Patents by Inventor Bernhard Winkler

Bernhard Winkler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10544037
    Abstract: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: January 28, 2020
    Assignee: Infineon Technologies Dresden GmbH
    Inventors: Thoralf Kautzsch, Heiko Froehlich, Alessia Scire, Maik Stegemann, Bernhard Winkler, Andre Roeth, Steffen Bieselt, Mirko Vogt
  • Patent number: 10519998
    Abstract: An expansion anchor, including at least one anchor body as a first element and at least one bolt as a second element, wherein the bolt has an expansion body, which pushes the anchor body radially outward when the expansion body is moved in an extraction direction in relation to the anchor body is provided. A double coating having an inner layer and an outer layer covering the inner layer is provided on one of the two elements in an area of contact with the other element, wherein the outer layer has a coefficient of friction with respect to the other element that is greater than a coefficient of friction of the inner layer with respect to the other element.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: December 31, 2019
    Assignee: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Michael Beckert, Bernhard Winkler, Patrick Scholz
  • Publication number: 20190250059
    Abstract: Examples provide for an apparatus, method, and computer program for comparing the output of sensor cells in an arrangement of sensor cells in an area A, including a set of at least two measurement units. A measurement unit includes at least two sensor cells, wherein at least one sensor cell of at least one measurement unit includes a sensitive sensor cell, which is sensitive with respect to a measured quantity. The sensor cells are intermixed with each other. The apparatus further includes means for selecting output signals of sensor cells of the arrangement and means for determining a measured quantity or determining an intact sensor cell by comparing output signals of different measurement units.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 15, 2019
    Applicant: Infineon Technologies AG
    Inventors: Victor POPESCU-STROE, Emanuel STOICESCU, Matthias BOEHM, Constantin CRISU, Uwe FAKESCH, Stefan JAHN, Erhard LANDGRAF, Janis WEIDENAUER, Bernhard WINKLER
  • Publication number: 20190159880
    Abstract: The invention relates to an artificial vascular graft comprising a primary scaffold structure encompassing an inner space of the artificial vascular graft, said primary scaffold structure having an inner surface facing towards said inner space and an outer surface facing away from said inner space, a coating on said inner surface, wherein a plurality of grooves is comprised in said coating of said inner surface. The primary scaffold structure comprises further a coating on said outer surface. The primary scaffold structure and the coating on said inner surface and on said outer surface are d designed in such a way that cells, in particular progenitor cells, can migrate from the periphery of said artificial vascular graft through said outer surface of said coating, said primary scaffold structure and said inner surface to said inner space, if the artificial vascular graft is used as intended. The invention relates further to a method for providing said graft.
    Type: Application
    Filed: December 11, 2018
    Publication date: May 30, 2019
    Inventors: Bernhard WINKLER, Martin GRAPOW, Friedrich ECKSTEIN, Aldo FERRARI, Dimos POULIKAKOS, Simone BOTTAN, Maximilian FISCHER, Tobias LENDENMANN
  • Patent number: 10188499
    Abstract: The invention relates to an artificial vascular graft comprising a primary scaffold structure encompassing an inner space of the artificial vascular graft, said primary scaffold structure having an inner surface facing towards said inner space and an outer surface facing away from said inner space, a coating on said inner surface, wherein a plurality of grooves is comprised in said coating of said inner surface. The primary scaffold structure comprises further a coating on said outer surface. The primary scaffold structure and the coating on said inner surface and on said outer surface are d designed in such a way that cells, in particular progenitor cells, can migrate from the periphery of said artificial vascular graft through said outer surface of said coating, said primary scaffold structure and said inner surface to said inner space, if the artificial vascular graft is used as intended. The invention relates further to a method for providing said graft.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: January 29, 2019
    Assignee: UNIVERSITÄTSSPITAL BASEL
    Inventors: Bernhard Winkler, Martin Grapow, Friedrich Eckstein, Aldo Ferrari, Dimos Poulikakos, Simone Bottan, Maximilian Fischer, Tobias Lendenmann
  • Patent number: 10173352
    Abstract: A method for the self-assembled production of a topographically surface structured cellulose element. First, a mold is provided having on one side a first surface which is in a complementary manner topographically structured and which is permeable to oxygen. Next, a liquid growth medium containing cellulose producing bacteria is provided. Then, the mold is placed to form a interface such that the side of the mold with the first surface is in direct contact with the liquid growth medium, and an opposite side is facing air or a specifically provided oxygen containing gas surrounding. This allows bacteria to be produced and deposit cellulose on the first surface and developing on the interface a surface structured surface complementary thereto, until a cellulose layer with a thickness of the element of at least 0.3 mm is formed. Finally; the element is removed from the mold.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: January 8, 2019
    Assignee: ETH ZURICH
    Inventors: Tobias Lendenmann, Maximilian Fischer, Simone Bottan, Aldo Ferrari, Dimos Poulikakos, Bernhard Winkler, Martin Grapow
  • Publication number: 20180335359
    Abstract: A pressure sensor is provided. The pressure sensor includes at least two electrodes and an integrated circuit configured to sense a capacitance between the at least two electrodes. Further, the pressure sensor includes a Microelectromechanical System (MEMS) structure including a conductive or dielectric membrane configured to move, depending on the pressure, relative to the at least two electrodes.
    Type: Application
    Filed: May 10, 2018
    Publication date: November 22, 2018
    Applicant: Infineon Technologies AG
    Inventors: Markus ECKINGER, Dirk HAMMERSCHMIDT, Florian BRANDL, Bernhard WINKLER
  • Publication number: 20180283435
    Abstract: A thread-forming screw has a shank which, in a front region of the shank, has a tip for insertion into a bore in a substrate, and in a rear region of the shank, has a drive for transmitting a torque to the shank. The shank has a spiral-shaped groove and a thread spiral which is inserted into the spiral-shaped groove. The spiral-shaped groove has a front flank and a rear flank disposed opposite the front flank. The front flank, at least regionally, has a different part flank angle than the rear flank.
    Type: Application
    Filed: October 4, 2016
    Publication date: October 4, 2018
    Applicant: Hilti Aktiengesellschaft
    Inventors: Christoph HAKENHOLT, Bernhard WINKLER, Roland SCHNEIDER, Robert SPRING, Huu Toan NGUYEN
  • Patent number: 10060816
    Abstract: Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: August 28, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thoralf Kautzsch, Heiko Froehlich, Mirko Vogt, Maik Stegemann, Andre Roeth, Bernhard Winkler, Boris Binder
  • Patent number: 10018213
    Abstract: An expansion anchor is provided having a stud and at least one expansion sleeve that surrounds the stud, whereby, on the stud, there is an expansion cone that radially widens the expansion sleeve when the expansion cone is pulled into the expansion sleeve. It is provided that the expansion sleeve has a hardness of more than 350 HV in the area of its front end facing the expansion cone, whereby the hardness of the expansion sleeve decreases towards its rear end. A production method for such an expansion anchor is also provided.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: July 10, 2018
    Assignee: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Bernhard Winkler, Robert Meier, Peter Rickers, Patrick Scholz
  • Publication number: 20180180081
    Abstract: An expansion anchor, including at least one anchor body as a first element and at least one bolt as a second element, wherein the bolt has an expansion body, which pushes the anchor body radially outward when the expansion body is moved in an extraction direction in relation to the anchor body is provided. A double coating having an inner layer and an outer layer covering the inner layer is provided on one of the two elements in an area of contact with the other element, wherein the outer layer has a coefficient of friction with respect to the other element that is greater than a coefficient of friction of the inner layer with respect to the other element.
    Type: Application
    Filed: June 7, 2016
    Publication date: June 28, 2018
    Inventors: Peter Gstach, Michael Beckert, Bernhard Winkler, Patrick Scholz
  • Publication number: 20180155188
    Abstract: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
    Type: Application
    Filed: January 19, 2018
    Publication date: June 7, 2018
    Inventors: Thoralf Kautzsch, Heiko Froehlich, Alessia Scire, Maik Stegemann, Bernhard Winkler, Andre Roeth, Steffen Bieselt, Mirko Vogt
  • Patent number: 9970465
    Abstract: An expansion anchor including a stud, at least one expansion element, and at least one slanted surface that is arranged on the stud and that pushes the expansion element radially outwards when the stud is moved in a pull-out direction relative to the expansion element is provided. It is provided that the coefficient of friction between the expansion element and the slanted surface is dependent on the direction.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: May 15, 2018
    Assignee: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Bernhard Winkler
  • Publication number: 20180127267
    Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 10, 2018
    Inventors: Bernhard Winkler, Rainer Leuschner, Horst Theuss
  • Publication number: 20180094666
    Abstract: An expansion anchor with a bolt and at least one expansion element is disclosed. An oblique surface is arranged in the region of the first end of the bolt and forces the expansion element radially outward on the bolt if the bolt is displaced in a pull-out direction relative to the expansion element. The bolt has, in the region of its rear end facing away from the first end, a load-absorber which is suitable for introducing tensile forces which are directed in the pull-out direction into the bolt. A plurality of grooves that are closed with respect to the first end of the bolt are disposed in the oblique surface and the plurality of grooves reduce a contact surface between the expansion element and the oblique surface. The contact surface between the expansion element and the oblique surface is reduced by the plurality of grooves by 20 to 50%.
    Type: Application
    Filed: December 6, 2017
    Publication date: April 5, 2018
    Applicant: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Bernhard Winkler, Matteo Spampatti
  • Patent number: 9933002
    Abstract: An expansion anchor including a stud and at least one expansion element arranged on the stud, whereby the stud has a slanted surface that pushes the expansion element radially outwards when the stud is moved in a pull-out direction, relative to the expansion element is provided. It is provided that the expansion anchor has at least one swelling element consisting of a swellable compound that can swell in order to secure the expansion element onto the wall of a drilled hole in the pull-out direction.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: April 3, 2018
    Assignee: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Ronald Mihala, Bernhard Winkler
  • Publication number: 20180073537
    Abstract: An expansion anchor is provided, which is fixable in a borehole, including an expansion sleeve for anchoring on a wall of the borehole and including an anchor bolt which is guided through the expansion sleeve and which has an expansion area for expanding the expansion sleeve, the expansion sleeve having a first annular groove on its outside, which extends up to the front end face of the expansion sleeve facing the expansion area. According to the invention, it is provided that the expansion sleeve has a second annular groove on its outside, and that an annular connection piece is situated between the first annular groove and the second annual groove.
    Type: Application
    Filed: March 22, 2016
    Publication date: March 15, 2018
    Inventors: Peter Gstach, Bernhard Winkler, Patrick Scholz, Matteo Spampatti, Michael Sproewitz
  • Patent number: 9896329
    Abstract: The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 20, 2018
    Assignee: Infineon Technologies Dresden GmbH
    Inventors: Thoralf Kautzsch, Heiko Froehlich, Alessia Scire, Maik Stegemann, Bernhard Winkler, Andre Roeth, Steffen Bieselt, Mirko Vogt
  • Patent number: 9884757
    Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: February 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Winkler, Rainer Leuschner, Horst Theuss
  • Patent number: 9869334
    Abstract: An expansion anchor with a bolt and at least one expansion element is disclosed. An oblique surface is arranged in the region of the first end of the bolt and forces the expansion element radially outward on the bolt if the bolt is displaced in a pull-out direction relative to the expansion element. The bolt has, in the region of its rear end facing away from the first end, a load-absorber which is suitable for introducing tensile forces which are directed in the pull-out direction into the bolt. At least one groove which is closed with respect to the first end is made in the oblique surface, which groove reduces the contact surface between the expansion element and the oblique surface.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: January 16, 2018
    Assignee: Hilti Aktiengesellschaft
    Inventors: Peter Gstach, Bernhard Winkler, Matteo Spampatti