured in a direction perpendicular to the current-flow direction of the conductor (25) and parallel to said surface, the conductor (25) having a first top surface extending parallel to said surface, the insulating sidewall spacers (22) having a second top surface, and airgaps (30) located in the insulating layer (10) adjacent to the insulating sidewall spacers (22), characterized in that the first top surfType: ApplicationFiled: October 29, 2007Publication date: January 7, 2010Applicant: NXP, B.V.Inventors: Aurelie Humbert, Romano Hoofman
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Publication number: 20090297938Abstract: A device is provided that includes a battery layer on a substrate, where a first battery cell is formed in the battery layer. The first battery cell includes a first anode, a first cathode, and a first electrolyte arranged between the first anode and the first cathode, where the first anode, the first cathode, and the first electrolyte are arranged in the battery layer such that perpendicular projections onto the substrate of each of the first anode and the first cathode are non-overlapping. A method of manufacturing such device is also provided. A system is also provide that includes such device for supplying power to an electronic device.Type: ApplicationFiled: May 28, 2009Publication date: December 3, 2009Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Romano HOOFMAN, Aurelie Humbert, Matthias Merz, Youri Victorovitch Ponomarev, Remco Henricus Wilhelmus Pijnenburg, Gilberto Curatola
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Publication number: 20070170538Abstract: An electronic integrated circuit is fabricated by forming on a substrate, of which a part is composed of absorbing material, a portion made of a sacrificial material. The sacrificial material includes cobalt, nickel, titanium, tantalum, tungsten, molybdenum, gallium, indium, silver, gold, iron and/or chromium. A rigid portion is then formed in fixed contact with the substrate, on one side of the portion of sacrificial material opposite to the part of the substrate composed of absorbing material. The circuit is heated such that the sacrificial material is absorbed into the part of the substrate composed of absorbing material. A substantially empty volume is thus created in place of the portion of sacrificial material. The volume that is substantially empty can replace a dielectric material situated between the electrodes of a capacitor.Type: ApplicationFiled: February 10, 2005Publication date: July 26, 2007Inventors: Christophe Regnier, Aurelie Humbert