Patents by Inventor Balasubramanian Ramachandran
Balasubramanian Ramachandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10077508Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.Type: GrantFiled: January 26, 2017Date of Patent: September 18, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Joseph M. Ranish, Paul Brillhart, Jose Antonio Marin, Satheesh Kuppurao, Balasubramanian Ramachandran, Swaminathan T. Srinivasan, Mehmet Tugrul Samir
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Patent number: 10062598Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: GrantFiled: April 28, 2015Date of Patent: August 28, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Anhthu Ngo, Zuoming Zhu, Balasubramanian Ramachandran, Paul Brillhart, Edric Tong, Anzhong Chang, Kin Pong Lo, Kartik Shah, Schubert S. Chu, Zhepeng Cong, James Francis Mack, Nyi O. Myo, Kevin Joseph Bautista, Xuebin Li, Yi-Chiau Huang, Zhiyuan Ye
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Publication number: 20180138031Abstract: Embodiments of the present invention generally relate to chambers and methods of processing substrates therein. The chambers generally include separate process gas and purge gas regions. The process gas region and purge gas region each have a respective gas inlet and gas outlet. The methods generally include positioning a substrate on a substrate support within the chamber. The plane of the substrate support defines the boundary between a process gas region and purge gas region. Purge gas is introduced into the purge gas region through at least one purge gas inlet, and removed from the purge gas region using at least one purge gas outlet. The process gas is introduced into the process gas region through at least one process gas inlet, and removed from the process gas region through at least one process gas outlet. The process gas is thermally decomposed to deposit a material on the substrate.Type: ApplicationFiled: January 15, 2018Publication date: May 17, 2018Inventors: Joseph M. RANISH, Paul BRILLHART, Jose Antonio MARIN, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN, Swaminathan T. SRINIVASAN, Mehmet Tugrul SAMIR
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Publication number: 20180089632Abstract: The techniques described herein facilitate sharing electronic cloud-based calendars via online application and collaboration services, e.g., Microsoft Office 365®. In an implementation, a method of operating an online application and collaboration service for sharing electronic calendars between mailboxes is disclosed. The method includes receiving a request to share a master calendar owned by a first user of the online application and collaboration service with a second user. The master calendar is stored in the first user's mailbox. The method further includes communicating a response indicating acceptance of the request to share the master calendar, generating a copy of the master calendar in the second user's mailbox, and synching the copy of the master calendar with the master calendar using pre-cached data to populate an initial view.Type: ApplicationFiled: January 20, 2017Publication date: March 29, 2018Inventors: Jaskaran Singh, Szymon Madejczyk, Aaron Eugene Stout, Balasubramanian Ramachandran, Carolyn Amy McKenna, Julia Foran Schearer
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Patent number: 9914999Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a process chamber includes: a chamber body and a lid assembly defining a processing volume within the process chamber; a substrate support disposed within the processing volume to support a substrate; and a showerhead having a first surface including a plurality of gas distribution holes disposed opposite and parallel to the substrate support, wherein the showerhead is fabricated from aluminum and includes an aluminum oxide coating along the first surface, wherein the aluminum oxide coating has a thickness of about 0.0001 to about 0.002 inches. In some embodiments, the showerhead may further have at least one of a roughness of about 10 to about 300 ?-in Ra, or an emissivity (?) of about 0.20 to about 0.80. The process chamber may be a thermal atomic layer deposition (ALD) chamber.Type: GrantFiled: June 25, 2015Date of Patent: March 13, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Muhammad M. Rasheed, Balasubramanian Ramachandran, Shih Chung Chen, Kevin A. Papke, Lei Zhou, Jing Zhou
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Patent number: 9870919Abstract: Embodiments of the present invention generally relate to chambers and methods of processing substrates therein. The chambers generally include separate process gas and purge gas regions. The process gas region and purge gas region each have a respective gas inlet and gas outlet. The methods generally include positioning a substrate on a substrate support within the chamber. The plane of the substrate support defines the boundary between a process gas region and purge gas region. Purge gas is introduced into the purge gas region through at least one purge gas inlet, and removed from the purge gas region using at least one purge gas outlet. The process gas is introduced into the process gas region through at least one process gas inlet, and removed from the process gas region through at least one process gas outlet. The process gas is thermally decomposed to deposit a material on the substrate.Type: GrantFiled: April 17, 2013Date of Patent: January 16, 2018Assignee: Applied Materials, Inc.Inventors: Joseph M. Ranish, Paul Brillhart, Jose Antonio Marin, Satheesh Kuppurao, Balasubramanian Ramachandran, Swaminathan T. Srinivasan, Mehmet Tugrul Samir
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Patent number: 9842753Abstract: The embodiments described herein generally relate to a lamphead assembly with an absorbing upper surface in a thermal processing chamber. In one embodiment, a processing chamber includes an upper structure, a lower structure, a base ring connecting the upper structure to the lower structure, a substrate support disposed between the upper structure and the lower structure, a lower structure disposed below the substrate support, a lamphead positioned proximate to the lower structure with one or more fixed lamphead positions formed therein, the lamphead comprising a first surface proximate the lower structure and a second surface opposite the first surface, wherein the first surface comprises an absorptive coating and one or more lamp assemblies each comprising a radiation generating source and positioned in connection with the one or more fixed lamphead positions.Type: GrantFiled: April 21, 2014Date of Patent: December 12, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Paul Brillhart, Joseph M. Ranish, Satheesh Kuppurao, Balasubramanian Ramachandran, Zuoming Zhu
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Patent number: 9832816Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.Type: GrantFiled: April 22, 2014Date of Patent: November 28, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Kin Pong Lo, Paul Brillhart, Balasubramanian Ramachandran, Satheesh Kuppurao, Daniel Redfield, Joseph M. Ranish, James Francis Mack, Kailash Kiran Patalay, Michael Olsen, Eddie Feigel, Richard Halpin, Brett Vetorino
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Publication number: 20170130359Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.Type: ApplicationFiled: January 26, 2017Publication date: May 11, 2017Inventors: Joseph M. RANISH, Paul BRILLHART, Jose Antonio MARIN, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN, Swaminathan T. SRINIVASAN, Mehmet Tugrul SAMIR
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Patent number: 9580835Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.Type: GrantFiled: January 4, 2016Date of Patent: February 28, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Joseph M. Ranish, Paul Brillhart, Jose Antonio Marin, Satheesh Kuppurao, Balasubramanian Ramachandran, Swaminathan T. Srinivasan, Mehmet Tugrul Samir
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Patent number: 9532401Abstract: Embodiments of the invention generally relate to susceptor support shafts and process chambers containing the same. A susceptor support shaft supports a susceptor thereon, which in turn, supports a substrate during processing. The susceptor support shaft reduces variations in temperature measurement of the susceptor and/or substrate by providing a consistent path for a pyrometer focal beam directed towards the susceptor and/or substrate, even when the susceptor support shaft is rotated. The susceptor support shafts also have a relatively low thermal mass which increases the ramp up and ramp down rates of a process chamber. In some embodiments, a custom made refractive element can be removably placed on the top of the solid disc to redistribute secondary heat distributions across the susceptor and/or substrate for optimum thickness uniformity of epitaxy process.Type: GrantFiled: February 14, 2014Date of Patent: December 27, 2016Assignee: Applied Materials, Inc.Inventors: Zhepeng Cong, Balasubramanian Ramachandran, Masato Ishii, Xuebin Li, Mehmet Tugrul Samir, Shu-Kwan Lau, Paul Brillhart
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Publication number: 20160336205Abstract: The embodiments described herein generally relate to a lamphead assembly with an absorbing upper surface in a thermal processing chamber. In one embodiment, a processing chamber includes an upper structure, a lower structure, a base ring connecting the upper structure to the lower structure, a substrate support disposed between the upper structure and the lower structure, a lower structure disposed below the substrate support, a lamphead positioned proximate to the lower structure with one or more fixed lamphead positions formed therein, the lamphead comprising a first surface proximate the lower structure and a second surface opposite the first surface, wherein the first surface comprises an absorptive coating and one or more lamp assemblies each comprising a radiation generating source and positioned in connection with the one or more fixed lamphead positions.Type: ApplicationFiled: July 27, 2016Publication date: November 17, 2016Inventors: Paul BRILLHART, Joseph M. RANISH, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN, Zuoming ZHU
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Publication number: 20160319428Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a process chamber includes: a chamber body and a lid assembly defining a processing volume within the process chamber; a substrate support disposed within the processing volume to support a substrate; and a showerhead having a first surface including a plurality of gas distribution holes disposed opposite and parallel to the substrate support, wherein the showerhead is fabricated from aluminum and includes an aluminum oxide coating along the first surface, wherein the aluminum oxide coating has a thickness of about 0.0001 to about 0.002 inches. In some embodiments, the showerhead may further have at least one of a roughness of about 10 to about 300?-in Ra, or an emissivity (?) of about 0.20 to about 0.80. The process chamber may be a thermal atomic layer deposition (ALD) chamber.Type: ApplicationFiled: June 25, 2015Publication date: November 3, 2016Inventors: Muhammad M. RASHEED, Balasubramanian RAMACHANDRAN, Shih Chung CHEN, Kevin A. PAPKE, Lei ZHOU, Jing ZHOU
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Publication number: 20160263634Abstract: Methods and apparatus for determining an endpoint of a process chamber cleaning process are provided. In some embodiments, a processing system having an endpoint detection system may include a process chamber having internal surfaces requiring periodic cleaning due to processes performed in the process chamber; and an endpoint detection system that includes a light detector positioned to detect light reflected off of a first internal surface of the process chamber; and a controller coupled to the light detector and configured to determine an endpoint of a cleaning process based upon the detected reflected light.Type: ApplicationFiled: May 23, 2016Publication date: September 15, 2016Inventors: BALASUBRAMANIAN RAMACHANDRAN, MASATO ISHII, AARON MUIR HUNTER
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Patent number: 9347132Abstract: Methods and apparatus for determining an endpoint of a process chamber cleaning process are provided. In some embodiments, a processing system having an endpoint detection system may include a process chamber having internal surfaces requiring periodic cleaning due to processes performed in the process chamber; and an endpoint detection system that includes a light detector positioned to detect light reflected off of a first internal surface of the process chamber; and a controller coupled to the light detector and configured to determine an endpoint of a cleaning process based upon the detected reflected light.Type: GrantFiled: April 5, 2012Date of Patent: May 24, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Balasubramanian Ramachandran, Masato Ishii, Aaron Muir Hunter
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Publication number: 20160138188Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.Type: ApplicationFiled: January 4, 2016Publication date: May 19, 2016Inventors: Joseph M. RANISH, Paul BRILLHART, Jose Antonio MARIN, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN, Swaminathan T. SRINIVASAN, Mehmet Tugrul SAMIR
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Patent number: 9230837Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes a vacuum chamber having a dome and a floor. A substrate support is disposed inside the vacuum chamber. A plurality of thermal lamps are arranged in a lamphead and positioned proximate the floor of the vacuum chamber. A reflector is disposed proximate the dome, where the reflector and the dome together define a thermal control space. The substrate processing apparatus further includes a plurality of power supplies coupled to the thermal lamps and a controller for adjusting the power supplies to control a temperature in the vacuum chamber.Type: GrantFiled: May 30, 2014Date of Patent: January 5, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Joseph M. Ranish, Paul Brillhart, Jose Antonio Marin, Satheesh Kuppurao, Balasubramanian Ramachandran, Swaminathan T. Srinivasan, Mehmet Tugrul Samir
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Publication number: 20150368829Abstract: In one embodiment, a susceptor for a thermal processing chamber is provided. The susceptor includes a base having a front side and a back side made of a thermally conductive material opposite the front side, wherein the base includes a peripheral region surrounding a recessed area having a thickness that is less than a thickness of the peripheral region, and a plurality of raised features protruding from one or both of the front side and the back side.Type: ApplicationFiled: June 22, 2015Publication date: December 24, 2015Inventors: Anhthu NGO, Schubert S. CHU, Nyi O. MYO, Paul BRILLHART, Yi-Chiau HUANG, Zuoming ZHU, Kevin Joseph BAUTISTA, Kartik SHAH, Edric TONG, Xuebin LI, Zhepeng CONG, Balasubramanian RAMACHANDRAN
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Publication number: 20150368830Abstract: Embodiments of the disclosure relate to a one-piece injector assembly. The injector assembly includes a plurality of channels for introducing process gas into a processing chamber while keeping the gas flow of each channel separate from the gas flow in each other channel. In addition, embodiments of the disclosure relate to upper and lower liners accommodating the one-piece injector assembly, methods for installing the injector assembly, and a processing chamber utilizing the one-piece injector assembly.Type: ApplicationFiled: June 12, 2015Publication date: December 24, 2015Inventors: Paul BRILLHART, Kin Pong LO, Edric TONG, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN
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Publication number: 20150340266Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: ApplicationFiled: April 28, 2015Publication date: November 26, 2015Inventors: Anhthu NGO, Zuoming ZHU, Balasubramanian RAMACHANDRAN, Paul BRILLHART, Edric TONG, Anzhong CHANG, Kin Pong LO, Kartik SHAH, Schubert S. CHU, Zhepeng CONG, James Francis MACK, Nyi O. MYO, Kevin Joseph BAUTISTA, Xuebin LI, Yi-Chiau HUANG, Zhiyuan YE